ITRS Factory Integation TWG 2017/3/27 ITRS Factory Integration Technology Working Group (FITWG) Industry Presentation 18 July 2001 Michio Honma, NEC Jeff Pettinato, Intel FITWG 2000

ITRS Factory Integation TWG 2017/3/27 Agenda Scope and Factory Drivers Difficult Challenges Key Technology Requirements Integrated Potential Solutions: Process Control Agile Manufacturing Material Handling Summary FITWG 2000

Factory Integration Group Regional Representatives ITRS Factory Integation TWG 2017/3/27 Factory Integration Group Regional Representatives Europe Klaus Eberhardt Richard Oechsner Claus Schneider Taiwan Hugo Chang JJ Hsu Japan Michio Honma Shoichi Kodama Toshi Uchino Hiromi Yajima US Court Skinner Jeff Pettinato FITWG 2000

Factory Integration Contributing Members Many International members have contributed to FI

ITRS Factory Integation TWG 2017/3/27 2001 Factory Integration Scope Includes Wafer, Chip and Product Manufacturing The Factory Wafer Mfg. Chip Mfg. Product Mfg. Si Substrate Mfg. Distribution FEOL BEOL Probe/Test Singulation Packaging Test The Factory is driven by Cost and Productivity: Reduce factory capital and operating costs per function Enable efficient high-volume production with operational models for varying product mixes (high to low) and other business strategies Increase factory and equipment reuse, reliability, and overall efficiency Quickly enable process technology shrinks and wafer size changes FITWG 2000

ITRS Factory Integation TWG 2017/3/27 2001 Difficult Challenges > 65nm through 2007 < 65nm after 2007 Managing Complexity Quickly and effectively integrating rapid changes in semiconductor technologies and market conditions Factory Optimization Productivity increases are not keeping pace with needs Flexibility, Extendibility, Scalability Ability to quickly convert to new semiconductor technologies while reusing equipment, facilities, and skills Post CMOS Manufacturing Uncertainty Inability to predict factory requirements associated with post CMOS novel devices 450mm Wafer Size Conversion Timing and manufacturing paradigm for this wafer size conversion Will 450mm be a scale up of 300mm or a more radical change in manufacturing technology (single wafer carriers, etc.) FITWG 2000

ITRS Factory Integation TWG 2017/3/27 All factory areas must be integrated to solve these Difficult Challenges Factory Areas or Thrusts Technology Requirements and Potential Solutions are expressed through these factory areas Includes Wafer, Chip, and Product Manufacturing Factory Operations Facilities Material Handling Factory Information and Control Systems Production Equipment Examples: Building, cleanroom, utility systems, process fluid delivery Example: Manufacturing rules, production size, mix Examples: AMHS Transport, storage, ID Systems, interface standards Example: Equipment unit, real-time process control, interface standards, Embedded Control Example: MES, Computers, Networks, Process Control Complexity Management Rapid changes to business needs & demands; Increasing process & product complexity; Larger wafers and carriers, Increased reliance on factory information & control systems Increased customer expectation to meet on time delivery; Increased urgency for improved factory effectiveness, High factory yield at startup; Reduce wafer and product cost; Satisfy all local regulations Difficult Challenges >65nm thu 2007 Factory Optimization Extendibility, Flexibility, Scalability Reuse of building, production equipment, and factory information and control systems; Factory designs that support rapid process and technology changes/retrofits; Comprehend tighter ESH/Code requirements FITWG 2000

Key Technology Requirements and Issues 1. Production equipment is not keeping up with Overall Equipment Efficiency (OEE) and Availability targets Ex. 2001 OEE target of 83% vs. actual of 65% for bottleneck equipment 2. Process technology advances are occurring at ever faster rates; factories are expected to ramp and meet yield targets more quickly New equipment for 157nm litho, High K gate stack, Low k dielectrics, SOI, copper will be implemented in factories over the next 2-5 years 3. A 45% reduction in manufacturing cycle times by 2007 is expected for high volume high mix factories 4. Direct transport systems capability must be ready for beta tests during 2002 and HVM implementation by 2004 5. Time required to a) build/ramp new factories, or b) convert/ramp existing factories to new technologies must improve 30% by 2007 6. 300mm software standards compliance is not meeting single wafer processing and intrabay AMHS needs

Integrated Solutions are Essential to Meet Needs ITRS Factory Integation TWG 2017/3/27 Integrated Solutions are Essential to Meet Needs Technology Requirements New disruptive process technologies 157nm litho High K gate stack Low k dielectrics Copper processing + Improved Productivity Decreased Factory Cycle Time (QTAT) Improved Equipment Efficiency Reduction in non-product (I.e. test) wafer usage More efficient direct labor Faster factory conversion at technology nodes Integrated Solutions Agile Manufacturing - Equipment Engineering Systems - EES - Single wafer control - e-Diagnostics Process Control - Fault Detection Capabilities - Feedback & Feed forward Process Control - Machine to machine matching Material Handling - Direct Transport AMHS - AMHS for Send-Ahead wafers - Integrated Sorters, Stockers, Metrology Integrated Factory Goal = Meet Factory Challenges and Technology Requirements FITWG 2000

Process Control Potential Solutions Type 1: Fault Detection and Classification Inside the Tool FDC Models defined / configured FDC host signals configured FDC actions may be configured Outside of Tool Host determines actions based on type of fault Host issues control command Process Equipment Step N UI Fast FDC Module GEM Interface Host System FDC Signal / Data External FDC Module FDC Control Potential Solutions Needs Include: Real-time process sensors on process equipment Reporting of real-time data to host system Ability to stop processing at various intervals via host command Factory Software systems capabilities to manage areas and groups of equipment Software I/F Standards Technology Requirement Drivers: Overall Equipment Efficiency Equipment Availability Yield Particle Densities

Process Control Potential Solutions Type 2: Run to Run Control Run to Run Control S/W & Models MES (Equipment Control) Feed Forward and Feedback Control - Use preprocess or post metrology data to adjust processing for that lot Recipe Recommendations Factory Network EE Network Detailed wafer and chamber data required GEM Recipe Adjustment Control GEM EE EE EE GEM Metrology Equipment UI UI Metrology Equipment Step N Step N+1 Step N-1 Parameterized recipes required Metrology data pipeline UI Process Equipment Technology Requirement Drivers: Overall Equipment Efficiency Optimize Process Performance (for example): Litho Gate CD control (nm) Litho Overlay Control (nm) Diffusion Oxide thickness Potential Solutions Needs Include: Reporting of metro data to host system Ability to adjust key recipe parameters at various intervals via host command Relationship between end process results and adjustable process parameters Open software interfaces and standards

Process Control Potential Solutions Type 3: Integrated Metrology Factory Network EE Network Metrology data and detailed wafer and chamber data GEM EE Recipe and Model Selection via remote interface Host System Equip Controller EES Parameterized recipes required UI Integrated Process and Metro Equip. Integrated Metrology Module (not Bolt on) Potential Solutions Needs Include: Hardware integration of process and metrology equipment Software integration of metrology and process equipment Single SECS/GEM interface for integrated metrology and process equipment No increase in process equipment footprint No degradation in equipment run rate or availability Technology Requirement Drivers: Factory Cycle Time per Mask Layer Interbay AMHS throughput Intrabay AMHS throughput

Agile Manufacturing Means… Quick turn around [*faster cycle] time for production Quick turn around time without productivity deterioration No productivity reduction even if many lots production formed with few wafers Quick capability to product, scale and technology change Quick ramp-up of equipment installation and product Assure high productivity even if low production volume to Satisfy these Requirements… Speed Product: short ramp-up time Equipment: short ramp-up time Product Quick Turn Around Time (QTAT) Cost Equipment high OEE Product yield high at ramp-up

Key Potential Solutions Full Automation Equipment Engineering System Fundamental technology Single Wafer Control Multiple lots/single wafer control in equipment module (group) Process Control Fault Detection and Classification Run to Run Integrated Metrology Direct Transportation Real Time Scheduling (RTS) Supply Chain Management (SCM)

What will Equipment Engineering Systems (EES) replace? New! Manufacturing Execution System Equipment Engineering System MES MCS MES FAX and telephone be replaced by Internet No more operator this side Suppliers e-Diag Capability Operators still watch the tool to confirm its health status and do miscellaneous things AMHS

e-Manufacturing Hierarchy ITRS Factory Integation TWG 2017/3/27 e-Manufacturing Hierarchy Company to Company (E-Commerce) Suppliers Company A Company B Factory to Factory (E-Factory) e-diagnostics capability Factory A Factory B firewall Within a Factory (E-Factory) Manufacturing Execution System - MES EES Equipment/AMHS Equipment Engineering System AMHS Eqpt (side view) Ethernet Process or Metrology Equipment (side view) Control System Material Control System - MCS Station Controller FITWG 2000

The e-Business structure for manufacturing

Carrier Level integrated Flow and Control Type 1: Sorter and Metrology with Stockers End View Sorter Metro Tools OHT Loop Stocker Stocker robot loads Sorters and Metro equipment Loadports Process Tools Stockers OHT Loop Sorter Metro Tools Stocker robot interfaces directly with Sorters and Metro equip When Solutions Are Needed: Research Required by 2001 Development Underway by 2002 Qualification/Production by 2003 Potential Solutions Require: Standardized Intrabay Operation Integrated Software

Wafer Level Integrated Flow and Control Type 2: Connected EFEM Equipment Supplier A Equipment Supplier C Equipment Supplier B Wafer Staging Carrier Staging Potential Solutions Require: I/F Standard (H/W, S/W) Standardized EFEM Software Integrated Wafer level APC Standardized Intrabay Operation When Solutions Are Needed: Research Required by 2002 Development Underway by 2004 Qualification/Production by 2005 Conceptual Only

Wafer Level Integrated Flow and Control Type 3: Expanded EFEM Standard Tool Widths Potential Solutions Require: System controller of Equipment Group Wafer Dispatcher Module structure of equipment Standardized I/F Standardized Width Modular Process Steps High Speed Wafer Transfer Standardized Intrabay Operation When Solutions Are Needed: Research Required by 2003 Development Underway by 2005 Qualification/Production by 2006 Conceptual Only

Wafer Level Integrated Flow and Control Type 4: Continuous EFEM (Revolving Sushi Bar) Single Wafer Conceptual Only Wafer Transport Potential Solutions Require: Ultra High Speed Wafer Transfer Target M/C to M/C 7sec. Wafer Level Dispatching Carrier Level Transport Single Chamber Process Tool Stocker Metrology Tool Multi-Wafer Carrier When Solutions Are Needed: Research Required by 2007 Development Underway by 2010 Qualification/Production by 2013 Target 450mm

The Next Generation Factory Concept User’s SCM - Supply Chain Management Planning System ….. ….. Direct Transport Mfg. System ….. ….. Agile -Mfg. EES Wafer Level Control ….. ….. E- Diagnostic Supporting System ….. Supplier’s SCM E-Mfg.

Summary 1. Advances in process technology are occurring at ever faster rates 2. Equipment suppliers must deliver stable equipment running new process technologies with very high Overall Equipment Efficiency (OEE) 3. Agile manufacturing systems are needed to quickly ramp new process technologies into high volume production and to achieve cycle time goals 4. Process control and machine to machine matching are needed to get high yields at startup and reduce cycle time 5. Open standards are a Key Part of Potential Solutions 6. We invite and encourage you to participate in FITWG activities to convert these plans to reality