Interconnect Terminal Naming Walter Katz Signal Integrity Software, Inc. IBIS ATM January 9, 2015.

Slides:



Advertisements
Similar presentations
10 Ways to Ruin Your Mini-Max microcontroller (and lose $69)
Advertisements

I N V E N T I V EI N V E N T I V E Model Connection Protocol extensions for Mixed Signal SiP Version 0.1 T. Kukal 22 nd Sep, 2010.
Package Die Ports Walter Katz IBIS Interconnect 10/31/12.
Package EBD/EMD Walter Katz IBIS Interconnect 11/13/12.
Package and On-Die Interconnect Decisions Made and Proposed Solutions Walter Katz IBIS ATM December 3, 2013.
Terminal Draft 2 Walter Katz Signal Integrity Software, Inc. IBIS Interconnect July 9, 2014.
Tx_Init_Optimizes Walter Katz Signal Integrity Software, Inc. IBIS-ATM April 1, 2014.
IBIS-ISS Package Status Walter Katz IBIS ATM December 17, 2014.
IBIS Interconnect Decision Time Walter Katz IBIS Interconnect 6/19/13.
VLSI Digital System Design
CMOS Invertors Lecture #3. Step 1: Select Foundary.
IBIS Interconnect BIRD Draft 3 Walter Katz Signal Integrity Software, Inc. IBIS Summit, DesignCon Santa Clara, CA January 30, 2015.
DDR MEMORY  NEW TCEHNOLOGY  BANDWIDTH  SREVERS, WORKSTATION  NEXT GENERATION OF SDRAM.
01/30/04 *Other brands and names are the property of their respective owners Page 1 Futures Subcommittee Proposed “New” Futures Subcommittee To create,
ESD for the Fabless Semiconductor Company Golden Rules of ESD Due Diligence for Third Party Intellectual Property Golden Rules of ESD Due Diligence for.
Signal Integrity Software, Inc.Electronic Module Description© SiSoft, 2008 Electrical Module Description EMD A new approach to describing packages and.
Toshiba Standard Cell Architecture for High Frequency Operation Peter Hsu, Ph.D. Chief Architect Microprocessor Development Toshiba America Electronics.
Interconnect Modeling Status Draft 1 Walter Katz … IBIS Summit, DesignCon January 31, 2013.
IBIS-ISS Package Proposal Status Walter Katz IBIS ATM January 7, 2014.
Modern VLSI Design 4e: Chapter 4 Copyright  2008 Wayne Wolf Topics n Standard cell-based layout. n Channel routing. n Simulation.
© 2007 Cisco Systems, Inc. All rights reserved. 1 IBIS Quality Review A status review of the IBIS Quality specification Mike LaBonte, Cisco Systems.
Updated Interconnect Proposal Bob Ross, Teraspeed Labs EPEPS 2015 IBIS Summit San Jose, CA, October 28, 2015 Updated Interconnect.
16- Agenda S-Parameters and Linear Analysis 4 Transmission Lines and Field Solver 5 IBIS 6 DAY 2 Synopsys 60-I-032-BSG-005 © 2007 Synopsys, Inc. All Rights.
3. Logic Gate 3.1 Introduction static, fully complementary CMOS psudo-nMOS, domino logic 3.2 Combinational Logic Functions combinational logic ---- specification.
1 General Purpose and Alternate Function I/O (GPIO and AFIO)
Package Modeling Status Walter Katz IBIS Open Forum December 6, 2013.
Backchannel Issues Walter Katz Signal Integrity Software, Inc. IBIS-ATM April 8, 2014.
Updated Interconnect Proposal Bob Ross, Teraspeed Labs Draft Presented September 23, 2015 at the Interconnect Working Group Copyright.
A Tour of the IBIS Quality Specification DesignCon East IBIS Summit April 5, 2004 Robert Haller Signal Integrity Software, Inc. 6 Clock.
1 IBIS 4.1 Macromodel Library for Simulator-independent models DesignCon East 2005 Current Status - IBIS 4.1 Macro Library for Simulator Independent Modeling.
Signal Integrity Software, Inc.Electronic Module Description© SiSoft, 2008 Electrical Module Description EMD A new approach to describing packages and.
Fixing GND in IBIS Walter Katz SiSoft IBIS-Packaging May
Company Confidential | ©2009 Micron Technology, Inc. | 1 Micron Contact: Tim Hollis February 16 University of Utah Senior.
EMD Overview Walter Katz IBIS Open Forum March 15, 2013.
pictures_slideshow/article.htm.
Updated Interconnect Proposal Bob Ross, Teraspeed Labs EPEPS 2015 IBIS Summit San Jose, CA, October 28, 2015 Updated Interconnect.
Pin Mapping Key Concepts From IBIS 6.0… “The [Pin Mapping] keyword names the connections between POWER and/or GND pins and buffer and/or terminator voltage.
IBIS & ICM Interfacing: Simple Link Michael Mirmak September 21, 2005.
1 ECE2030 Introduction to Computer Engineering Lecture 4: CMOS Network Prof. Hsien-Hsin Sean Lee School of ECE Georgia Institute of Technology.
Interconnect Terminal Mapping Figures 30 Sep
Engineering Test Coverage on Complex Sockets Myron Schneider.

Fixing [Pin Mapping] Walter Katz Signal Integrity Software, Inc. IBIS Summit, DesignCon Santa Clara, CA January 22, 2016.
References in IBIS Bob Ross, Teraspeed Labs IBIS ATM Meeting January 12, 2016 Copyright 2016 Teraspeed Labs 1.
Building controller with joystick and buttons. put joystick together (keep things in order below)
Simulation [Model]s in IBIS Bob Ross, Teraspeed Labs Future Editorial Meeting April 22, 2016 Copyright 2016 Teraspeed Labs 1.
HCS12 Technical Training Module 6 – Port Integration, Slide 1 MOTOROLA and the Stylized M Logo are registered in the US Patent & Trademark Office. All.
[Die Supply Pads] Walter Katz Signal Integrity Software, Inc. IBIS Interconnect January 6, 2016.
IBIS Interconnect BIRD Draft 0 Walter Katz Signal Integrity Software, Inc. IBIS Summit, DesignCon January 27, 2015.
[Pulldown Reference] [GND Clamp Reference] Offset in [Pulldown] [Ground Clamp] Walter Katz IBIS GND Editorial March 4, 2016.
BUS 437 Week 1 DQ 2 Using Outside Help to Write the Plan (Ash) Using Outside Help to Write the Plan. Respond to the following: What are the benefits and.
Piero Belforte, HDT 1998: Advanced Simulation and Modeling for Electronic System Hardware Design Part2 .
IBIS 6.2 Editorial Resolutions
Topics Subsystem design principles. Pipelining. Datapath.
Library Characterization
ESD Test Methodology Vdd Vss +V / - V I/O.
BIRD Terminology Issues Bob Ross
A High-Speed and High-Capacity Single-Chip Copper Crossbar
Walter Katz IBIS-ATM December 8, 2015
IBIS Interconnect Task Group December 15, 2015
بسم الله الرحمن الرحيم الموضوع:الوضوء صفته وفرائضه وسننه
DUT vs DIA Device Under Test vs Device In Action
New IBIS Cookbook 1.0 Introduction 2.0 Pre-Modeling Steps
COPING WITH INTERCONNECT
Pin Reference Concerns Bob Ross, Teraspeed Labs
Reduced Pin Count (RPCTM) DRAM Etron Technology Inc
Ground Recommendations Review of Recent Discussion
IBIS 6.2 Editorial Resolutions
Walter Katz Signal Integrity Software, Inc. September 10, 2019
IBIS Interconnect Task Group August 23, 2017
Presentation transcript:

Interconnect Terminal Naming Walter Katz Signal Integrity Software, Inc. IBIS ATM January 9, 2015

Package Terminals Post Layout A_puref A1 Pullup Pulldown Power Clamp Ground Clamp C_comp Model A_pcref A1 A_gcref A1 A_pdref A1 A_signal A1 Combined Package and On-Die Model Pin_A_Signal A1 Pin_Signal_Name VSSQ Pin_Signal_Name VSS Pin_A_Signal B3 Pin_A_Signal B4

Package Terminals Pre Layout Pullup Pulldown Power Clamp Ground Clamp C_comp Model A_signal DQ Pin_A_Signal A1 Pin_Signal_Name VSSQ Pin_Signal_Name VSS Pin_Signal_Name VDD Pin_Signal_Name VDDQ A_Signal_name VDD A_Signal_name VDDQ A_Signal_name VSSQ A_Signal_name VSS Combined Package and On-Die Model

Package Terminals Post Layout A_puref A1 Pullup Pulldown Power Clamp Ground Clamp C_comp Model On-Die Model A_pcref A1 A_gcref A1 A_pdref A1 A_signal A1 Package Model Pin_A_Signal VDD_pad Pin_A_Signal VDDQ_pad Pad_A_Signal A1 Pad_Signal_Name VSSQ Pad_Signal_Name VSS Pin_A_Signal A1 Pin_Signal_Name VSSQ Pin_Signal_Name VSS Pin_A_Signal B3 Pin_A_Signal B4

Package Terminals Pre Layout Pullup Pulldown Power Clamp Ground Clamp C_comp Model On-Die Model A_signal DQ Package Model Pad_Signal_Name VDD Pad_Signal_Name VDDQ Pad_A_Signal A1 Pad_Signal_Name VSSQ Pad_Signal_Name VSS Pin_A_Signal A1 Pin_Signal_Name VSSQ Pin_Signal_Name VSS Pin_Signal_Name VDD Pin_Signal_Name VDDQ A_Signal_name VDD A_Signal_name VDDQ A_Signal_name VSSQ A_Signal_name VSS