Next Generation Integrated Circuits 300 mm wafers Copper metallization Low-K dielectric under interconnect lines High-K dielectric under gate Silicon-on-insulator.

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Presentation transcript:

Next Generation Integrated Circuits 300 mm wafers Copper metallization Low-K dielectric under interconnect lines High-K dielectric under gate Silicon-on-insulator (SOI) Strained silicon New gate metals Dual-core CPU chips

Next Generation Integrated Circuits 300 mm wafers Copper metallization Low-K dielectric under interconnect lines High-K dielectric under gate Silicon-on-insulator (SOI) Strained silicon New gate metals Dual-core CPU chips

Copper Metallization – Low-K Dielectric

Next Generation Integrated Circuits 300 mm wafers Copper metallization Low-K dielectric under interconnect lines High-K dielectric under gate Silicon-on-insulator (SOI) Strained silicon New gate metals Dual-core CPU chips

High-K Gate Dielectric Reduced fringing of gate electric field – better switching control, less leakage current Reduced tunneling leakage current with thin oxides Si 3 N 4, ZrO 2, HfO 2

Next Generation Integrated Circuits 300 mm wafers Copper metallization Low-K dielectric under interconnect lines High-K dielectric under gate Silicon-on-insulator (SOI) Strained silicon New gate metals Dual-core CPU chips

Silicon-On-Insulator No p-n junction for electrical isolation Reduced inter-device coupling Reduced parasitic capacitance No deep diffusion required for isolation - less fabrication time, closer device packing

Next Generation Integrated Circuits 300 mm wafers Copper metallization Low-K dielectric under interconnect lines High-K dielectric under gate Silicon-on-insulator (SOI) Strained silicon New gate metals Dual-core CPU chips

Strained Silicon Enhanced carrier mobility – compensates for increased ionized impurity scattering in thin, heavily-doped layers

Next Generation Integrated Circuits 300 mm wafers Copper metallization Low-K dielectric under interconnect lines High-K dielectric under gate Silicon-on-insulator (SOI) Strained silicon New gate metals Dual-core CPU chips

New Generation ICs at Intel _sil+rd Main Page Reports and Publications

New Generation ICs at AMD Processor Cores Roadmap Main Page

New Generation ICs at AMD Back to Main

New Generation ICs at IBM BNanofabrication%20%2Burl.all:research.ibm.com Main Page Reports and Publications ibm.com/press/prnews.nsf/jan/0C17FDCBF4B76CE185256C6F D Nanofabrication