1 10 MEMS Products & Case Histories Ken Gilleo PhD ET-Trends LLC 92%

2 Newer OLD

3

4 Silicon Load Cell for Loads up to 1000 kg An array of capacitors is used instead of a single capacitor to compensate for nonhomogeneous force distributions.

5 Micro fluid handling systems By sensing the pressure drop over a fixed hydraulic resistance with use of pressure sensors, the flow through the shunt resistor can be obtained. The monolithic sensor consists of two capacitive read-out pressure sensors, connected by a resistance channel. Because two pressure sensors are used (relative to atmospheric pressure) the sensor can be used both to measure flow-rate as well as pressure

Knowles From various Knowles articles on web

7 Infineon The microphone consists of two chips, the MEMS chip and an application-specific integrated circuit (ASIC), both of which share the same package on a surface-mounted device. The MEMS consists of a rigid, perforated back electrode and a flexible silicon membrane that serves as a capacitor, transforming acoustic pressure waves into capacitive variations. The ASIC detects these variations, converts them into electrical signals and passes them to the appropriate processing devices, such as a baseband processor or amplifier.

8 MEMS Microphones

9 QFN Package

10 Session Summary MEMS Mfgs. pioneered packaging  Inertial sensors  Pressure sensors  Ink jets  Microphones Most attempt to stay within infrastructure MEMS packing vendors are emerging No clear trend for packaging outsourcing

11 12 Summary & Future Ken Gilleo PhD ET-Trends LLC 98%

12 Markets

13 Top MEMS Co’s Much of HP’s MEMS is simple ink jet chips with no moving parts.

14 MOEMS Mkt. MOEMS Mkt. By region

15 Trends New MEMS startups will be fabless More MEMS good fab services More reuse  MUMPS standards  Existing libraries Packaging  Still custom designed by MEMS device designer  Some use of MEMS-specific packagers

16 Final Summary Adding motion to chips is a very big deal MEMS: a top technology for 21 st century MEMS: long lifetime (beyond silicon electronics) MEMS and Nano are compatible, synergistic MEMS: greatest packaging challenge MEMS packaging should work for nano