1. ITRS Factory Integration Presentation
Mani Janakiram & Junji Iwasaki
July 2005
Global Co-Chairs:
Europe: Arieh Greenberg
Japan: Shige Kobayashi, Michio Honma
Korea: TBD
Taiwan: Thomas Chen
US: Mani Janakiram
ITRS Factory Integration TWG

2. ITRS Factory Integration TWG
Agenda
Scope and Difficult Challenges
FI Current Status
Technology Requirements
Manufacturing Strategy Evolution
Top Factory Integration Focus Areas
Summary
ITRS Factory Integration TWG

3. ITRS Factory Integation TWG
2017/4/6
Factory Integration Scope and Drivers UI
Factory
Operations
Production
Equipment
Factory Information
& Control Systems
AMHS
Facilities
Si Substrate
Mfg
Wafer
Mfg
Chip
Mfg
Product
Mfg
Distribution
Reticle
Mfg
FEOL
BEOL
Probe/Test
Singulation
Packaging
Test
Increasing cost &
Cycle time implications
Factory is driven by Cost, Quality, Productivity, and Speed:
Reduce factory capital and operating costs per function
Faster delivery of new and volume products to the end customer
Efficient/Effective high volume production, high reliability, & high equipment reuse
Enable rapid process technology shrinks and wafer size changes
DRAFT – Work In Progress - NOT FOR PUBLICATION July 2005
FITWG 2000

4. Key Technologies that will Impact Factory Design
ITRS Factory Integation TWG
2017/4/6
Key Technologies that will Impact Factory Design
2005 and future years are targeted to meet productivity and capture technology requirements
Key process and device technology intercepts that will impact the factory design are Extreme Ultraviolet Litho (EUVL), New Device Structures, new materials and the next wafer size conversion
Near Term Years
Year
2005
2006
2007
2008
2009
Technology trend (nm) 80 70 65 55 50
Wafer Size (mm)
300
Start Planning for 450mm
Started discussions
Long Term Years
Year
2010
2011
2012
2013
2014
2015
2016
2017
2018
Technology trend (nm) 45 40 35 32 28 25 22 20 18
Wafer Size (mm)
300
450
EUVL in Production?
New Device Structures?
Next Wafer Size in Production?
ITRS Factory Integration TWG
FITWG 2000

5. Difficult Challenges Summary
ITRS Factory Integation TWG
Difficult Challenges Summary
2017/4/6
E=Economic/Business
P=Process Technology
M=Manufacturing
Near Term: 2005 to >45nm
Responding to rapidly changing and complex business requirements [E]
Meeting growth targets while margins are declining [E]
Managing ever increasing factory complexity [M]
Meeting factory and equipment reliability, capability or productivity requirements per the roadmap [M]
Meeting the Flexibility, Extendibility, and Scalability needs of a cost effective, leading edge factory [M]
Meeting process requirements at 65nm and 45nm nodes running production volumes [P]
Increasing global restrictions on environmental issues [E]
Long Term: to <45nm
Post conventional CMOS manufacturing uncertainty [P]
Next Wafer Size and Emerging factory paradigm changes [M] [E]
Economic and business challenges are equal to our manufacturing and process technology challenges in scope and breadth for both efficiency and effectiveness
DRAFT – Work In Progress - NOT FOR PUBLICATION July 2005
FITWG 2000

6. Some Projected Attributes of a 300mm < 45nm Fab
ITRS Factory Integation TWG
Some Projected Attributes of a 300mm < 45nm Fab
2017/4/6
Wafer Data Standard
For Packaging
Data standards and
Systems for Rapid
Mask Set Creation
Very Fast Cycle time Fabs for Hot & Normal lots
Equipment & Systems designed for High Mix operation
100% Direct Tool Delivery AMHS
Aggressive NPW Reduction & Efficient Spares Mgmt
Full Wafer Level Tracking &
Recipe/Parameter Changes
Systems Scaled for > 50k wspm
Ubiquitous APC; Rapid Process Matching & New Product Qualification
Manufacturing
Execution Systems
Equipment Engineering Capabilities
Equipment
Control Systems
Equipment &
Process Data
SECS Control Line
APC
FDC
SPC
Recipes
Factory Scheduler
And Material Control
Yield
PCS
E-Diag
EPT
Equipment Data Acquisition (EDA) Standards to get Rich Equipment Data
Offline tools to test schedule rules and rapidly put in Mfg
Partner, Customer
Or Supplier
Pervasive
E-Diagnostics
Standard, Detailed Equipment
Performance Tracking (EPT) Data
FITWG 2000

7. FI Sub team – July 2005 Status
ITRS Factory Integation TWG
FI Sub team – July 2005 Status
2017/4/6
Subteam
July 2005 1
Factory Operations (FO)
Focus: 1) Reduce mfg cycle time, 2) Improve Equipment Utilization, 3) Reduce Losses from High Mix
Completed Technology Requirements table and potential solutions tables. No major changes to the technology table anticipated. Working on the summary. 2
Production Equipment (PE)
Focus: 1) NPW reduction, 2) Reliability Improvement, 3) Run rate (throughput) improvement
Completed Technology Requirements table and potential solutions tables. Few changes to the technology table is made. Completed rev0 write-up and impact of focus area on PE 3
Automated Matl Handling Systems (AMHS) Focus: 1) Increase throughput, 2) Reduce Average Delivery times, 3) Improve Reliability
Completed Technology Requirements table and potential solutions tables. Updating the values for peak MPH specific to high thr’put bay. Working on the summary. 4
Factory Information & Control Systems (FICS)
Focus: 1) Increase Reliability, 2) Increase Factory Throughput, 3) Handle data explosion,
4) Reduce or Maintain Mask Shop Cycle Time
Completed Technology Requirements table and potential solutions tables. Small changes to the technology table are made. Working on the summary. 5
Facilities
Focus: 1) Reduce Costs 2) Utility 3) Footprint 4) Reduce equipment installation time
Completed Technology Requirements table and potential solutions tables. Few changes to the technology requirements table are made. Working on the summary. 6
Other – Focus area & Cross-cut items
2005 FI chapter will include sections on 1) Focus areas 2) Text on AMC, EMI, ESD and cross-TWG issues.
Completed technology requirements, potential solutions, focus area and cross-cut challenges
DRAFT – Work In Progress - NOT FOR PUBLICATION July 2005
FITWG 2000

8. Factory Operations Technical Requirements
ITRS Factory Integation TWG
2017/4/6
Factory Operations Technical Requirements
Speed and Flexibility
Goal is to reduce cycle time at all levels of manufacturing
Hot lots and super fast hot lots are important due to the need to qualify processes and introduce new products to the market place
Normal lot cycle time is important to meet customer delivery time requirements. Long production cycle times for leading edge products also increases the risk that the part may be scrapped since it may no longer be needed when it exits production or it may have been redesigned while being manufactured
Key Objectives: 1) Reduce mfg cycle times, 2) Improve Equipment Utilization, 3) Reduce Losses from High Mix
Solution exists
Solution being developed
Solution required
FITWG 2000

9. Production Equipment Technical Requirements
ITRS Factory Integation TWG
2017/4/6
Production Equipment Technical Requirements
Productivity
Non-Product Wafers or NPW usage must be reduced over time.
Each NPW purchased or reclaimed has a direct cost on manufacturing
When NPW’s are run in the manufacturing line, they reduce the number of production wafers that can be run since they require equipment time
Key Objectives: 1) NPW reduction, 2) Reliability Improvement, 3) Run rate (throughput) improvement
Solution exists
Solution being developed
Solution required
FITWG 2000

10. Material Handling Technical Requirements
Key Objectives: 1) Increase throughput for Traditional and Unified Transport, 2) Reduce Average Delivery times, 3) Improve Reliability
Solution exists
Solution being developed
Solution required

11. FICS Technical Requirements
Key Objectives: 1) Increase Reliability, 2) Increase Factory Throughput,
3) Reduce or Maintain Mask Shop Cycle Time, 4) Reduce Costs
Solution exists
Solution being developed
Solution required

12. Facilities Technical Requirements
Key Objectives: 1) Factory Extendibility, 2) AMC,
3) Rapid Install/Qualification, 4) Reduce Costs
Solution exists
Solution being developed
Solution required

13. ITRS Factory Integation TWG
2005 FI Focus Area
2017/4/6
Focus Areas
July 2005 Status 1
Airborne Molecular Contamination (AMC) Implications at < 45nm process technologies (Now -> 2006)
AMC tables will be in YE and the reference text will be in PE and Facilities. 2
Rapid Equipment Install and Qualification (Now ->)
Rapid equipment install and adaptor plate ideas being formed by Facilities. Adaptor plate per tool type. Need a standard among the suppliers. 3
“Proactive Visual” manufacturing (Now ->)
Need more clarity; Minifab versus Megafab; STRJ needs help to promote visualization; This can be treated as a solution. 4
Next Wafer Size (NWS) Transition (2005 -> 2012)
FI will work with International Sematech and will continue to define technology requirements for NWS FI
Factory Integration focus areas: AMC, NWS, and Proactive Visualization
FITWG 2000

14. AMC Requirements - Current status
AMC limits are currently addressed in the Yield Enhancement YE TWG, and the Wafer Environmental Contamination Control WECC subTWG
Fab environment requirements have not been defined yet in the FI TWG
Factory
Integration
Roadmap
Yield Enhancement Roadmap
Fab
environment
Technology
Requirements
Wafer/Tool
environment
Wafer

15. Rapid Tool Install - Adapter Plate Concept
Exhaust From Tool
Supplier Utilities Into Process Tool
Facility Utilities Into Adapter Plate
(water, gasses, etc.)
Facility Power Into Adapter Plate
Exhaust To Facility

16. Proactive Visualization
ITRS Factory Integation TWG
2017/4/6
Proactive Visualization
Comprehensive structured P/V matrix be developed for SoC manufacturing
Strategic issues be broken down and mapped into P/V matrix
Solutions and needs bilaterally be traceable through P/V matrix
New IDM
New Foundry Business
Short product cycle
Small order size
Combinations of Solutions
Varying product volume
LMHV
HMLV
New
Production
Methods
Design &
Manufacturing
Integration
Strategic Issues
solutions
Cost
Delivery
Quality
Energy
Products
Factory Operation
Factory Resource
Metrics Development
and Proper Targeting Needed
Visualization
Proactive
Visualization of fab activity and goal of operation are to be shown in response to the target production model such as HMLV or LMHV, and so on.
The fab operation targets are needed to be expressed against the cross points in this 7 by 3 matrix. Each cross points are to be optimized in accordance with the over all optimization over the matrix. In the 2005 ITRS Road Map Quality*Factory Resource, Delivery*(Factory Resource, Products, and Factory Operation) are discussed.
DRAFT – Work In Progress - NOT FOR PUBLICATION July 2005
FITWG 2000

17. Cycle Time as a function of Lot Size
ITRS Factory Integation TWG
2017/4/6
Cycle Time as a function of Lot Size
Objective
Lot Size 25 12 6 2
Current R/M
(Non Hot Lot)
Current R/M (Super Hot Lot)
Next R/M
Nominal
Lot Size
The cycle times have been defined such that with a lot having 25 wafers is considered to be of the major lot size (non hot lot as well) and with 6 wafers to be of the super hot lot size at least by 2004, and the technical requirements are discussed and put into ITRD Road Map.
Because of diversification in the devices especially in SoC category High Mix/ Low Volume production was discussed and considered to be included in the Road Map in order to facilitate highlighting emerging High Mix / Low Volume production needs.
Because of the tendency in the order size becoming smaller and the requirement of shorter cycle time, the manufacturing lot size is expected to decrease as transition to the larger diameter proceeds. The lot size is expected from the current 12 wafers to 6 and 3 or 2 wafers. Road Map is expected to include the SoC’s flexible criteria such as the lot size diversification.
2005
2018
Cycle time per mask layer (days)
Short cycle time will be driven by smaller lot size and more single wafer processing
Setup time reduction
ITRS Factory Integration TWG
FITWG 2000

18. We started discussions for next wafer size transition
ITRS Factory Integation TWG
2017/4/6
We started discussions for next wafer size transition
When does this happen?
We are here
200mm/1990 (125/150mm )
300mm/2001
450mm/2012?
675mm/2021?
9 yrs + 2 yrs delay*
9 yrs? + 2 yrs delay?
9 yrs + ?yrs delay
ITRS Factory Integration TWG
FITWG 2000

19. Examples of next wafer size (NWS) technology decisions that are needed
ITRS Factory Integation TWG
2017/4/6
Examples of next wafer size (NWS) technology decisions that are needed
Attribute
Key Technology Decisions
Wafer
Material, Size, Thickness, ID, Registration, Edge Exclusion
Carrier
Number of Wafers, Size, Door Type, AMHS Strategy, ID
Production
Equipment
Single wafer vs. mini-batch, cleanliness, interface standards, productivity targets relative to 300mm (NPW usage, etc.)
Factory
Factory Size, Egress, Cleanliness, Sub-Fab attributes, Clean-room height
Automated
Material Handling
Systems
Direct transport concepts, carrier/wafer delivery time, overall throughput, efficient storage concepts
Manufacturing
Process Control & Yield Data Standards, Carrier delivery time, Decision Making Time, Data Flow
ITRS Factory Integration TWG
FITWG 2000

20. Proposed next wafer size (NWS) transition timeline
ITRS Factory Integation TWG
Proposed next wafer size (NWS) transition timeline
2017/4/6
Not final.
Need Further discussions
2004
2005
2006
2007
2008
2009
2010
2011
2012
Carrier & lot-size
determination
Direct Transport
Standards
Production Equipment
Factory Control
System Standards
Interoperability Testing
& Reliability Verification
450mm wafer
Many technology issues in NWS need to be addressed!
FI has started to work on NWS technology challenges
ITRS Factory Integration TWG
FITWG 2000

21. ITRS Factory Integation TWG
2017/4/6
Key Messages
Business strategies, market demands, and process technology changes continue to make factories difficult to integrate
Factory’s speed and flexibility are vital to accommodate various production technologies
High Mix, Cycle time improvement, equipment utilization, direct transport AMHS, etc.
Gaps in Production Equipment performance, Setup time, AMHS, Facilities and Factory operations must be improved
Metrics needed to cover versatility, productivity, agility, quality, environment compatibility
Key cross-TWG issues need to be addressed
Abatement, Energy requirement,
New technology demands tighter AMC control
Proactive visualization/usage of factory data is required
Delivery time, Quality, and Reliability
Next wafer size technical requirements need to addressed
ITRS Factory Integration TWG
FITWG 2000