Welcome to the OAI Aerospace Instrumentation and Controls Collaboration Forum Ohio Aerospace Institute, Cedar Point Road, Cleveland, OH For The Building Blocks of Smart Sensors and other Technologies for Distributed High Temperature Intelligent Integrated Controls Networks for Aerospace Applications 25 August, 2011 Introduction Dr. Al Behbahani Air Force Research Laboratory

1:00 – 2:15 p.m. Smart sensors 15 min – Introduction --Al  Motivation for Distributed High Temperature Controls  Distributed Open Software Hierarchical Architectures for Control Systems 20 min – Developing standards for distributed engine controls – Dewey High level node architecture (functional requirements) What will the DECWG requirements document contain  20 min – Developing standards for Smart Sensors – Bhal  20 min – Discussions 2:15 – 2:30 p.m. Break Agenda

Statement of Objective The Air Force Research Laboratory has committed its resources to the development of new tools and component technologies to improve the affordability, fuel efficiency and increased power/weight of the legacy and future fleet of aircraft gas turbine engines thorough the Versatile Affordable Advanced Turbine (VAATE) initiatives. A pervasive enabler across all VAATE platforms is high temperature capable controls, sensors, and actuators which will allow for enhanced thermal management, development cost reductions, and possible fuel burn savings. The Distributed Engine Control Working Group (DECWG) has identified that a key enabler for future engine control systems is high temperature capable electronics which will allow full life operation in increasingly harsh thermal environments. This effort will develop requirements documents to be used by industry for high temperature distributed control systems (along with high temp. sensors and actuators) as well as perform proof of concept testing for State Of the Art (SOA) high temperature Silicon-On-Insulator (SOI) device packaging and development/toolkit work for compact/affordable SOI wafers. This activity serves as initial risk mitigation for demonstrating high temperature Distributed control architectures on the CAESAR engine.

 Eliminate duplication and encourage collaboration among DECWG, PIWG, ASWG, IAPG, TETWoG, small businesses, universities, and colleges for sensors, instrumentation, modeling & simulation  Summary of the DECWG, and how small business & universities can participate or contribute to overall goal and vision of the DECWG & other teams. Ideas such as SBIR benefits and contributions, consortium participation, standards, Power supplies, Process and Toolkit Development, sensors, collaborate in buying parts for the whole group at the reduced price, communication data bus, packaging, System Level / Node Level / Chip Level requirements, cost minimization ideas.  Reemphasize the vision of the DECWG to eliminate operational limitations imposed by Controls on next generation turbine engine and aerospace vehicle applications, while positively impacting system-level cost, weight, size, reliability and adaptability/reuse metrics.  The DECWG goal is to create a voluntary pre-competitive collaboration between government and aerospace industry to promote development of affordable high-temperature-capable distributed gas turbine engine controls and sensors.  Define the roll and responsibilities for the airframers to be involved in the PIWG & DECWG. Need to have an integration plan to involve them.  A true collaboration between the entire participants for a mutually beneficial for advancement of sensors, actuators, and controls. Objectives of Today’s Meeting

The Process for Distributed Controls (including Smart Sensors and Actuators) Technology Insertion Systems End-UsersProduction Research Is the central issue needs to be focused Requirements are different for Test Cell Application Vs. Flight application

Objective: Modular, Open, Distributed Engine Control

Technical Requirements for Distributed Controls, Smart Sensors and Actuators Physical Drivers for Smart Sensors / Actuators / Distributed Control System Designs Thermal Environment Externals Packaging Rapid Reconfiguration / Upgradability Generic Physical/Functional Interface Environmental Requirements Certification Impact Integration Testing Developing Standards Financial Responsibility Focus on Near-Term Applications Concentrate on commercial applications with production volumes Design for maximum leveraging though multiple applications Externals Packaging Need to integrate electronics onto or within existing hardware Minimize unique hardware Adding new/extra mounting hardware drives cost, weight in the wrong direction

Environmental Requirements Design for existing ambient temperatures and vibration environments Don’t drive cost/complexity into the DCM to withstand unrealistic margins Focus on actual engine environments, not D0160/810 generic requirements Design electronics to withstand existing hardware thermal conditions Recognize limitations of typical industry materials Aluminums (300F/149C), Elastomers (350F/177F) Certification Impact, Changes to Testing Allow certification at modular level Require system level certification using black box approach to testing Allow flexible system expansion/contraction without recert. required Integration testing System integration testing paradigms will shift System integration tasks will shift one layer down the food chain AS/OS boundaries may drive testing location, integration responsibilities Technical Requirements for Distributed Controls…(Cont.) Bhal will be talking next

Motivation / Objective Are engine control sensors and actuators keeping pace with turbine engine system needs? How Do & Why Should we take advantage of emerging electronics and smart sensors and actuator technologies, and integration technology? What are the collaboration opportunities for the turbine engine sensors and actuators community?

Supervisory FADEC DC SN DC S Implementation of Distributed Engine Controls with Smart Sensors Cross Channel Data Links (CCDL )

The Role of Data Communication and Smart Sensors and Actuators in a Distributed Engine Control A fully distributed control system. Each system element individually connects to the network. Each physical element can have multiple functions, some of which require real-time communication for control and others which may be less time critical.

Distributed Open Software (DOS) Hierarchical Architectures for Control Systems

Straw man Plans To work on High temperature Electronics to be used in the data concentrator, smart nodes, smart sensors, smart actuators, and smart pumps Each company proprietary information will be protected. Every company from US will start from the same building blocks. Will use common I/Os, data buses, and standard components / software (if possible)

Smart Sensors, Actuators, & Integration Develop the technologies to implement reliable, integrated electronics for high temperature applications. Stable, high temperature transistors Multilevel interconnect structures for complex integrated circuit development High performance packaging and interconnects for reliable, extreme environment applications Develop high temperature sensing capabilities

Need collaboration on Smart Sensors and Actuators High Temperature Electronics High Temperature Packaging Data Bus Communication Standardized Smart Sensors Standardized Smart Actuators Standardized software Standardized Power supplies Standardized chips Standardized Communication H/W Standardized testing & Evaluation Certifiable components Integration Testing Standardized Processes while keeping proprietary information and stimulating innovation and evolution in the Distributed Control

Centrally Controled FADEC Baseline centralized engine control architecture. The FADEC connects directly to each system element

IEEE 1451 Standard for a Smart Transducer Interface for Sensors and Actuators The objective of IEEE 1451 is to develop a smart transducer interface standard to make it easier for transducer manufacturers to develop smart devices and to interface those devices to networks, systems, and instruments by incorporating existing and emerging sensor and networking technologies. The standard interface consists of three parts. Smart Transducer Interface Module (STIM) – electronics to convert the native transducer signal to digital quantities. Transducer Electronic Data Sheet (TEDS) – a memory which contains transducer specific information such as; identification, calibration, correction data, measurement range, manufacture-related information, etc Network-capable application processor (NCAP) - the hardware and software that provides the communication function between the STIM and the network

IEEE 1451 The IEEE 1451 standard family defines the interfaces between various transducers and networks, including wireless