SMT Assemblies Why Solder Paste Inspection? The majority of SMT defects occurs during the solder paste printing process. According to data from SMTA (The Surface Mount Technology Association), 74% of defects in PCB manufacturing process are related to solder paste. Assembly Process Defect Chart

Why?? Is Printing so Important 1.Production must be more FLEXIBLE. 2.Mixed technologies, on the same board. 3. Limited space, Assembly density 4. Budget reductions 5. Quality demand 6. No rework permitted

Processes continue to be challenged If that werent enough……. Miniaturization

The concept is clear….The SMT printer Process needs excellent Mechanical Seal and Paste Release!!!

2013 Q1 Intelectual Property filed in Mexico 2013 Q1 Intelectual Property filed in Mexico 2013 Q1 File USA Patent for COBRA 2013 Q1 File USA Patent for COBRA 2010 Q4 Project outlined 2010 Q4 Project outlined 2012 Q1 Cobra HD Released 2012 Q1 Cobra HD Released 2012 Q2 Initial Sales efforts 2012 Q2 Initial Sales efforts 2012 Q3 Revised Process to focus on Adhesion Properties 2012 Q3 Revised Process to focus on Adhesion Properties 2013 Q1 Cobra “TX” Developed 2013 Q1 Cobra “TX” Developed 2013 Q2 NEW Development 2013 Q2 NEW Development 2011 Q2 Registered LOGO 2011 Q2 Registered LOGO 2013 Q1 InterLatin Recieves Award CONACYT- Estimulos a La INOVACION Innovation Project-COBRA 2013 Q1 InterLatin Recieves Award CONACYT- Estimulos a La INOVACION Innovation Project-COBRA Since Q32013 Sales Started

ALL TopLINE Nanos, “Cobra HD” vs “COBRA 3.0 y TX” –Sensative to stencil wash –Wearing of the “COATING” –Aplication type “Coating” –On time Delivery –Componentes –“Nano” waste management –Outperforms any Nano, Eform, Ni stencil –COBRA will Last the life of the Stencil!!!! Out Performs !! Product Comparison

REX Customer “COBRA, BGA “.35”, AR.49, Paste type 3 mesh, Over assemblies, zero fail. Mechanical or Electrical.”

GDL Site Increased ICT Yield 60% to 75%. Excellent paste release After Introdcing COBRA GDL Site We compared COBRA with E-Fab stencil. COBRA had a better release of solder paste, we reduced problems in our printing process

Automotive Customer Requirement: Use Eform Std as minimum requirments They had 3D SPI inline Volume Measurements CpK >/= 1.6 Std Dev </= 8 16 mil pitch QFP EFab COBRA 3.0 This denotes an effect caused by the USC while using EF but did not affect COBRA print quality The SPC sine wave is representative only Final results: Efab 100% of established SPI volume Cpk: 1.56 Std Dev= 11 COBRA 115% Volume compared to Efab CpK: 2 Std Dev= 6 Note: NOT even the underscreen cleaners elements interfered with the COBRA print quality

What we Did, June 2014 Created a test vehicle, representing current assembly challenges, for our customers Setup an SMT printer, Fully automated Programmed Solder Paste Inspection system, fully automated Made one common stencil design, IAW industry standards…..NO special designs

Director COBRA Developement

Reduction in Cost – Lasts the Life of the Stencil – Helps reduce Consumible consumption Improves AR Performance – More productivity Stencil Life Warranty – COBRA will NOT come off, Under Standard SMT Process Practices Improved OTD – Made in Local sites Local design Support….over 20 years Local Eng Printing Support…..over 20 years We will work with all customers to support their process. Conclusions

Thank you Gracias Merci Obrigado Danke