28 June 2002Santa Cruz LC Retreat M. Breidenbach1 SD – Silicon Detector EM Calorimetry.

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Presentation transcript:

28 June 2002Santa Cruz LC Retreat M. Breidenbach1 SD – Silicon Detector EM Calorimetry

28 June 2002Santa Cruz LC Retreat M. Breidenbach2 SD (Silicon Detector) Conceived as a high performance detector for NLC Reasonably uncompromised performance But Constrained & Rational cost We accept the notion that excellent energy flow calorimetry is required, and explore optimization of a Tungsten-Silicon EMCal…

28 June 2002Santa Cruz LC Retreat M. Breidenbach3 Silicon Detector EM Calorimetry

28 June 2002Santa Cruz LC Retreat M. Breidenbach4 Scale of EMCal & Vertex Detector

28 June 2002Santa Cruz LC Retreat M. Breidenbach5 Silicon Tungsten EMCal Figure of merit something like BR 2 /  where  is the rms sum of Moliere radius of the calorimeter and the pixel size. –Maintain the great Moliere radius of tungsten (9 mm) by minimizing the gaps between ~2.5 mm tungsten plates. Dilution is (1+Rgap/Rw) –Could a layer of silicon/support/readout etc fit in a 2.5 mm gap? Even less?? 1.5 mm goal?? Requires aggressive electronic-mechanical integration!

28 June 2002Santa Cruz LC Retreat M. Breidenbach6 EMCal, continued Diode pixels between 5 – 10 mm square on largest hexagon fitting in largest available wafer. (6” available now – 300 mm when??) Consider  tracking as well as E flow in picking pixel dimension. Develop readout electronics of preamplification through digitization, zero suppression and IO on bump bonded chip. Upgrade would be full integration of readout on detector wafer. (R&D opportunity!) Optimize shaping time for small diode capacitance. Probably too long for significant bunch localization within train. But some detector element needs good time resolution!!!

28 June 2002Santa Cruz LC Retreat M. Breidenbach7 Channel Counts [Forget Them!!] We are used to pixel counts in CCD’s … –3x10 8 last time, 1x10 9 this time, no problem Silicon Strip Tracker ~5x10 6 strips (channels??) EMCal ~5x10 7 pixels (channels??) Don’t even think about multiplying channels by O($10)…… Must solve the cluster technology challenges.

28 June 2002Santa Cruz LC Retreat M. Breidenbach8 Structure

28 June 2002Santa Cruz LC Retreat M. Breidenbach9 Pixels on 6” Wafer

28 June 2002Santa Cruz LC Retreat M. Breidenbach10 Zoom to Readout Chip

28 June 2002Santa Cruz LC Retreat M. Breidenbach11 Gross System Architecture Silicon Diode Array Readout Chip Network Interconnect

28 June 2002Santa Cruz LC Retreat M. Breidenbach12 Cross Section

28 June 2002Santa Cruz LC Retreat M. Breidenbach13 Signal Collection from m 2 board

28 June 2002Santa Cruz LC Retreat M. Breidenbach14 Preamplifier Architecture Charge amplifier and shaper followed by two amplifiers with gains G1,G2 and sample & holds. Comparator logic to select appropriate range Mux and 12 bit ADC

28 June 2002Santa Cruz LC Retreat M. Breidenbach15 Noise and Muons Assume 300  (  possible) effective e - collection at 80 e - / . signal ~ e -. Assuming diode capacitance of 0.3 pf/mm 2, and amplifier noise of 20e - /pf+200e - – noise ~400 e -. S/N ~60, plenty good! Pick S/N of 7 (Figure) for minimum performance.

28 June 2002Santa Cruz LC Retreat M. Breidenbach16 Plausible Resolution Criteria Spread the 0.6% muon  into several bins, with enough range for MIP counting to a few. Preliminary Monte Carlo indicates peak ionizing track density from a high energy shower to be 2200 µ equivalent. (5 x 10 7 e - = 8 pC.) Do not degrade resolution of calorimeter! Energy resolution of a sampling calorimeter with 2/3 X 0 plates will not exceed 12%/√E. Say this peak should be spread over 5 bins, and take no credit for multiple sampling. Relaxation of these requirements now being studied with EGS.

28 June 2002Santa Cruz LC Retreat M. Breidenbach17 Required Resolution High Res Bin Width=1000 e -, Emax=37 GeV,Mips=170 Low Res Bin Width=13200 e -,Emax=512 GeV,Mips=2325

28 June 2002Santa Cruz LC Retreat M. Breidenbach18 Technical Issues Assuming integrator full scale voltage of around 1 V, feedback (and calibration) capacitors need to be ~10 pF. This is large for an integrated capacitor, but doable with substantial real estate. Plus is that this makes the bump bond pitch easy!

28 June 2002Santa Cruz LC Retreat M. Breidenbach19 Thermal Management Cooling is a fundamental problem: GLAST system is ~2 mW/channel. Assume 1000 pixels/wafer and power pulsing duty factor for NLC of (10 Hz), for 2 mW average power. Assume fixed temperature heat sink (water cooling) at outer edge of an octant, and conduction through a thick (6 oz) copper ground plane in the G10 motherboard. ΔT~1 0 C. This is fine, but it sure doesn’t work without power pulsing!!! Holding the power down while maintaining the noise/resolution is a serious engineering challenge.

28 June 2002Santa Cruz LC Retreat M. Breidenbach20 Plans We (Oregon and SLAC) plan to develop this design in more detail and build prototype wafers and chips. Test detectors in 5 Tesla field. If successful, develop board level chip. Build 1 wafer wide by about 25 X 0 deep calorimeter for test beam.