Module Flex status. 4 types: M4, M2, M1plane, M1mountain. constraint: components and bonding on the same side → folded wing geometry of the flex module.

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Presentation transcript:

Module Flex status. 4 types: M4, M2, M1plane, M1mountain. constraint: components and bonding on the same side → folded wing geometry of the flex module. Serial powering current: 0,6A mandatory for the tracks implementation on the stave flex. Discussion started with LPSC on current generator. Current PSPP not adapted for the low current/high voltage powering. Should be studied but not implemented on the module flexes. Total surfaces: stave flex 558cm², module flex 322cm² → 37% for modules. → Important to reduce matter for modules too. Discussion with Rui on 23/04/2015: same material and process than stave flexes. Platted holes possible with a 10µm copper platting. Not dominant for X0 because of the reduced surface of copper. Final stack-up: coverlay(12-12µm)-core( µm)-coverlay(12-12µm). Scheme currently finalized, HV pads… Modules CAD details to be discussed with bonding company: connection pads, glob-top, gluing? Also full sheet CAD to be discussed for tooling development with bonding and components mounting people. First contact with Hybrid SA (Neuchâtel), advised by Rui. → Meeting foreseen soon with a first set of CAD drawings. Sebastien Vilalte, 28/04/2014

Tooling(s): to be discussed with Hybrid SA and LAPP for specific features: bending/folding… Also with components mounting company. What are we going to do in LAPP? Compromise between time and money (gluing). Steps:→ Finish 1 st version of CAD & meet Hybrid SA: end of May. Discuss with component mounting people (CERN, Addax?, not so trivial…). → Rework of the CAD, tuning with Rui, launch prod: beginning of June. Can expect naked flexes for September. → Components mounting: September. → Gluing, bonding: sept,oct... Production: for one stave, total of 7 M4, 2 M1 and 13 M2. For electrical and mechanical tests, need at least 20 M4, 10 M1 and 40M2. Represents about 900cm², the equivalent surface of the stave flex prod. → about 8000CHF. → mounting, gluing, bonding: €??? → connectors: 500€ Linked developments: translation boards for module testing with USB-pix: 200€. TOTAL: 15-20k€. Sebastien Vilalte, 28/04/2014