Moldex3D_TIPs_20150401 Apr, 1st, 2015 Advanced Hot Runner Setting.

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Presentation transcript:

Moldex3D_TIPs_ Apr, 1st, 2015 Advanced Hot Runner Setting

2 >All hot runner component supported –Hot Runner Metal Bushing, manifold, nozzle, valve pin… –Heating System Heating rod/coil, sensor… –Boundary Conduction Insulating air gap, heat conduction face… Main Features of Advanced Hot Runner (AHR) Module Hot runner metal Heating rod/coil Heat conduction face Valve pin design

3 Hot Runner Metal Component – Moldex3D Mesh >To attribute Hot Runner Metal component in Moldex3D-Mesh

4 Hot Runner Metal Component – Designer >To attribute Hot Runner Metal component in Designer

5 Heat Conduction Faces - Heat conduction face : Heat conduction face is the conductible interface between hot runner metal and mold base (mold insert). - Insulating air gap : The condition will be insulation without heat conduction face setting between hot runner metal and mold base (mold insert).

6 >To assign Heat Conduction Faces in Moldex3D Mesh Heat Conduction Faces – Moldex3D Mesh

7 Heat Conduction Faces – Designer >To assign Heat Conduction Faces in Designer

8 Heating System Heating Rod Sensor Each heating rod can be assigned a sensor node control in process setting Once heating rod (or cooling channel) contacts with hot runner metal, it will be considered that part of hot runner metal (within insulating air gap)

9 Computation Parameter How to activate Air Gap Boundary >In Cool computation parameter tab, enable “Apply air gap boundary condition on hot runner metal” >Default air gap boundary is ideal heat insulation

10 Heat Transfer Coefficient of Air Gap >Heat transfer coefficient of air gap can be adjusted in Filling/Packing Advanced Setting.

11 Air Gap Boundary Condition >Air gap boundary will be assigned on contact face between Hot runner metal and Mold base (Mold insert) >Once heating rod (or cooling channel) contacts with hot runner metal, it will be considered that part of hot runner metal (within insulating air gap) Conduction face Heat dissipation from conduction face Air gap B.C.

12 Appendix 1 >Relation between HTC and thickness of air gap (thickness 0.5 cm ~ 25 cm)

13 Appendix 2 >Relation between HTC and thickness of air gap (thickness 0.02 cm ~ 0.5 cm)

14