Tom McMullen Week 3 18/2/2013 – 22/2/2013

LETI wafer thinning project flow Phase 1 IDProject NameOwnerDaysStartEnd 3-Feb10-Feb17-Feb24-Feb3-Mar10-Mar17-Mar24-Mar31-Mar5-Apr12-Apr19-Apr26-Apr 1.0Thin Wafer AssembliesT. McMullen01-Feb30-Sep Week 1Week 2Week 3Week 4Week 5Week 6Week 7Week 8Week PHASE 1 - Layout and mask production, first 2 wafers with microbumps delivered to AdvacamLETI - 3D101-Feb29-Mar LETI accpets CERN proposal 1.1.1Send gds to LETIT. McMullen51-Feb8-Feb Send 2 FEI4b wafers to LETIR. Bates51-Feb6-Feb Confirm step size on wafer and centre ofset variation on waferLETI51-Feb6-Feb Layout and mask productionLETI101-Feb11-Feb Deliverable 1: Microbumb gds files First 2 wafers with micro bumps delivered to AdvacamLETI4912-Feb2-Apr Deliverable 2: First 2 wafers with micro bumps delivered to Advacam Current Deliverable Target not met

Action List Phase 1 and 2 ActionWhatWhoWhenComment 4Top metal align key informationTMcM22/5/2003 sent to Fabian and Maurice by Richard requesting info 5CERN purcahsing info for STFCTMcM14/2/2013Contact Sandrine and ask for the invoice for STFC 6Further funding for flip-chip processRbates\Cbuttar31/2/2013 Richard awaiting information back from Hienze regarding this 7Bow measurement set-upTMcM31/2/2013Visit SMC and set up program for bow measurement

Highlights and issues  LETI and CERN agree contracts  Cash for flip-chip bonding We have the funding for the thinning work with LETI but will need further funding for the flip-chip process at Advacam Richard has contacted Heinz regarding this and awaiting feedback. Didier and Peppe have declined to contribute at this time as they have already submitted their proposals for the next 2 years We will need this further funding by the end of phase 1 (week 9 from Gant on previous slide) to test the LETI micro-bumps  Receipt of purchase CERN feedback on receipt of purchase prior to the end of March was not possible with a DAI. An invoice can be created using EDH and needs to be confirmed if this will suffice.  Top Metal layer gds information is required for the alignment scheme. Richard is trying to source this information but its painfully slow and holding up progress. Deliverable 1 has been missed due to this. LETI are still confident on meeting deliverable 2 provided we get this information ASAP.  Micro-bumps are designed and and wafer mapping completed

LETI wafer thinning project flow Phase 2 To be published in next report