U N C L A S S I F I E D FVTX Detector Readout Concept S. Butsyk For LANL P-25 group.

Slides:



Advertisements
Similar presentations
Ancillary firmware for the NSW Trigger Processor Lorne Levinson, Weizmann Institute for the NSW Trigger Processor Working Group NSW Electronics Design.
Advertisements

E-link IP for FE ASICs VFAT3/GdSP ASIC design meeting 19/07/2011.
6/8/03J. Lajoie - PHENIX Silicon Workshop1 Pixel Ladder, PILOT Issues Physical structure of first pixel layer –FPGA-based PILOT chip readout Show some.
July 10, 2008 PHENIX RPC review C.Y. Chi 1 RPC Front End Electronics On chamber discriminator  The strips  The CMS discriminator chips  The discriminator.
David L. Winter for the PHENIX Collaboration PHENIX Silicon Detector Upgrades RHIC & AGS Annual Users' Meeting Workshop 3 RHIC Future: New Physics Through.
Electrical Integration WBS Eric J. Mannel Columbia University Electronics Project Engineer VTX and FVTX.
Trigger Supervisor (TS) J. William Gu Data Acquisition Group 1.TS position in the system 2.First prototype TS 3.TS functions 4.TS test status.
Understanding Data Acquisition System for N- XYTER.
Leo Greiner IPHC meeting HFT PIXEL DAQ Prototype Testing.
1 DAQ for FVTX detector Implementation Mark Prokop Los Alamos National Laboratory.
PHENIX upgrade DAQ Status/ HBD FEM experience (so far) The thoughts on the PHENIX DAQ upgrade –Slow download HBD test experience so far –GTM –FEM readout.
M. Lo Vetere 1,2, S. Minutoli 1, E. Robutti 1 1 I.N.F.N Genova, via Dodecaneso, GENOVA (Italy); 2 University of GENOVA (Italy) The TOTEM T1.
Pixel hybrid status & issues Outline Pixel hybrid overview ALICE1 readout chip Readout options at PHENIX Other issues Plans and activities K. Tanida (RIKEN)
Leo Greiner TC_Int1 Sensor and Readout Status of the PIXEL Detector.
David Bailey University of Manchester. Overview Aim to develop a generic system –Maximise use of off-the-shelf commercial components Reduce as far as.
HBD FEM the block diagram preamp – FEM cable Status Stuffs need to be decided….
Leo Greiner IPHC DAQ Readout for the PIXEL detector for the Heavy Flavor Tracker upgrade at STAR.
LANL FEM design proposal S. Butsyk For LANL P-25 group.
A Front End and Readout System for PET Overview: –Requirements –Block Diagram –Details William W. Moses Lawrence Berkeley National Laboratory Department.
11th March 2008AIDA FEE Report1 AIDA Front end electronics Report February 2008.
HBD FEM Overall block diagram Individual building blocks Outlook ¼ detector build.
CPT Week, April 2001Darin Acosta1 Status of the Next Generation CSC Track-Finder D.Acosta University of Florida.
David L. Winter Nevis FVTX FEE Concept PHENIX FVTX Review 19 February 2007.
Muon Electronics Upgrade Present architecture Remarks Present scenario Alternative scenario 1 The Muon Group.
Leo Greiner PIXEL Hardware meeting HFT PIXEL detector LVDS Data Path Testing.
Xiangming Sun1PXL Sensor and RDO review – 06/23/2010 STAR XIANGMING SUN LAWRENCE BERKELEY NATIONAL LAB Firmware and Software Architecture for PIXEL L.
The PHENIX Forward Silicon Vertex Tracker Eric J. Mannel IEEE NSS/MIC October 29, 2013.
FVTX Electronics (WBS 1.5.2, 1.5.3) Sergey Butsyk University of New Mexico Sergey Butsyk DOE FVTX review
ATLAS Trigger / current L1Calo Uli Schäfer 1 Jet/Energy module calo µ CTP L1.
NUMI Off Axis NUMI Off Axis Workshop Workshop Argonne Meeting Electronics for RPCs Gary Drake, Charlie Nelson Apr. 25, 2003 p. 1.
1 The PHENIX Muon Identifier Front End Electronics Andrew Glenn (University of Tennessee), for the PHENIX collaboration Andrew Glenn 5/1/01 April APS Meeting.
FPGA firmware of DC5 FEE. Outline List of issue Data loss issue Command error issue (DCM to FEM) Command lost issue (PC with USB connection to GANDALF)
March 9, 2005 HBD CDR Review 1 HBD Electronics Preamp/cable driver on the detector. –Specification –Schematics –Test result Rest of the electronics chain.
December 14, 2006Anuj K. Purwar1 Design proposal for Read Out Card (ROC) Anuj K. Purwar December 14, 2006 Nevis Meeting.
LHCb front-end electronics and its interface to the DAQ.
1 07/10/07 Forward Vertex Detector Technical Design – Electronics DAQ Readout electronics split into two parts – Near the detector (ROC) – Compresses and.
Valerio Re, Massimo Manghisoni Università di Bergamo and INFN, Pavia, Italy Jim Hoff, Abderrezak Mekkaoui, Raymond Yarema Fermi National Accelerator Laboratory.
Sept. 7, 2004Silicon VTX Workshop - Brookhaven National Laboratory, Long Island, New York Prototype Design of the Front End Module (FEM) for the Silicon.
Modeling PANDA TDAQ system Jacek Otwinowski Krzysztof Korcyl Radoslaw Trebacz Jagiellonian University - Krakow.
KLM Trigger Status Barrel KLM RPC Front-End Brandon Kunkler, Gerard Visser Belle II Trigger and Data Acquistion Workshop January 17, 2012.
FVTX Electronics (WBS 1.5.2, 1.5.3) Sergey Butsyk University of New Mexico Sergey Butsyk DOE FVTX review
Connector Differential Receiver 8 Channels 65 MHz 12 bits ADC FPGA Receive/buffer ADC data Format triggered Events Generate L1 Primitives Receive timing.
HBD/TPC Electronics Status Works done to for a)Prototype detector readout b)Understand packing density and heat loading issues c)Address the overall system.
D. M. Lee, LANL 1 07/10/07 Forward Vertex Detector Overview Technical Design Overview Design status.
XLV INTERNATIONAL WINTER MEETING ON NUCLEAR PHYSICS Tiago Pérez II Physikalisches Institut For the PANDA collaboration FPGA Compute node for the PANDA.
1 Level 1 Pre Processor and Interface L1PPI Guido Haefeli L1 Review 14. June 2002.
HBD/TPC Electronics Status Works done to for a)Prototype detector readout b)Understand packing density and heat loading issues c)Address the overall system.
.1PXL READOUT STAR PXL READOUT requirement and one solution Xiangming Sun.
D. M. Lee, LANL 1 07/10/07 Forward Vertex Detector Status: R&D: Scientific and Technical Resources Technical Design Overview Design status R&D Cost and.
1 Carleton/Montreal Electronics development J.-P Martin (Montreal) Shengli Liu & M. Dixit (Carleton) LC TPC Meeting DESY Hamburg, 4 June 2007.
Tracking at the Fermilab Test Beam Facility Matthew Jones, Lorenzo Uplegger April 29 th Infieri Workshop.
Juin 1st 2010 Christophe Beigbeder PID meeting1 PID meeting Electronics Integration.
Readout controller Block Diagram S. Hansen - CD-1 Lehman Review1 VXO Ø Det Links to 24 SiPM Front End Boards Clock Event Data USB ARM uC A D Rd Wrt 100Mbit.
DHH at DESY Test Beam 2016 Igor Konorov TUM Physics Department E18 19-th DEPFET workshop May Kloster Seeon Overview: DHH system overview DHE/DHC.
Work on Muon System TDR - in progress Word -> Latex ?
DAQ Requirements M. Villa 21/02/2011.
CALICE DAQ Developments
Evidence for Strongly Interacting Opaque Plasma
Iwaki System Readout Board User’s Guide
TELL1 A common data acquisition board for LHCb
RadLab PHENIX Meeting Feb
VELO readout On detector electronics Off detector electronics to DAQ
The digital read-out for the CSC system of the TOTEM experiment at LHC
The digital read-out for the CSC system of the TOTEM experiment at LHC
RPC Front End Electronics
New DCM, FEMDCM DCM jobs DCM upgrade path
PID meeting Mechanical implementation Electronics architecture
Digitally subtracted pulse between
SVT detector electronics
TELL1 A common data acquisition board for LHCb
Presentation transcript:

U N C L A S S I F I E D FVTX Detector Readout Concept S. Butsyk For LANL P-25 group

S. Butsyk, LANL 02/19/07 Outlook Overview of the FVTX detector LANL readout concept Read Out Card (ROC) design Front End Module (FEM) design Integration into PHENIX DAQ

S. Butsyk, LANL 02/19/07 FPHX Chip Data Format Detector consists of 8640 FPHX chips FPHX chip continuously sends words with 16 bits of information at 200 MHz – Data word : contains ROW(7b), ADC(3b), BCO counter(6b) – Sync word : Sent when no data. Used to sync the serial data 2 output lines seems to be optimal as we can output 4 hits in 4 BCO clocks  – Chip designed in accordance with requirements to participate in LVL-1 trigger Data words latch the timestamp of the beam clock in internal BCO counter Fully programmable interface with 2 download lines per up to 32 chips

S. Butsyk, LANL 02/19/07 FVTX Readout Ideas Readout is based upon PHENIX DAQ standards: – Defined set of chips is read out by a single electronics channel (FEM) through Data Collection Module (DCM) into a Packet Granularity defined by constraints on: – Bandwidth – Readout latency (4 BCO Clocks for LVL-1) – Mechanical placement (~1.1 Mil readout channels in total, 3 times more then we currently have in PHENIX ! ) – Cost of components R&D for the FVTX detector electronics is the same as for iFVTX detector readout Standard DAQ implementation is a big advantage to the design – Use of well defined/tested PHENIX DAQ architecture

S. Butsyk, LANL 02/19/07 PHENIX DAQ Requirements ~9.4 MHz beam clock Data buffered by FEM for 64 beam clocks LVL-1 Trigger issued with fixed delay w.r.t. collision FEM sends the data from the collision bucket to DCM in a data packet format Event is constructed from the packets, corresponding to the same event, by Event Builder Sub-System Dependent Part PHENIX Standard Part

S. Butsyk, LANL 02/19/07 Constraints for the Readout Constraints – Large number of Data I/O lines – In total ~17K LVDS pairs – Maximum total bandwidth Tb/s – Radiation environment around the detector – 10 year Total Integrated Dose - <200 kRad – 2 SEU/FPGA/hour at 40 cm for RHIC I rates – Synchronicity of the data between all 8640 chips – Triggered readout – data stored for less then 64 Beam Clocks – Ability to generate a flag if chip clogs with data Solutions – Combine/compress the data near the detector – Use Radiation Tolerant FPGAs close to the detector – ACTEL FLASH based FPGA – Split design logically in two parts – In IR – Data combiner/compressor board and fiber interface (ROC) – In the Counting House – Data buffer and triggered readout (FEM) – Store the data by BCO clock in 64 FIFO array

S. Butsyk, LANL 02/19/07 Expected Data Rates Single wedge of FVTX detector consists of 26 FPHX chips Simulation shows the average number of hits per chip in most central Au+Au event to be ~ 4hits/chip Estimation of the total delay to combine and send 4 hits from every chip on 2 output lines form 52 chips takes ~14 BCO clocks For smaller number of hits, the delay drops significantly to ~ 6 BCO clocks for 1 hit/chip # BCO clocks 2 output lines

S. Butsyk, LANL 02/19/07 FVTX Readout Block Diagram

S. Butsyk, LANL 02/19/07 ROC Design Specifications Combine serial data from 52 FPHX chips Synchronize readout and strip off Sync Words Generate ~200 MHz Serializer Clock Provides Control, Download and Calibration signals for the chips Append CHIP ID to the data Send parallel data word output at 200 MHz over 2 fiber interface to the FEM Implemented on ACTEL A3PE3000 FLASH based FPGA

S. Butsyk, LANL 02/19/07 ROC Block Diagram Fiber Link To FEM ROC Channel FVTXFVTX

S. Butsyk, LANL 02/19/07 ROC Implementation 4 chip combiner design implemented and tested on ACTEL test board Ready to test the design for 8 chips combiner Plan to test full 52 chip design by distributing the data from the single chip to 52inputs 8-chip HDI USB Interface Actel Starter Board

S. Butsyk, LANL 02/19/07 FEM Design Specifications FEM receives parallel data from a single ROC channel over fibers at fixed rate of 200 MHz Main functionality – Store the data by BCO counter – Buffer data for 64 BCO clocks – Read the data from certain BCO counter to output buffer at 300 MHz – Send the output buffer content to the DCM as 20b words at 40 MHz Plan to combine the data from 4-6 FEM channels into single DCM channel with a small-scale channel combiner FPGA Implementation – Xilinx mid-scale Vertex-4 FPGA VC4VSX35 – Use built-in FIFOs and Relationally Placed Macros (RPMs) for maximum performance and predictability

S. Butsyk, LANL 02/19/07 FEM Implementation Design tested with single chip readout and “fake” data and running chip calibration chain 100% of hits propagates through FEM with realistic triggered readout Readout to PC tested at 800 Mb/s rate using NI readout board Virtex-4 test board FPIX Chip

S. Butsyk, LANL 02/19/07 Readout Prototype Testing “Fake” LVL1 Accept generated from the FAST-OR of all pixels Calibration board sent 100 pulses of different amplitude to a particular pixel Design successfully run at 150 MHz input data rate GOT_HIT Writing into FIFO array Trigger 42 BCO clocks delay Reading from FIFO array GOT_HIT Writing into FIFO array Trigger 42 BCO clocks delay Nothing

S. Butsyk, LANL 02/19/07 Integration into PHENIX No effect to the central arm acceptance Total power consumption – 475 W/arm ROC board 7 ROC channels Fiber drivers

S. Butsyk, LANL 02/19/07 Main Design Advantages Reduce the number of output lines and overall bandwidth at the detector Compatible with LVL-1 requirements Handles Au+Au most central events with sufficient contingency Compatible with existing PHENIX DAQ architecture Tolerant to Single Event Upsets in radiation environment Fits within mechanical constraints of enclosure Reasonable power consumption Design uses widely available and well tested commercial components