Device Interface Board for Wireless LAN Testing

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Presentation transcript:

Device Interface Board for Wireless LAN Testing Team May 05-29 Client ECpE Department Faculty Advisor Dr. Weber Team Members Nathan Gibbs – EE Adnan Kapadia – EE Daniel Holmes – EE/CprE Kyle Peters – CprE January 20, 2005

Presentation Outline Project Overview Project Activities Problem statement Operating environment Intended user(s) and use(s) Assumptions and limitations End product Project Activities Present accomplishments Future goals Approaches considered and one used Project definition activities Research activities Design Test and implementation Resources and Schedule Resource requirements Schedule Closure Materials

Definitions DUT – Device Under Test (Positive edge triggered D flip-flop) ESD wristband– Electrostatic Discharge protective device Header – Preamble bits for communication data Data packet – Group of bits sent through a communication channel sequentially IG-XL – Custom software for Teradyne Integra J750 Kbps – Kilo-bits per second Teradyne Integra J750 – High speed digital tester TX/RX – Transmitter/Reciever S/R Network – Send and receive network PLL – Phase-Locked Loop RF – Radio Frequency

Project Overview

? Project Overview Problem Statement Problem Solution Wireless product testing is a requirement Currently, no way to interface Teradyne Integra J750 with a S/R network Test wireless products using the Teradyne Integra J750 Solution Develop wireless interface to J750 Develop test for DUT Solve latency issues and data transmission ? Figure 1 – Project Problem

Project Overview Operating Environment 27°C - 33°C ESD wristbands IG-XL for Windows

Project Overview Intended Users Intended Uses ECpE Faculty and Students Knowledge of Teradyne Integra J750 Knowledge of RF components Intended Uses Functional test Signal test

Project Overview Assumptions System User Single channel communication Teradyne J750 will process despite delay User Manual for the Teradyne J750 Knowledge of RF components Experience with an FPGA Understand the DUT operation

Project Overview Limitations 27°C - 33°C Digital I/O only Usage of less common frequencies Wireless components limit data rate Teradyne cannot be moved RX/TX range approx. 100 feet

Project Overview End Product and Other Deliverables S/R Network Failure or Success? Success Demonstration of test Manual to setup remote tests Failure Document describing findings Report to Teradyne

Project Activities

Project Activities Project Definition Initially wanted to test wireless components of device Research and advisor indicated task was too large Redefined project as “proof-of-concept” that J750 can wirelessly test a device

Project Activities Research Activities Feasibility of testing wireless components with J750 Researched J750 setup and test creation Researched wireless system implementations Researched and evaluated components

Project Activities Design Figure 2 – System Design

Project Activities Design Constraints Limited choice of frequency channels Lose precision from Teradyne Integra J750 FPGA only at 25MHz TX/RX at 115kbps Distance between receivers and transmitters limited to 100 feet Budget limited to $150.00 Team would like to have additional FPGA’s for parallel to serial conversion

Project Activities Present Accomplishments Ordered all components, received shift register and PLL Wrote test on J750 for device under test (Will modify for wireless test) Wrote FPGA code Tested and implemented shift registers

Project Activities Future Required Activities Wirelessly test more devices using system developed Develop system to test wireless components Develop system for multiple users to test devices wirelessly

Project Activities Approaches Considered System Design 2 FPGA’s, 2 wireless transceivers 4 FPGA’s, 2 wireless transmitters, 2 receivers 1 FPGA’s, 2 wireless transmitters, 2 receivers, parallel to serial shift registers Advantages/Disadvantages Chose #3 Only 1 FPGA available Simple, but effective implementation Simple to recognize wireless packets Dedicated send and receive channel #1 X #2 #3

Project Activities Testing and Implementation No design modifications as of now Test each sub system individually Agenda Test the Shift Register Test the PLL and FPGA Test the S/R network Integrate subsystems into final setup and test Testing form

Project Activities Testing and Implementation Figure 4 – Testing form

Resources and Schedule

Resources and Schedule Estimated Resources Figure 5 -

Resources and Schedule Other Resources Item Cost Project Poster $65.00 D Flip-Flop (TI- SN74LVC2G74) $0.43 2 x 16-Bit Shift Registers (Fairchild 74F676) $18.24 Phase-Locked Loop (TI CD74HC7046A) $1.23 Teradyne Integra J750 Test System $500000.00 Transmitter (RF Monolithics TX6000) $14.00 Transmitter (RF Monolithics TX6004) Receiver (RF Monolithics RX6000) $20.00 Receiver (RF Monolithics RX6004) 4x 50 Ohm Antennas PCB Milling $2000.00 FPGA $200.00 Supplementary Circuit Components $15.00 Total Cost $502,387.90 Donated $84.90 Figure 6 - Resource Requirements

Resources and Schedule Project Final Costs Item Cost Parts $84.90 Labor ($11/hour) $11,297.00 Total $11,381.90 Figure 7 – Project Costs with Labor

Resources and Schedule Figure 8 – Major project tasks schedule Figure 9 – Project Deliverables

Closing Material

Closing Material Project Evaluation Commercialization Inconclusive Unlikely Cost Speed Immobile Possibilities RF companies Larger telecommunication companies

Closing Material Recommendations for Additional Work Test other devices Test actual wireless network cards Improve upon FPGA speed Improve overall data rate Test actual RF links

Closing Material Lessons Learned What went well? What did not go well? FPGA code worked Shift register performed as expected No issues with part selection or purchase Completed initial design What did not go well? Project definition Initial Teradyne J750 setup and test

Closing Material Lessons Learned What technical knowledge was gained? Learned about RX/TX couples Learned about PLL’s FPGA implementation Teradyne Integra J750 usage Parallel⇔Serial conversion

Closing Material Lessons Learned What non-technical knowledge was gained? Communication skills Time management Negotiation skills

Closing Material Lessons Learned What would have been done differently if the project had been done again? Define project earlier

Closing Materials Potential Risks Encountered Risks Teradyne Integra J750 signal latency Phase-Locked Loop fails to recover clock Encountered Risks Internships Receiver/Transmitter delivery delays

Closing Materials Closing Summary Problem Solution Project still in development stage Cannot conclude on results

Questions?

Thank You