Panda PCB for prototype status report by D Malkevich on behalf of the ITEP group ITEP.

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Presentation transcript:

Panda PCB for prototype status report by D Malkevich on behalf of the ITEP group ITEP

ALICE TOF experience - module based on PCB - Module design based on multi layer PCB both for mechanical construction and signal routing - Minimal Radiation Length, => no cooling and cabling inside module - Signal transmission lines, HV and L.V. distribution “on board” PANDA prototype design : Strip consists of 8 th single cell DRPC chambers fixed at 6 layers PCB and merged into common gas volume. 4 gaps R=10 10 Ω 4 gaps R=10 12 Ω 4 gaps R=10 11 Ω 6 gaps R=5*10 12 Ω 6 gaps R=10 10 Ω 4 gaps R=5*10 10 Ω 4 gaps R=5*10 11 Ω 4 gaps R=5*10 12 Ω

PCB design (Capture) We are going to do : Differential transmission lines quality Resistive coating optimization Resolution, efficiency, rate dependence, and streamer fraction using this prototype Pre amplifier Main amplifier Amplitude buffers Amplitude outputs TOT outputs Test input Internal / External Threshold HV filter LV filter Differential transmission lines HV, LV and test line TOTs, fast “OR” + Amplitude outputs Discriminator

PCB design (Layout) Discriminators AD96687 Main amplifiers AD8146 Buffers AD8056 Fast “OR” Test 50 Ohm line H.V. connector Test input External Threshold connector L.V. connectors Amplitude outputs TOTs + Fast “OR”

Last updates Discriminator MAXIM 9600 changed to AD Just to have both amplifier and discriminator from one vendor. PCB Stack up parameters for structure with 200 Ohm differential lines preliminary estimated with respect to reality i.e. available materials of manufacture, compromise between possibility and prices. (We are still discussing with manufacture precision we can achieve)

Conclusion 6 layers PCB for 8 th channels prototype was design in ORCAD. PCB stackup design parameters for 200 Ohm differential lines preliminary estimated. Calculation based on real available materials for some manufacture. Transmission lines quality test will be taken ASAP when PCB already done. Test results could give conclusion about signal transmission possibilities up to 1,5 m (we want to produced PCB ASAP but we haven’t funding for the moment) Schematic and PCB design for real size prototype will be make after confirmation final mechanical design. (PCB will be produced only after DIRC design will be fixed)