1. University of California, Los Angeles Endcap Muon meeting @ Purdue
TMB-RAT Status Report
CSC/ME1/1 Meeting
Oct
Yangheng Zheng
University of California, Los Angeles
Outline:
Mezzanine cards, TMBs, RATs production details
Firmware/Software updates
Endcap Muon Purdue
6-Oct-2006

2. TMB-RAT pair (version 2006)
RAT Board
Receives ALCT
And RPC data
CFEB Input Connectors
Xilinx XC2V4000
Mezzanine board
Endcap Muon Purdue
6-Oct-2006

3. Bench Testing Software
~ 15K lines of code
Mezzanine card test
Hard resets test
Connection test:
CFEB connectors on TMB
ALCT-RPC connectors on RAT
DMB, MPC, CCB and VME connections on backplane (done by loopback backplane)
TMB-RAT connections through backplane
Delay chips test
Other test (LEDs, EPROMs etc…)
Endcap Muon Purdue
6-Oct-2006

4. Mezzanine Cards Status
TMB Virtex-2 mezzanine cards:
In 2004 – 2005, 542 mezz. cards assembled.
520/542 work fine without extensive rework
22 sent out for re-balling, only 7 recovered.
New: 40 additional mezz. cards had been assembled in July, All passed the test. 
Plan: assemble 10 more mezz. cards with reballed Virtex-2 chips.
Endcap Muon Purdue
6-Oct-2006

5. Endcap Muon meeting @ Purdue
TMB Production Status
468 TMB’s in final system
plan 15% spares: 540 in total
Deliveries
520 shipped to CERN (495 tested: 3 found with problems)
10 shipped to Rice
3 shipped to Florida
In UCLA electronics lab:
2 ready for shipping
19 need to be repaired
Endcap Muon Purdue
6-Oct-2006

6. Endcap Muon meeting @ Purdue
RAT Production Status
468 RAT’s in final system
Plan 15% spare: 540 in total
Deliveries:
Currently 540 shipped to CERN (495 tested: no problems found so far)
3 shipped to Florida
In UCLA:
7 RAT boards need to be repaired
Endcap Muon Purdue
6-Oct-2006

7. TMB-RAT testing experience
TMB: ~280 boards pass the test without extensive debugging. (error rate: ~50%)
RAT: ~440 boards pass the test without extensive debugging. (error rate: ~20%)
Mezzanines: Error rate 4% (compare to ALCT mezz. boards : ~30% error rate)
Good assembly house made big difference for BGA project.
Typical errors:
soldering bridge/cold soldering (>90%)
Bad chips/components (~10%)
Mechanical errors (~1%)
Endcap Muon Purdue
6-Oct-2006

8. TMB Firmware/Software Updates
Done by Greg with the help of Martin and others at CERN
Software for programming eproms via VME controller/backplane
TMB, CCB, DMB, MPC
XML configuration for variable parameters
RAT, ALCT via TMB with JTAG
Firmware/Software update for small “Configuration” Eproms on TMB (done)
Read in after hard reset reloads the firmware.
TMB downloads its own registers using FPGA control of on-board VME circuitry.
TMB downloads ALCT registers using JTAG
Endcap Muon Purdue
6-Oct-2006

9. Firmware/Software Updates (cont.)
TMB+RAT+ALCT configuration (Greg):
All (relevant) parameters now in xml file…
Corresponding registers read from TMB, decoded into “user-friendly” format
Configuration for TMB, RAT, and ALCT now takes following path:
Parameters in xml file compared with configuration data in 2 proms on TMB
prom 0 = TMB configuration parameters
prom 1 = ALCT+RAT configuration parameters
If different, proms programmed and verified
Upon hard reset, TMB firmware loads TMB, ALCT, and RAT configuration parameters from user proms
New software/firmware are being checked on slice test ME+1a
To be implemented during MTCC phase 2
Endcap Muon Purdue
6-Oct-2006

10. Board-maintaining/repairing Crew
Engineer: Y. Shi (UCLA physics department)
Students
Special thanks to the following students who worked for the UCLA TMB-RAT project.
Daniel Maronde, Paul Cubre, Jennifer Goodman, Alfonso Vergara, Mike Lee, Aaron Senter, Donald Chang
Amber Bechtel
Rina Kakimi
Endcap Muon Purdue
6-Oct-2006