Team #55 Reflow Oven Project Manager: Patrick Selzer (ME) Team Members: Michael Ladd (ME), Patrick Mooney (EE), Corey Seidel (EE)
Executive Summary Problem Statement Small scale solder ovens sacrifice quality and precision for cost.
Executive Summary Deliverables
Executive Summary Team Responsibilities Control System (CS) User Interface (PM) Heating System (PS/ML) Cooling System (PS/ML)
Executive Summary Resources $ Oven by Mar. 14 th Profiles and Testing Data by Apr. 28th
Market Outlook Professional Models Expensive Precise performance data Accurate temperature control Higher reliability Faster cycle times ModelCostCycle TimeUser InterfaceControl UnitSolder Area Heating Element T962A$ min B/W with function buttons Micro-processor300 x320 mmInfrared T962$ min LCD display with function buttons Micro-processor (Self- Contained) 180 x 235 mmInfrared T962C$ min LCD display with function buttons Micro-processor (Self- Contained) 400 x 600 mmInfrared AS-5060$850.00N/A B/W with function buttons Micro-processor460 x 275 mmInfrared 2011 D.A$ min B/W with function buttons Control Unit with EPROM 400 x 350 mmConvection BT300CP$ min B/W with function buttons PID control230 x 370 mmConvection 850$ min B/W with function buttons PID control340 x 430 mmConvection GF-B-HT$ min B/W with function buttons Micro-processor305 x305 mmConvection GF-C^2-HT$ minComputer out Outside Computer 305 x 305 mmConvection HHL3000$ minB/W with function buttons Micro-processor360 x 385 mmConvection
Market Outlook Do-It-Yourself (DIY) Ovens Cheap No performance data Untested reliability Higher cycle times Build After Oven Cost ($) AutomaticControl Temperature Uniformity Ease of Use Ease of Build Spectrum154.00YesGoodFairGoodFair Freetronics70.00NoPoor Very Good Instructables120.00YesGoodPoorGoodFair Die4laser148.00YesGoodPoorGood Mad-science85.00YesFairPoorGoodVery Good
Market Outlook Target Markets Small Business Reliable High Performance Tighter constraints Low cost Lower cycle times Home Hobbyist Versatile Ease of use Low cost
Specifications User Interface <$50 CPU Digital Display Profile Library Control System 2% overshoot Thermal Profile Base profile of low ramp-up rate, low peak, high ramp-down rate Calibrated with respect to solder, flux, oven
Block Diagram
Temperature Profiles Profile Types Ramp to Spike Ramp, Soak, Spike Low Void Profile Eliminating Defects Heating Rate 3°C/s Cooling Rate of -4°C/s Time above liquidus sec
Heating and Cooling Systems Resistive heating element Max oven temperature of 300°C Internal Convection Fan 79 ft 3 /min 120 mm Aluminum External Vents Solenoid controlled In-line with convection fan.
Control System Arduino Temperature= User Input – Actual Temperature Applies corrections to within 2% Output pulse width modulated signal MOSFET bridge Act as solid state relay High-current switching operation Expandability Modular to accommodate future expansion
User Interface Arduino TFT digital display Standard 4 buttons Arrange buttons to proximity of text Up to 12 buttons available Stop button integrated
Action Item List (AIL) ActivityPersonAssignedDue Acquire OvenML1/131/20 Stock-oven ExperimentsAll1/202/3 Install vent and fanPS/ML1/272/10 Implement ControlCS2/102/24 Install User InterfacePM2/103/3 Synchronize subsystemsALL2/173/10 FEA heat flux analysisML/PS2/243/17 Solder TestingAll3/103/31 Compile Temp. ProfilesAll3/174/28 Perfect DeviceAll3/314/28 Document DesignAll4/75/5
Resources PartItemQuantityPriceCostTotal 1Black and Decker Toaster Oven1$ Arduino Duo1$43.00 $ Arduino TFT1$26.00 $ Solenoid2$7.00$14.00$ Computer Fan1$8.00 $ Wire-On Hand $ Buttons-On Hand $ Solder-On Hand $ Thermistor10$1.00$10.00$ Super Glue1$2.00 $ Metal Sheeting-On Hand 12Arduino Software On Hand 13Contingency1$57.00 $ Total:$200.00
Conclusion Modify Standard Convection Oven Arduino Board External Vents Internal Fan User Interface Objectives Reach 300°C Heating Rate 3°C/s Cooling Rate of -4°C/s Questions?