Dual Logo Procedures Alex Zamfirescu IEC USNC TA TC93 Convener IEC TC93 WG2 November 2004.

Slides:



Advertisements
Similar presentations
Doc.: IEEE /0006r0 Submission March 2005 Steve Shellhammer, Intel CorporationSlide 1 What is a CA document? Notice: This document has been prepared.
Advertisements

Doc.: IEEE wng0 Submission November, 2013 Pat Kinney, Kinney ConsultingSlide 1 Project: IEEE P Working Group for Wireless Personal.
THE STANDARDS DEVELOPMENT PROCESS STEP 1 PUBLIC AND COMMITTEE PROPOSAL STAGE PUBLIC AND COMMITTEE PROPOSAL CLOSING DATE FIRST TECHNICAL COMMITTEE MEETING.
Doc.: IEEE /1454r7 Submission March 2013 IEEE 802 JTC1 Standing Committee Proposal for SC6 contribution process 20 March 2013 Haasz et al, IEEESlide.
How an idea becomes an IEC standard Gary Johnson Chairman IEC SC45A
SC 17A SC 17A Discussion - Need and Process IEEE, Document Need, Dual Logo Maintenance Process New Delhi, India /17 L. Farr and D.
Ashenden Designs IEEE DASC Steering Committee 2 December 2003 San Jose, CA, USA Peter Ashenden DASC Interim Chair.
1 PAR Presentation DASC meeting at DAC, June 21, 2001 Project title: A standard for an Advanced Library Format (ALF) describing Integrated Circuit (IC)
Submittal of C as an IEC/IEEE Dual Logo Document IEEE Switchgear Committee Main Committee Meeting 18 October 2007.
Slide 1 IEEE 802 Response to FDIS comments on IEEE 802.1AS 20 March 2014 Authors: NameCompanyPhone .
Christer Eriksson 11 March 2010 JWG1 - Wind Turbine Gearboxes IEC/ISO Design Requirements for Wind Turbine Gearboxes.
API SC18 Work Group 2 API Exploration & Production Standards Conference on Oilfield Equipment and Materials Westminster, Colorado June 23, 2009 Ed Durante.
Ashenden Designs IEEE DASC Steering Committee 20 September 2004 Piscataway, NJ Peter Ashenden DASC Chair.
Doc.: IEEE /0036r0 Submission Sept 2005 Tom Siep, Cambridge Silicon Radio PlcSlide 1 Matthew Sherman’s Comments to P&P Notice: This document.
Ashenden Designs IEEE DASC Steering Committee 19 February 2004 Paris, France Peter Ashenden DASC Chair.
DASC Steering Committee 10 March 2004 Peter Ashenden DASC Chair Victor Berman DASC Vice Chair.
Module IV Standards Development and the Stages of Technical Work USNC Constituent Training Program This training material has been developed with content.
1 PAR Presentation DASC meeting at DAC, June 21, 2001 Project title: A standard for an Advanced Library Format (ALF) describing Integrated Circuit (IC)
Doc.: IEEE /0748r2 Submission May 2011 Tom Siep, CSRSlide 1 Process for Creating TGai Draft Date: Authors:
DICOM to ISO-DICOM Report to joint ISO TC215/WG2 – DICOM WG10 meeting January 24, 2004, San Diego.
ISO Liaison Report Hidenori Shinoda Charles Parisot.
INTERNATIONAL ELECTROTECHNICAL COMMISSION Standardization Management Board Decisions How They Affect Your TAG! Jim Matthews Vice President & SMB Chairman.
Ashenden Designs The IEEE Design Automation Standards Committee Peter J. Ashenden, Ashenden Designs DASC Vice Chair
DEX Publication Project OASIS PLCS TC Telecon 22 January 2008 Trine Hansen.
IEEE Design Automation Standards Committee (DASC) Peter Ashenden IEEE DASC Chair.
Doc.: IEEE /197R3 Submission July 2003 Terry Cole, AMDSlide WG Technical Editor’s Report Opening Session, July 2003 Plenary Meeting Terry.
DASC Steering Committee 17 June 2005 Peter Ashenden DASC Chair Victor Berman DASC Vice Chair.
Doc.: IEEE /0281r1 Submission James D. Allen (Appairent Technologies, Inc.) Project: IEEE P Working Group for Wireless Personal Area Networks.
Doc.: IEEE /0828r0 Submission May 2007 Harry Worstell, AT&TSlide 1 Procedural Clarification Notice: This document has been prepared to assist.
1 Accredited Standards Committee C63 ® - EMC Subcommittee 5 – Immunity Report to Main C63 Committee Stephen R Whitesell Chair, SC5 November 12, 2015.
SECTION BYLAWS APROVAL PROCESS Five Easy Steps. Step 1: Collect Data Obtain Template from SWE Communities Professional Section Bylaws Community Collegiate.
1 Addendum FALL 2004 RFP Detailed Instructions for Bidder Registration and Proposal Submission ENTERGY SERVICES, INC. November 2004.
1 1 JEITA and IEC TC93 update JEITA EDA Technical Committee, Fellow IEC TC93 WG2, Convener NEC System Technologies Satoshi Kojima DASC meeting at DAC2012.
Slide 1 IEEE 802 Response to FDIS comments on IEEE 802.1AB 20 March 2014 Authors: NameCompanyPhone .
IEC TC93 Liaison Report DASC SC Alex Zamfirescu IEC USNC Technical Aadviser TC93 Convener IEC TC93 WG2 September,
Minutes Document March 2006 Terry Cole, AMDSlide Editor’s Best Practices Terry Cole, AMD WG Technical Editor & Simon Barber, Devicescape.
The IEEE-SA Standards Process Dr. Bilel Jamoussi IEEE Standards Education Committee.
Session # Maintenance Task Group Opening Report IEEE Presentation Submission Template (Rev. 9) Document Number: IEEE maint-08/025.
International Electrotechnical Commission International Electrotechnical Commission.
1 Conference on U.S. Leadership in ISO and IEC Technical Committees Presented by David Q. McDowell Chair, USTAG ISO TC130 USTAGs and Joint Working Groups.
Doc.: IEEE /1454r0 Submission Jan 2013 IEEE 802 JTC1 Standing Committee Proposal for SC6 contribution process 15 January 2013 Haasz et al, IEEESlide.
Programming Committee - composition
IEC TC93 Liaison Report to DASC Alex Zamfirescu IEC USNC TA TC93 Convener IEC TC93 WG2 September 2004.
September Session Chair’s Supplementary Material
Sponsor Ballot Process
ECMA-328 2nd edition Invitation for open review
IEEE 802 JTC1 Standing Committee Proposal for SC6 contribution process
Editor’s Guideline Version 1.0
Agenda 5.11 General Regulations
2017 Amendments to the INCITS Organization, Policies and Procedures
IEEE 802 JTC1 Standing Committee Proposal for SC6 contribution process
IEEE P Motions at the July Plenary EC Meeting
IEEE 802 JTC1 Standing Committee Proposal for SC6 contribution process
IEC Maintenance Committee Report
WG Technical Editor’s Report
Review & maintenance of IAEG Glossary
Standardization Management Board Decisions How They Affect Your TAG!
<month year> doc.: IEEE < e> <July 2018>
IEC TC93 Liaison Report DASC SC Alex Zamfirescu IEC USNC Technical Aadviser TC93 Convener IEC TC93 WG2 September,
September Session Chair’s Supplementary Material
Sponsor Ballot Comment Resolution
Project: IEEE P Working Group for Wireless Personal Area Networks (WPANs) Submission Title: [A Brief Overview of Draft Approval.
Title: LE TG Closing Report for Session #63.5
Comments for Rev PAR – July 2010 Plenary
DASC Meeting February 21, 2008 Victor Berman, Chair
WG Technical Editor’s Report
TGg Report to the IEEE Working Group
IEEE 802 JTC1 Standing Committee Proposal for SC6 contribution process
Task Group G Report January 17, 2003
Presentation transcript:

Dual Logo Procedures Alex Zamfirescu IEC USNC TA TC93 Convener IEC TC93 WG2 November 2004

Facts Both VHDL and Verilog® are DL standards Both standards are in maintenance Dual Logo maintenance procedures were approved by IEEE and IEC, but require pragmatic validation Some procedure details have to be filled in

Proposed Plan Walk through the information flow – identify and agree on areas for improvement/refinement Discuss the general major topics 1.Actual flow requires that versions of the draft are produced and reviewed -simpler for std in maintenance -editor on duty 2.Harder to understand IEC document circulation rules »DASC should be minimally affected 3.With extra rules IEEE groups might feel unreasonably constrained 4.What are the first time process tune-up procedures »Joint work to write procedure details, approval »Execute maintenance for VHDL and Verilog® »Review and Update DL procedures

Submitting Dual Logo Candidates to the IEC Candidate is formally submitted to the IEC Central Office –IEC reviews candidate IEC Central Office sends a Question of Principle (QP) ballot to the SMB –Should this document move forward as an IEC/IEEE dual logo document? If the ballot passes, the document is sent to the appropriate IEC TC for “fast-tracking”

Current IEEE DASC Dual Logo Submissions Computer Society/Design Automation Committee: –IEEE Std – IEEE Standard for Standard Delay Format (SDF) for the Electronic Design Process.. (IEC ) –IEEE Std – IEEE Standard VHDL Language Reference Manual …………………………………..(IEC ) –IEEE Std – IEEE Standard Verilog® Hardware Description Language ……………………(IEC ) –IEEE Std – IEEE Standard for VITAL ASIC Modeling Specification……………………………….. (IEC ) –IEEE Std – IEEE Standard for Advanced Library Format (ALF) Describing Integrated Circuit (IC) Technology, Cells, and Blocks –IEEE Std , Standard for VHDL Register Transfer Level (RTL) Synthesis –IEEE Std , IEEE Standard for Verilog® Register Transfer Level Synthesis

Dual logo maintenance process see pages 2/3 An IEC-TC/SC needs to revise an IEC-IEEE standard IEEE needs to revise an IEC-IEEE standard MCRPAR IEC and IEEE agree on a common need YES Dual logo maintenance team (DLMT) set up with members from IEC and IEEE and a convenor jointly accepted ( see note 3 ) IEC disagrees see note 1 IEEE disagrees see note 2 INFO Maintenance Procedure

Maintenance Procedure The DLMT prepares a draft for comments (CD) IEC National Comments ( 3 months ) IEEE experts internal ballot ( electronic ) The DLMT prepares a common compilation of comments with possible proposals for change IEC-TC/SC takes decision by correspondance or at a TC/SC meeting CDV OK? See note 4 IEEE takes decision for the next step ( possibly a second internal ballot ) INFO Ballot OK See note 4 The DLMT prepares a second draft based on commonly agreed changes IEC votes on CDV (5 months) IEEE sponsor ballot ( days ) INFO NO YES See note 5

Maintenance Procedure Positiv e results Positiv e results INFO The DLMT prepares a common compilation of comments on the CDV together with proposals to solve them YES See note 6 NO See note 6 NO IEC-TC/SC takes final decisions on the comments by or at a meeting IEEE takes final decisions on the comments received INFO The DLMT prepares the FDIS based on commonly agreed modifications. Revised IEC-IEEE standard IEEE final ballot. Once approved IEC submits the FDIS for final vote (2 months) See note 7

Maintenance Procedure Notes Note 1 – IEC may decide to continue its own route. If any material is used from the IEC/IEEE standard, a separate license agreement will be required. Note 2 – IEEE may decide to continue its own route leading to publish a revised single IEEE logo standard replacing the previous one. If so IEC will withdraw the existing IEC-IEEE standard. Then IEEE may submit to IEC this new standard as a candidate for a possible new IEC-IEEE standard according to the agreement. Note 3 – The organisation which initiates the process, proposes a convenor first. If the proposal is not accepted by the other organisation, another convenor has to be chosen amongst the members of the DLMT by mutual agreement. Note 4 – At this stage, IEC or IEEE are requested to task the DLMT to provide a new draft for comments Note 5 – The 2 ballot processes must be carried out in such a way that the deadlines are the same Note 6 – At this stage, IEC or IEEE may decide either to continue their respective route or to task the DLMT to provide a new draft for vote by both organizations. If IEC decides to continue its own route, then note 1 applies. If IEEE decides to continue its own route then note 2 applies. –Note 7 – The comments made at this stage must be limited to corrections of misspelling or obvious errors which may have been generated during the preparation of the FDIS.

Notes