Metal Soldering Connectors Kovar connectors 6mm diameter with a small pin to enter in the hole Developed for NA62 project 3µm

Soldering Test with 10x10mm chips

200°C for 2min °C for 1h 100°C/h 50°C/h Temperature Profile Vacuum oven (10 -6 – )

6 mm Limitation of the test set-up read-out at 600 bars Limitation of the pump 700 bars No failure of the soder joint Inner diameter 1.6 mm Silicon thickness 525 µm preliminary prototypes size reduction and different geometries under study Common development with LHCb VeLo Upgrade Solder joint withstands 700 bar ! Si thickness = 500 um Exposed Si surface is 2mm hole Pressure test

SMD lab 3µm Vapor phase oven: Liquid (fluides liquides perfluorocarbonés inertes) in vapour-phase form is used to transfer the heat to the components and solder. 230°C

Metal on Pyrex:

Comparison Oven chez Tino SMD lab 20 nmTi 50 nm Ni 200 nm Au 20 nmTi 50 nm Ni 200 nm Au

Future soldering TEST for NA62