W. Karpinski, Nov. 2001 CMS Electronics week CMS Microstrip Tracker grounding & shielding of the CMS Tracker R. Hammarstrom (CERN EP/CMT) & W. Karpinski.

Slides:



Advertisements
Similar presentations
F. Formenti - ALICE forum 16/03/ Contacted some teams for system GND discussions: cases analyzed are presented here Planned to continue with others.
Advertisements

HFT Technical Overview September 26, HFT 2013 TPC FGT 2011 STAR Detectors Fast and Full azimuthal particle identification EMC+EEMC+FMS (-1 ≤ 
Technical Board, 12 July 2005Børge Svane Nielsen, NBI1 Status of the FMD Børge Svane Nielsen Niels Bohr Institute.
M.PEGORARO Grounding Workshop 24th Jan 08 DT GROUNDING & SHIELDING Presented by A. BENVENUTI.
04/02/2004 az Outer Tracker Distribution Boxes 1 EFNI H K Outer Tracker Distribution Boxes Ad Berkien Tom Sluijk Albert Zwart.
Module Production for The ATLAS Silicon Tracker (SCT) The SCT requirements: Hermetic lightweight tracker. 4 space-points detection up to pseudo rapidity.
The LHCb Inner Tracker LHCb: is a single-arm forward spectrometer dedicated to B-physics acceptance: (250)mrad: The Outer Tracker: covers the large.
Performance of the DZero Layer 0 Detector Marvin Johnson For the DZero Silicon Group.
Layout of the Power Distribution on Support Tube for Phase I Lutz Feld, Waclaw Karpinski, Katja Klein, Jan Sammet, Michael Wlochal.
Experimental Area Meeting V. Bobillier1 Good connection to earth (in many points) of every metallic parts to be installed in the cavern is very.
CMS ECAL End Cap EDR Meeting CERN 28 Nov. to 29 Nov 2000 A.B.Lodge - RAL 1 ECAL End Cap CMS ECAL End Cap Engineering Design Review. EDR meeting held 28.
SVX4 chip 4 SVX4 chips hybrid 4 chips hybridSilicon sensors Front side Back side Hybrid data with calibration charge injection for some channels IEEE Nuclear.
18-Jan-021W. Karpinski System Test Design verification of petals and interconnect boards and control links without detectors a)mechanics b)electrical.
17/06/2010UK Valencia RAL Petals and Staves Meeting 1 DC-DC for Stave Bus Tapes Roy Wastie Oxford University.
CMS TRACKER STATUS REPORT Dimitri PandoulasCMS Week
System Test Status Report R. D’Alessandro 1 TIB System Test Report Where were we ….., Mechanics (layer 3 prototype) Mother Cable & Interconnect Board System.
The ALICE Silicon Pixel Detector Gianfranco Segato Dipartimento di Fisica Università di Padova and INFN for the ALICE Collaboration A barrel of two layers.
Electrical and Optical Cables Installation at P5 What When How H. Breuker
1 Module and stave interconnect Rev. sept. 29/08.
Saverio Minutoli INFN Genova 1 1 T1 Electronic status Electronics Cards involved: Anode Front End Card Cathode Front End Card Read-Out Control card VFAT.
ALICE DCS Workshop 28/29 May 2001 Vito Manzari, INFN Bari SSD (Silicon Strip Detector) SDD (Silicon Drift Detector) SPD (Silicon Pixel Detector) Detector.
Construction and Installation Readiness of TOTEM Roman Pots Detectors Federico Ravotti (PH/TOT) Gennaro Ruggiero (PH/TOT) LHCC minireview – 06 May 2009.
1 Outer Tracker Front-End Layout Distribution of Signals and Bias NIKHEF/HeidelbergOctober 2002.
Design studies of a low power serial data link for a possible upgrade of the CMS pixel detector Beat Meier, Paul Scherrer Institut PSI TWEPP 2008.
Waclaw Karpinski General meeting CMS TRACKER SYSTEM TEST Outer Barrel –TOB Inner Barrel –TIB End cap –TEC TIB TOB TEC Different Geometries One.
FE Electronics - Overview ASD TDC L0 Buffer L1 Buffer biasL0 BXL1 50 fC DAQ counting room ~100m FE Electronics on the detector GOL Electronics Service.
Power Distribution Existing Systems Power in the trackers Power in the calorimeters Need for changes.
ATLAS SCT End-Cap C Integration 1.Introduction: to the SCT within ATLAS 2.End-Cap C Reception at CERN 3.Final Assembly 4.Integration with the TRT 5.Combined.
The LHCb Outer Tracker Front End, what does it look like and what is the status Talk for the LHCb Electronics Working Group /TS A Collaboration.
HV-Splitter for RENO Project S. Stepanyan, 김우영 경북대학교 Y.Kim Sejong University May-2008.
2 Silicon pixel part Done and to be written Written! Under way To be done Introduction 1.Hybrid Pixel Assembly Concept 2.Silicon sensor 1.First thinned.
BKLM RPC Signal & Ground Schematic Gerard Visser, Indiana University (for the barrel KLM team) 10th B2GM, 11/2011 magnet structure GND 7mm FOAM 3mm GLASS.
29-Jun-09H. Henschel DESY (Zeuthen) 1 Frontend Interface Summarize.
Grounding Guidelines Developed for LBNE
Pixel Endcap Power Distribution Phase 1 Upgrade Plans Fermilab, University of Mississippi, University of Iowa Lalith Perera University of Mississippi CMS.
L0 Technical Readiness Review-Electronics Installation Linda Bagby L0 Electronics Installation  System Electronics Overview u Low Voltage s Filter.
Director’s Review of RunIIb Dzero Upgrade Installation Linda Bagby L0 Electronics Installation  System Electronics Overview u Low Voltage u High.
P. Aspell CERN April 2011 CMS MPGD Upgrade …. Electronics 2 1.
- Performance Studies & Production of the LHCb Silicon Tracker Stefan Koestner (University Zurich) on behalf of the Silicon Tracker Collaboration IT -
Compilation of Dis-/Advantages of DC-DC Conversion Schemes Power Task Force Meeting December 16 th, 2008 Katja Klein 1. Physikalisches Institut B RWTH.
Assumptions: Cockcroft-Walton photomultiplier bases are the same for all ECAL sections Digital to analog converters are installed on the distribution boards.
Thermal Screen Grounding CERN - Dec. 10 th, 2003 Enzo Carrone The thermal screen grounding and the tracker: a scary concert Enzo Carrone.
The CMS Silicon Strip Tracker Carlo Civinini INFN-Firenze On behalf of the CMS Tracker Collaboration Sixth International "Hiroshima" Symposium on the Development.
1 (Gerard Visser – STAR Integration Meeting 5/16/2008) STAR Forward GEM Tracker Readout/DAQ Integration G. Visser Indiana University Cyclotron Facility.
CERN – 7 Oct 04 1 LHCb Muon Grounding Anatoli Katchouk CERN Alessandro Balla, Paolo Ciambrone, Maurizio Carletti, Giovanni Corradi, Giulietto Felici, Rosario.
Rene BellwiedSTAR Tracking Upgrade Meeting, Boston, 07/10/06 1 ALICE Silicon Pixel Detector (SPD) Rene Bellwied, Wayne State University Layout, Mechanics.
Juan Valls - LECC03 Amsterdam 1 Recent System Test Results from the CMS TOB Detector  Introduction  ROD System Test Setup  ROD Electrical and Optical.
J. Valls, CMS L2-L3 Meeting, Sept ROD Production at CERN  ROD Flow During Production  ROD Flow at CERN  ROD Testing Areas  Infrastructure  Equipment.
1 Chamber Interfaces Adalberto Readout-, I2C-, HV-, LV-, Gas- and chamber support interface. Space issues.
F. Arteche EMC: Electronics system integration for HEP experiments (Grounding & Shielding)
Belle-II bKLM RPC Readout Power & Ground Discussion 12 th Belle II General Meeting Gerard Visser Indiana University CEEM 7/24/2012.
HF ROBOX PRR3 Apr 2003E. Hazen HF Front-End Electronics ● System Description – Overview – PMT Board, ROBOX, Patch Panel – Signal Cable, Front-end boards.
Noise & Grounding Andrei Nomerotski (U.Oxford) 17 July 2007.
EC: 7 DISK concept Preliminary considerations
Alignment of the CMS Tracker
Calorimeter Mu2e Development electronics Front-end Review
Preliminary thoughts on SVT services
Update of MVD services and requests
- STT LAYOUT - SECTOR F SECTOR A SECTOR B SECTOR E SECTOR D SECTOR C
A few ideas about detector grounding and shielding D. Breton
Meeting on Services and Power Supplies
same for both sectors 45 and 56
DT & RPC Grounding STATUS
Compilation of Dis-/Advantages of DC-DC Conversion Schemes
ATL-IC-ES new version available - approval starts
Pixel Detector System (Barrel & Forward)
Overview of T1 detector T1 is composed by 2 arms
HCAL HV splice box.
Grounding, Power Distribution
Setup for testing LHCb Inner Tracker Modules
Presentation transcript:

W. Karpinski, Nov CMS Electronics week CMS Microstrip Tracker grounding & shielding of the CMS Tracker R. Hammarstrom (CERN EP/CMT) & W. Karpinski (RWTH AC I)

W. Karpinski, Nov CMS Electronics week CMS Microstrip Tracker Outline Overview of the CMS Tracker and its Readout electronics Grounding and shielding policy Cables and manifolds Grounding schema of TOB Grounding schema of TEC Tracker shielding

W. Karpinski, Nov CMS Electronics week CMS Microstrip Tracker L ~ 5,4 meters Outer Barrel Inner Barrel Endcap Pixel  ~ 2,4 meters Tracker Overview

W. Karpinski, Nov CMS Electronics week CMS Microstrip Tracker Si – ModuleSi – Module Biasing 500V, I = 1.0 mA (after irrad.)Biasing 500V, I = 1.0 mA (after irrad.) Front endFront end based on APV25 chips based on APV25 chips supply voltage: supply voltage: +2.5 V ; 0V I= 90 mA +2.5 V ; 0V I= 90 mA +1.25V ; 0V I= 80 mA +1.25V ; 0V I= 80 mA Optical hybridOptical hybrid supply voltage: supply voltage: +2.5 V ; 0V I =300 mA +2.5 V ; 0V I =300 mA Control systemControl system based on DOH and CCU based on DOH and CCU supply voltage: +2.5 V ; 0V supply voltage: +2.5 V ; 0V CCU I =300 mA CCU I =300 mA DOH I =300 mA DOH I =300 mA

W. Karpinski, Nov CMS Electronics week CMS Microstrip Tracker Power supplies –Situated in counting room –PS modules power groups of ~60APV =10A, =4A =14A =10A, =4A voltage drop = 5V voltage drop = 5V Cables 3 major sectionsCables 3 major sections Patch Panel 3 (PP3) in USC55 – PP2 on balconies ~100mPatch Panel 3 (PP3) in USC55 – PP2 on balconies ~100m PP2– PP1 on HCAL ~40mPP2– PP1 on HCAL ~40m PP1 - module groups ~2m-5mPP1 - module groups ~2m-5m

W. Karpinski, Nov CMS Electronics week CMS Microstrip Tracker

W. Karpinski, Nov CMS Electronics week CMS Microstrip Tracker Overall grounding and shielding strategy Floating LV, HV power supplies of each detector group, their Return Lines connected inside the detector to the Common Inter-Detector Ground Shielded power cables with low D.C. resistance and a low impedance Shielded twisted pair cables for monitoring Electrical isolation from other systems -Data transmission, clock and trigger distribution per optical link -Galvanic separation of tracker interior manifolds,as close as possible to the detector, from the long distribution manifold outside the TK Detector located inside a faraday cage

W. Karpinski, Nov CMS Electronics week CMS Microstrip Tracker All subdetectors All shields, All manifolds will be electrically connected to the 2 TK cylinder brackets A perfect and solid GROUND

W. Karpinski, Nov CMS Electronics week CMS Microstrip Tracker Interconnection and Grounding of the cables the individual shields remain insulated and interconnected at all three PP Shields grounded at the common detector ground and floating at PP3

W. Karpinski, Nov CMS Electronics week CMS Microstrip Tracker Cable inside the Tracker

W. Karpinski, Nov CMS Electronics week CMS Microstrip Tracker Cable PP1 to PP2

W. Karpinski, Nov CMS Electronics week CMS Microstrip Tracker Control Cable

W. Karpinski, Nov CMS Electronics week CMS Microstrip Tracker Prototype of the cable PP3 to PP2 Cable PP3 to PP2 Low impedance cable, Z ~2 Ohm -low inductance -high capacitance  -high immunity from E.M.I -minimize voltage overshoots due to current variations

W. Karpinski, Nov CMS Electronics week CMS Microstrip Tracker Galvanic insulation, as close as possible to Tracker All manifolds will be connected to Tracker brackets

W. Karpinski, Nov CMS Electronics week CMS Microstrip Tracker Grounding of TOB

W. Karpinski, Nov CMS Electronics week CMS Microstrip Tracker TOB Ladder 6 silicon detector modules 6 front end hybrids 6 optocal hybrids 1 CCUM 1 Interconnect bus 1 Interconnect Card Ladder is powered over one power cable one floating LV channel two HV bias channels

W. Karpinski, Nov CMS Electronics week CMS Microstrip Tracker -The cooling pipes are used as Local Ladder Ground to which LV and HV supplies are referenced. -The CCUM Ground is connected to the TOB Local Ladder Ground inside each Ladder Grounding of TOB Local Ladder Ground

W. Karpinski, Nov CMS Electronics week CMS Microstrip Tracker Grounding of TOB

W. Karpinski, Nov CMS Electronics week CMS Microstrip Tracker Grounding of TOB - The Manifold pipes (Ø 8.0 mm) are used as part of the „TOB Common Ground“, to which all corresponding LV and HV supplies are referenced. - The Digital Control (CCUM + DOHM) power supply and Control Cable Shielding are automatically connected to the TOB Common Ground

W. Karpinski, Nov CMS Electronics week CMS Microstrip Tracker Ground loops between Digital Control Cable and manifolds should be investigated Grounding of TOB

W. Karpinski, Nov CMS Electronics week CMS Microstrip Tracker Grounding of TOB  manifolds are inter connected electrically in radial manner  no loops inside the magnetic field and then tied to the TK brackets

W. Karpinski, Nov CMS Electronics week CMS Microstrip Tracker Grounding of TEC

W. Karpinski, Nov CMS Electronics week CMS Microstrip Tracker TEC: Services of 1/8 of the end cap

W. Karpinski, Nov CMS Electronics week CMS Microstrip Tracker 28 Si-detectors 28 FE hybrids 28 Opto hybrids 2 CCUM 4 IC Boards

W. Karpinski, Nov CMS Electronics week CMS Microstrip Tracker The Si- modules on each petal are organized into three power groups with one multiservice cable serving each group LV and HV supplies of all three group are referenced to the Local Petal Ground, which is distributed along the interconnect boards as a reference stub The shields of the cables associated with the petal are tied to the Local Petal Ground Grounding schema of TEC- Petals

W. Karpinski, Nov CMS Electronics week CMS Microstrip Tracker Grounding schema of one Power Group The Local Petal Ground is insulated from the cooling system and petal CFK structure The detector frames are insulated from the cooling system. The CCUM Ground is not connected to the Local Petal Ground inside petals

W. Karpinski, Nov CMS Electronics week CMS Microstrip Tracker Local Petal Grounds of all petals of one control link (3) are connected to the TEC Common Ground The Digital Control (CCUM + DOHM) power supply and Control Cable Shielding are connected only once to the TEC Common Ground to avoid ground loops Grounding of the Control Link

W. Karpinski, Nov CMS Electronics week CMS Microstrip Tracker End cap insulation disk TEC Common Ground could be realized using a thin Cu wire (  2mm, R=  /m) running in parallel in z direction or eventually cooling pipes (  12mm, R=  /m) The Cu wires and all manifolds of one half of TEC will be connected (elec) together at the end flange and tied to the 2 TK cylinder "brackets" at 3 and 9 o'clock positions

W. Karpinski, Nov CMS Electronics week CMS Microstrip Tracker

W. Karpinski, Nov CMS Electronics week CMS Microstrip Tracker Shielding Tracker Support tube and the tracker end flange covered by 100 µm AL foil Shields tied to TK brackets No individual shielding of TOB Shielding of TEC under discussion - inner support tube, front and back terminating plates covered by 50 µm Al-foils - outer cylindrical skin made of metalized CFC or metalized kapton

W. Karpinski, Nov CMS Electronics week CMS Microstrip Tracker TK Shielding