TMB and RAT Status Report Endcap Muon OSU April 16, 2004 Yangheng Zheng University of California, Los Angeles  TMB Status  RAT Status.

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Presentation transcript:

TMB and RAT Status Report Endcap Muon OSU April 16, 2004 Yangheng Zheng University of California, Los Angeles  TMB Status  RAT Status

04/16/2004 Endcap Muon 2 TMB2003A and RAT2003A  Replaces problematic PHOS4 fine delays with commercial DDD devices  ALCT and RPC inputs through RAT (Rpc Alct Transition) board  Rad-hard regulators used, 1.5v added for Virtex-2 core voltage  4 base boards produced and bench-tested  2 mezzanine boards with faster and larger FPGA’s (Xilinx Virtex-2 XC2V4000)

04/16/2004 Endcap Muon 3 TMB2004A and RAT2004A  Layout problems were fixed.  Power section was changed to allow Spartan-3 mezz. card upgrade (1.2v core voltage).  Firmware was re-written to get around Xilinx problem with use of global clock buffer lines for user I/O.

04/16/2004 Endcap Muon 4 TMB/RAT Original Pre-Production Planning (last Emu meeting)  January plan:  Build 27 working sets (TMB-base, TMB-mezz, RAT) by May 1:  20 for two full crates and two spares at CERN, 1 bench test setup, 1 OSU test setup, 1 Rice test setup, 2 UF Track Finder cosmic ray test stand, 1 UC FAST site, 1 additional spare  Front panels: 20 without ALCT cable access (for CERN), 7 with ALCT cable access (for debugging)  Mezzanine boards:  Cost of XC2V4000’s prohibitive, so made 10 with XC2V3000’s (temporary measure, 85% full without RPC logic).  Planned for a Spartan-3 layout (proceeding) to save ~$500K.

04/16/2004 Endcap Muon 5 TMB/RAT Pre-Production Current Status  32 TMB boards are bench-tested  Assembly house did a good job, very few errors.  As a result, testing was done ahead of schedule.  Tooling for Z-pack connector installation works well.  Virtex-2 mezzanine layout has a few bugs:  Pull-up resistors on some lines, pairs of output pads need to use same clock.  Firmware work-arounds implemented.  TMB regulators for mezzanine core voltage somewhat questionable:  Large ripple appears if mezzanine card is not plugged in.  32 RAT modules were assembled.  1 finished bench testing.  31 are in final assembly.  No problems seen thus far.

04/16/2004 Endcap Muon 6 RAT Status and Plans  ME1 case: RPC input from Link boards  Need feedback from data interchange tests with RPC Link boards (~June at CERN).  May want to move RPC connectors back a little (~1.5 cm).  Will need to decide ME1 RPC cables, routing, strain relief.  ME2, ME3, ME4 case: no RPC inputs foreseen  Current RAT boards are fine for ALCT inputs.

04/16/2004 Endcap Muon 7 TMB & RAT Planning  10 TMB2004A and 2 TMB2003A are currently useable (limited by number of mezzanine cards).  2 TMB2004A are at UF for preparing for CERN test beam.  1 TMB2004A are kept for reference and development.  7 TMB2004A + 1 TMB2003A are at OSU for full-crate test.  1 TMB2003A are at UC FAST site for development.  Next steps:  Do a full-crate test for CCB and MPC internal tests (at Rice before beam test?).  Send 4 TMB2004A to CERN for the test beam, early-to-mid May.

04/16/2004 Endcap Muon 8 Mezzanine Card Full Production  Virtex-2 versus Spartan-3:  Spartan-3 not available until 4 th quarter of  Virtex series price was reduced.  Advantages of Virtex-2 XC2V4000:  Almost twice as fast as Virtex-E  Plenty of logic cells and memory for additional firmware:  Sensible ordering of pattern qualities (a problem in test beam 2003)  RPC data handling  Enough memory cells for “deadtime-free” triggering (like ALCT)  Available now  New quote brings these within the TMB budget.  Go ahead to procure XC2V4000’s?  Slight tweak needed for Virtex-2 mezzanine layout:  I/O pads are grouped in pairs, each pair needs to use the same clock.  Will be handled by PNPI.  (Spartan-3 layout proceeding anyway, cheaper by promised factor of ~2 than Virtex-II.)

04/16/2004 Endcap Muon 9 TMB2004A Cosmic Ray Testing  UF tests early April:  Only minor software changes needed to make TMB2004A work, but…  Have to rip apart system to do timing:  CFEB_Control needed in order to have modes to do timing and debugging.  CFEB_Control was incompatible with new CCB module.  When LCTs timed in, CFEB data was out-of-time:  Still need OSU experts to finish timing-in process.  Minor: event display data unpacking “broken” by 2-word status words addition to DDU output.  Continued development going on at UF, Rice, and UCLA FAST site:  UF?  Rice?  UCLA FAST?

04/16/2004 Endcap Muon 10 Test Beam Plans from TMB/RAT Perspective  Personnel:  Yangheng Zheng has been debugging the setup at UF and UC FAST sites.  Martin von der Mey will go to CERN mid-May through June 14.  Equipment:  Bring 4 TMB 2004A, 2 RAT2004A, rear card cage, and special backplane with rear connectors.  May unstructured beam period:  Use the new CCB.  ALCT signals fed through RAT module.  Use the PCcontroller-- new software (as much as possible).  Time in the peripheral crate.  Hopefully get the entire chain working to SP output.  June 7-14 structured beam period:  Add RPC inputs to RAT module, take data.  Study ME1/1 variant.

04/16/2004 Endcap Muon 11 Beyond the Test Beam/Conclusions  TMB boards:  Would like to understand the source of regulator instability.  Otherwise, the base board is ready to go into production.  Mezzanine boards:  XC2V4000’s can be procured right away.  Slight tweaks are needed to mezzanine card layout (~1 month).  RAT modules:  Boards pass bench tests.  Would like to see them working with RPC & Link Board inputs at the test beam.  Would like to see them working with the new peripheral crate backplane (June?)  Want to understand cable installation and strain relief with full crate mock-up (where, when?)

04/16/2004 Endcap Muon 12 This note at TTC distribution to peripheral crate cards TMB-CFEB diagram TMB-ALCT diagram Details of L1A-LCT coincidences in TMB & DMB TMB clocking to MPC (CCB-TTC clocking details) CSC Peripheral Crate Timing

04/16/2004 Endcap Muon 13 2ns/bin TMB-ALCT Block Diagram AFEB data ~2.2ns/bin ALCT data ALCT latch raw data ALCT Master clock Synch. test pulse from TTC command or VME write to CCB Main FPGA OR TMB Master clock Crate Master clock CCB test pulse commands 2ns/bin Test pulse to AFEB amplifier or test strips (select via VME write to TMB to ALCT Slow Control FPGA register) TMB Latch input ALCT data ALCT Main FPGA Asynch. test pulse from VME write to CCB TMB pass- through 1.Adjust ALCTtx for optimal latching of ALCT output data at TMB ALCT section 2.Adjust ALCTrx for optimal latching TMB output data at ALCT Latch output ALCT commands ALCT commands AFEB 3.Adjust Delay ASICs for max. probability for ALCTs to come in one BX Internal test pulse via VME command to TMB CSC Test Pulse Strips ALCT -RX clock ALCT -TX clock Delay ASICs

04/16/2004 Endcap Muon 14 (external L1A = LHC & Test Beam operation modes) TMB-DMB Block Diagram DMB CFEB CLCT Final logic TMB Master Clock, L1A TTC/CCB Crate Master Clock, L1A TMB DMB Master Clock, L1A Store SCA data command AFF (Active FEB Flags) CFEBs “hit” AFF-L1A Coinc. Starts CFEB digi. & readout CLCT FIFO CLCT pre-trigger logic ALCT/ CLCT/ RPC Coincidence Comparators Output FPGA LCT-L1A Coinc. starts TMB readout CLCT Readout queue DMB-DDU readout Controller logic CFEB FIFOs (5) ALCT FIFO From ALCT readout queue SCAs, ADCs, Memories From ALCT From RPC/ RAT RPC logic L1A*CLCT DAV Coinc. L1A*ALCT DAV Coinc. LCTs to MPC 1 ns/bin ALCT-DAV CLCT-DAV CFEB -DAV CFEB Clock L1A CFEB DAV Coinc. Auto set fixed LCT -read delay RPC delay ALCT delay CLCT DAV delay ALCT DAV delay L1A delay CFEB DAV delay CFEB Clock phase Cable Equal. delay Cable Equal. delay AFF delay

04/16/2004 Endcap Muon 15 TMB 2003A Detail

04/16/2004 Endcap Muon 16 RAT2003A Detail These Connectors for GND Only RPC connectors To TMB and 3.3v, 1.8v power ALCT SCSI input connectors Spartan 2E FPGA for RPC