High Electron Mobility Transistors (HEMT)

Slides:



Advertisements
Similar presentations
MICROWAVE FET Microwave FET : operates in the microwave frequencies
Advertisements

RF and AMS Technologies for Wireless Communications Working Group International Technology Roadmap for Semiconductors Radio Frequency and Analog/Mixed-Signal.
Microwave Solid State Power Devices Yonglai Tian
Power FET Structure DMOS and VMOS
ELECTRICAL CONDUCTIVITY
Power FET structure (DMOS and VMOS)
Metal Oxide Semiconductor Field Effect Transistors
The High Voltage/High Power FET (HiVP)
The state-of-art based GaAs HBT
(AlGaN/GaN) High electron mobility transistors Low dimensional System Master of Nanoscience Olatz Idigoras Lertxundi.
High Electron Mobility Transistors
©2007 Kwangsik Choi Characterization of Silicon Devices at Cryogenic Temperatures (Thesis of Jeffrey F. Allnutt M.S.) Kwangsik Choi.
Metal Semiconductor Field Effect Transistors
Evaluation of GaAs Power MESFET for Wireless Communication
Highly Linear Power Amplifiers for Broadband Wireless Applications Power Amplifiers for Wireless Communications Workshop September 9, 2002 M. Siddiqui,
Chap. 5 Field-effect transistors (FET) Importance for LSI/VLSI –Low fabrication cost –Small size –Low power consumption Applications –Microprocessors –Memories.
The state-of-the-art InP-based HEMTs
MSE-630 Gallium Arsenide Semiconductors. MSE-630 Overview Compound Semiconductor Materials Interest in GaAs Physical Properties Processing Methods Applications.
RFMD ® Foundry Services. RFMD Foundry Services World’s Largest III-V Electronics Manufacturer  Two high volume Fabs for unlimited capacity  Starts >25%
Presenters: Jerald Thomas, Steve Jungst April 25, Abstract: Thyristor devices are common, yet largely misunderstood semiconductor devices. In this.
1 Bipolar Junction Transistor Models Professor K.N.Bhat Center for Excellence in Nanoelectronics ECE Department Indian Institute of Science Bangalore-560.
C. KOO Millimeter-wave Integrated Systems Lab. RF Power Transistors For Mobile Applications 전기공학부 구찬회.
Chapter 6 Field Effect Transistors 6.1 Transistor Operation 6.2 The Junction FET 6.3 The Metal-Semiconductor FET 6.4 The Metal-Insulator-Semiconductor.
Chapter 1. Background on Microwave Transistors
Gallium Nitride
ECE 662 Microwave Devices Microwave Materials, Diodes and Transistors February 3, 2005.
InAs Inserted Channel HEMT MDCL 이 종 원.
ELECT /01/03 SiC basic properties The basic properties of SiC makes it a material of choice for fabricating devices operating at high power and high.
Grace Xing---EE30357 (Semiconductors II: Devices) 1 EE 30357: Semiconductors II: Devices Lecture Note #19 (02/27/09) MOS Field Effect Transistors Grace.
JFETs, MESFETs, and MODFETs
InAs Inserted HEMT 연성진.
Sanae Boulay, Limelette, Nov 05 th 20091/20 S. Boulay, B. Boudjelida, A. Sharzad, N. Ahmad, M. Missous Novel Ultra Low Noise Amplifiers based on InGaAs/InAlAs.
High Electron Mobility Transistor (HEMT)
Heterostructures & Optoelectronic Devices
© Fraunhofer IAF Mechanisms of 1/f noise and Gain Instabilities in metamorphic HEMTS D. Bruch; M. Seelmann-Eggebert; S. Guha Fraunhofer Institute for Applied.
Heterojunctions -Two different semiconductor materials that have different energy band gapes are used to form a junction -Will introduce a discontinuity.
Wideband Gap Semiconductors and New Trends in Power Electronics
High Electron Mobility Transistor
Millimeter-wave Device & Circuit Lab. (MDCL) Non-Alloyed Ohmic Contact in HEMTs Microwave devices 노 훈 희  Introduction  Ohmic.
Dr Danielle Kettle1 LNA progress 4 th SKADS Workshop, Lisbon, 2-3 October 2008 LNA progress.
Some Microwave Devices Impatt Diodes PIN Diodes Varactor Diodes YIG Devices (Yttrium-Iron Garnet) Dielectric Resonators BIPOLAR TRANSISTORS GaAsFETs HEMT.
Gallium Nitride Research & Development Rakesh Sohal
DOUBLE-GATE DEVICES AND ANALYSIS 발표자 : 이주용
By: Cody Neubarth Date: 4/27/16 Abstract Power MOSFETS are designed to handle significant power levels. It’s main advantages are its high commutation speed.
Review of Semiconductor Devices
P RESENTATION ON MONOLITHIC MICROWAVE INTEGRATED CIRCUITS PASSIVE COMPONENTS SUBMITTED BY:- AJAY KAUSHIK(088/ECE/09 ) NAMAN KUMAR(082/ECE/09 )
High electron mobility transistors (HEMT) AMIR ABDURAHIM EE /11/2016.
Contents GaAs HEMTs overview RF (Radio Frequency) characteristics
GaAs Process & Devices Anurag Nigam.
QUANTUM-EFFECT DEVICES (QED)
Introduction to GaAs HBT and current technologies
Graphene Based Transistors-Theory and Operation; Development State
Bipolar Junction Transistors and Heterojunction Bipolar Transistors
Turkey’s First Chip Factory: AB MicroNano
Project Proposal on "Device and nanotechnology".
UNDERGRADUATE COURSES USING THE SMU CLEAN ROOM
TriQuint Semiconductor, Inc.
GaN HEMT with SiN/SiO2/SiN gate dielectric
Metal Semiconductor Field Effect Transistors
Lab3: GaAs Process And Devices
A p-n junction is not a device
Other FET’s and Optoelectronic Devices
The Gunn Diode. Contents Overview of The Gunn Diode Gunn Effect Two-Valley Model Theory Gunn-Oscillation Gunn Oscillation Modes.
SEMICONDUCTORS. ELECTRONICS: The term electronics is originated from the word Electron. It was first applied to the study of electron movement and its.
Rochester VHF Group 12 December 2008
Heterojunction Bipolar Transistor
High Power, Uncooled InGaAs Photodiodes with High Quantum Efficiency for 1.2 to 2.2 Micron Wavelength Coherent Lidars Shubhashish Datta and Abhay Joshi.
X-BAND & S-BAND FOR MARINE RADAR
Student Design Competition
Plenary Round Table Interoperable Space and Enabling Technologies and Capabilities The State of Key Technologies that Ease Interoperability Between Government.
Presentation transcript:

High Electron Mobility Transistors (HEMT) BY: Aaron Buehler & Jason Vanderlinde

Outline Brief History What are they? How they Work Different Types Band Structure and Diagrams Applications Key Points References

Brief History Developed by Takashi Mimura and colleagues at Fujitsu in Japan in 1979 Faced several issues along the way Early Applications: Low noise amplifiers Installed in radio telescope Other space and military applications Commercialization began in 1987 for satellite broadcasting receivers Commercial production took off in the 90’s Faced multiple device failure(GaAs MESFET, depletion type MOSFET) until final product was produced by controlling the electrons in the superlattice by introducing a Schottky barrier over the single heterojunction HEMT’s replaced GaAs MESFET’s because of the shrink in necessary size of the antenna by .5 or more In the 90’s these entered into the satellite receivers and mobile phone applications, improvements in cost and processes

What are they? Referred to as heterojunction field-effect transistor (FET) Abrupt discontinuities Two layers of different semiconductor with two different band gap energies Separating majority carriers and ionized impurities minimizes the degradation in mobility and peak velocity The 2-D electron gas = less electron collisions = less noise

Different Types Material: AlGaAs-GaAs Pseudomorphic HEMT (pHEMT) Metamorphic HEMT (mHEMT) Indium Phosphide (InP) Galium Nitride (GaN)

HEMT structure

pHEMT GaAs pHEMT < .5 µm gate length Low noise: 1dB at 12GHz High gain: 10 dB at 12GHz Range up to 26GHz Thin layer so the crystal lattice stretches to fit the other material. Larger bandgap differences = better performance Fit together like a two combs. Used in wireless communications and satellite applications because of high power and extremely low noise capabilities.

mHEMT .15 µm gate length Low noise High gain Range up to 100GHz Large lattice mismatch between the channel and substrate is accommodated by formation of dislocations within a metamorphic buffer. Modern day can get up to 1THz

Band Structure On the left is a band structure of two different semiconducting materials and on the right is them forming a heterojunction when they come into close contact.

AlGaAs-GaAs HEMT band diagrams

InP HEMT Cross section using a scanning electron micrograph

GaN HEMT Based on GaN/AlGaN heterojunctions Uses a Sapphire (Al3O2)/Silicon Carbonide(SiC) substrate because of the wide energy gap of 3.4 eV and 3.3 eV Applicable to high power supply voltages because of the wide energy gaps Can withstand high operating temperatures In comparison to InP with only a band gap of 1.9 eV

Applications Originally for high speed applications High power/ high temperature microwave applications Power amplifiers Oscillators Cell Phones Radar Most MMIC’s radio frequency applications MMIC = Monolithic Microwave Integrated Circuit RF applications with combination of low noise and very high frequency

Key Points Its two main features are low noise and high frequency capability A heterojunction is two layers different semiconductors with different band gap energies The 2-D electron gas is essential to the low noise feature AlGaAs and GaAs are the most common materials for heterojunction Used in MMIC’s and radio frequency applications for high performance

Sources "GaAs Pseudomorphic HEMT Transistor." Mimix Broadband, Inc. N.p., 19 July 2008. Web. 30 Apr. 2013. <http://www.richardsonrfpd.com/resources/RellDocuments/SYS_4/CF003- 03.pdf>. Grunenputt, Erik. "Pseudomorphic and Metamorphic HEMT-technologies for Industrial W-band Low-noise and Power Applications.” Youscribe. N.p., Dec. 2009. Web. 30 Apr. 2013. <http://www.youscribe.com/catalogue/rapports-et-theses/savoirs/pseudomorphic-and- metamorphic-hemt-technologies-for-industrial-w-band-1426512>. Poole, Ian. "HEMT, High Electron Mobility Transistor." Radio-Electronics.com. Adrio Communications, June 2010. Web. 30 Apr. 2013. <http://www.radio- electronics.com/info/data/semicond/fet-field-effect-transistor/hemt-phemt- transistor.php>.

Sources continued "0.15-um LN MHEMT 3MI." TriQuint.com. N.p., 29 Nov. 2007. Web. <http://www.triquint.com/prodserv/foundry/docs/0.15.LN.mHEMT.3MI.pdf>. Göran, Andersson, ed. "High Electron Mobility Transistors (HEMT)." Laboratory for Millimeter-Wave Electronics. ETH Zurich, 2 Mar 2010. Web. 30 Apr 2013. <http://www.mwe.ee.ethz.ch/en/about- mwe-group/research/vision-and-aim/high-electron-mobility-transistors-hemt.html>. Neamen, Donald. Semiconductor Physics and Devices Basic Principles. 4th ed. New York: McGraw-Hill, 2012. 602-9. Print. Mimura, Takashi. "The Early History of the High Electron Mobility Transistor (HEMT)." Early History of the High Electron Mobility Transistor (HEMT). 50.3 (2002): 780-82. Web. 30 Apr. 2013. <http://ieeexplore.ieee.org.libpdb.d.umn.edu:2048/stamp/stamp.jsp?tp=&arnumber=98996 1&tag=1>.