1. L0 Technical Readiness Review-Electronics Installation 9.27.05 Linda Bagby L0 Electronics Installation  System Electronics Overview u Low Voltage s Filter design u High Voltage u RTD-Carbon Fiber Temperature Monitoring s Filter design u Readout  Prep Work Summary

2. L0 Technical Readiness Review-Electronics Installation 9.27.05 Linda Bagby System Electronics  The L0 Upgrade electronics consist of 4 systems. u Isolated Low Voltage Power Supply s Wiener PS-Filter-Fuse Panel-PS Interlock-CAN bus interface u High Voltage Power Supply s HV crate-Fanout Chassis (2 units) u RTD Temperature Monitoring s RTD-Flex-Filter-32AWG-26AWG-Controller u Readout s Junction Card-Twisted pair cable-Adapter Card

3. L0 Technical Readiness Review-Electronics Installation 9.27.05 Linda Bagby Isolated Low Voltage System

4. L0 Technical Readiness Review-Electronics Installation 9.27.05 Linda Bagby Components installed  Installed and Tested u 2 Fuse Panels u East and West Side Collision Hall  Installed and Tested u Wiener Power Supply u Safety Interlock DAB

5. L0 Technical Readiness Review-Electronics Installation 9.27.05 Linda Bagby LV Power Supply Filter  Sigma*10 noise ~ 5-7 ADC counts.  5 turns on ferrite core of power cable reduced noise to 3-3.5 cts.  Filter design in progress-need to shield from magnetic field.  Shielding box (filter) will be mounted under fuse panel in cathedral area. counts channel

6. L0 Technical Readiness Review-Electronics Installation 9.27.05 Linda Bagby Filter plans  Design prototype to test at SiDet  2 quadrants per chassis

7. L0 Technical Readiness Review-Electronics Installation 9.27.05 Linda Bagby  Prep work remaining u Design and test filter u Operating parameters in EPICS database u Test CAN bus interface via GUI in Control Room  Work remaining in Collision Hall (3 days) u Install filter in cathedral u Cable Plant s 12 twisted pair 10AWG cables –fuse panel  filter –filter  gauge change panels on horseshoe s 12 twisted pair 22AWG cables –gauge change panels  AC. LV PS work remaining

8. L0 Technical Readiness Review-Electronics Installation 9.27.05 Linda Bagby High Voltage System  1st crate (L0) with 48 pods and power supply tested and installed in the 100% test stand at SiDet. u Pods modified to accommodate lower current.  2 nd 48 pod crate (SMT) load tested and ready for installation.  Prep work: u Order HV cables.  Work remaining in MCH (2-3 days): u Install 2 HV crates-1 st from SiDet, 2 nd in house. u Install 2 Fanout chassis. u Install 48 SHV cables from pods to Fanout chassis. u Remapping of Inner H-disk channels. u Redistribute fanout for additional 48 channels.  Work remaining in Collision Hall: u None

9. L0 Technical Readiness Review-Electronics Installation 9.27.05 Linda Bagby RTD system  Monitors carbon fiber structure temperature.  Testing at SiDet has uncovered noise coupling into the readout from RTD flex circuits.  32 AWG cable shielding tied to isolated ground at AC removed noise. 81 36 conductor Hirose L0 Isolated GND 36 conductor x8

10. L0 Technical Readiness Review-Electronics Installation 9.27.05 Linda Bagby Filter SPICE Model FILTERRTD Controller

11. L0 Technical Readiness Review-Electronics Installation 9.27.05 Linda Bagby Filter Response  Model illustrates >60dB attenuation.  Rs need to be tweaked to accommidate Controller capability.  Studies underway to determine maximum lead R.  Ready to layout prototype board. 1KHz 5mV 40mV -60dB -74dB

12. L0 Technical Readiness Review-Electronics Installation 9.27.05 Linda Bagby RTD System  Prep work u Design, test, and manufacture filter card-shielding scheme. s How much lead resistance can Controller tolerate? –Latest studies show the Controller can handle 3K Ohm per lead. Channel variations are linear and can be calibrated out as was done with the current SMT. s Will just a filter work, a cable shield, or a combination of both? –Filter:Cs need a connection to detector ground in the vicinity of the junction card ring. Not clear how this connection will be made.(Perhaps 34  26AWG card is easier place to put filter.) –Shield:Requires a connection to L0 isolated ground. This can be done at the horseshoe but need to be careful..returns are quadrant specific due to LV distribution scheme. Leads to another issue—34  26AWG boards. Current design has one per end. Will probably have to go to two due to location of isolated gnd connection points.This translates into installing 2 cables from the gap to Controller electronics.

13. L0 Technical Readiness Review-Electronics Installation 9.27.05 Linda Bagby RTD System  Work remaining in Collision Hall u Connect RTD flex circuits to filter cards (Hirose). u Install 2 (probably 4) 32  26 AWG boards on horseshoe. u Connect 32 AWG cables. u Install Controller cable from horseshoe to Controller rack on platform.

14. L0 Technical Readiness Review-Electronics Installation 9.27.05 Linda Bagby Readout-Junction Card Junction Card and Twisted pair cable 6 per ring — 12 per end Junction Card Mounting Ring 2 rings per end

15. L0 Technical Readiness Review-Electronics Installation 9.27.05 Linda Bagby Readout-Junction Card  Work in Collision Hall u Connect digital jumper cable from detector to Junction card. u Mount junction card. u Test channel, complete first tier ring of 6 on each end. u Install second tier mounting ring. u Mount remaining 6 junction cards, test.

16. L0 Technical Readiness Review-Electronics Installation 9.27.05 Linda Bagby Readout-Adapter Card  Work in Collision Hall u Remove 24 old ACs and standoffs. u Install 12 new ACs and mounts – 3 per quadrant. u Route 48 twisted pair cables from junction cards to ACs. u Connect cables: twisted pair (4/cd), power(4/cd), clock (16/cd), 80 conductor (2/cd). u Test L0 DAQ channel (2/card). Adapter Card Installed on Horseshoe

17. L0 Technical Readiness Review-Electronics Installation 9.27.05 Linda Bagby Horseshoe Positions  Positions for the temperature monitoring gauge change panels, LV gauge change panels, and Adapter Cards were determined based on the existing DAQ cable map.  Every effort has been made to minimize the number of cable moves required to integrate L0 into the current system.  Since the Outer and Inner H-disk low mass cables are combined on one old AC, it is necessary to move half of the Inner H-disk low mass cables (48). The open channels will be used for L0.

18. L0 Technical Readiness Review-Electronics Installation 9.27.05 Linda Bagby Sector 1 Low Mass Moves Open Positions for Sector 1 44B2 to 35C1 44, 45, 46, 52 45C2 to 36B1 46C2 to 36C1 52C2 to 43C1 Sector 2 Low Mass MovesOpen Positions for Sector 2 29B2 to 22C1 29, 30, 31, 37 30C2 to 23B1 31C2 to 23C1 37C2 to 28C1 Sector 6 Low Mass MovesOpen Positions for Sector 6 57C2 to 50C1 57, 58, 59, 65 58C2 to 51B1 59C2 to 51C1 65C2 to 56C1 NorthEast S1: 45,46 S2: 30,31 S6: 57,58 LV AWG  AC RTD board position dependant on filter design

19. L0 Technical Readiness Review-Electronics Installation 9.27.05 Linda Bagby Sector 3 Low Mass Moves Open Positions for Sector 3 16C2 to 09C1 16, 17, 18, 24 17C2 to 10B1 18C2 to 10C1 L0 Prototype in 16, 17 24C2 to 15C1 Sector 4 Low Mass MovesOpen Positions for Sector 4 02C2 to 11C1 02, 03, 04, 05 03C2 to 76C1 04C2 to 77B1 05B2 to 77C1 Sector 5 Low Mass MovesOpen Positions for Sector 5 70C2 to 63C1 70, 71, 72, 78 71C2 to 64B1 72C2 to 64C1 78C2 to 69C1 NorthWest S3: 16,17 S4: 02,03 S5: 70,71 AC LV AWG 

20. L0 Technical Readiness Review-Electronics Installation 9.27.05 Linda Bagby Sector 3 Low Mass Moves Open Positions for Sector 3 36C2 to 28C1 36, 37, 38, 46 37C2 to 29C1 38C2 to 30C1 46C2 to 35C1 Sector 4 Low Mass MovesOpen Positions for Sector 4 51C2 to 43C1 51, 52, 53, 59 52C2 to 44C1 53C2 to 45C1 59C2 to 50C1 Sector 5 Low Mass MovesOpen Positions for Sector 5 64C2 to 56C1 64, 65, 66, 72 65C2 to 57C1 66C2 to 58C1 72C2 to 63C1 SouthWest S3: 36,37 S4: 51,52 S5: 64,65 LV AWG  AC

21. L0 Technical Readiness Review-Electronics Installation 9.27.05 Linda Bagby SouthEast S1: 10,11 S2: 23,24 S6: 76,77 AC LV AWG  Sector 1 Low Mass Moves Open Positions for Sector 1 10C2 to 02C1 10, 11, 12, 18 11C2 to 03C1 12C2 to 04C1 18C2 to 09C1 Sector 2 Low Mass MovesOpen Positions for Sector 2 23C2 to 15C1 23, 24, 25, 31 24C2 to 16C1 25C2 to 17C1 31C2 to 22C1 Sector 6 Low Mass MovesOpen Positions for Sector 6 76C2 to 05C1 76, 77, 78, 79 77C2 to 69C1 78C2 to 70C1 79C2 to 71C1

22. L0 Technical Readiness Review-Electronics Installation 9.27.05 Linda Bagby SE_1 Mapping IB Sequencer VRB

23. L0 Technical Readiness Review-Electronics Installation 9.27.05 Linda Bagby SEQ fibers  Layer Zero utilizes VRB slots previously used by H-disks.  H-disks were not used in the STT trigger.  To integrate Layer Zero into the trigger, SEQ fibers need to be moved from the associated VRB crates to the splitters mounted on the wall in MCH2.  Work in MCH2 u Reroute 2 fibers/VRB crate (24 total) to splitter. u Install 2 fibers/splitter to VRB crates.

24. L0 Technical Readiness Review-Electronics Installation 9.27.05 Linda Bagby Prep Work Summary  LV system u Design and test filter.  HV system u Install 1 crate, order SHV cable.  RTD system u Design and test filter-shield.  Readout u SEQ-splitter fiber plant.