Dry Etch and Thin films & Process Integration August 26, 2014 NNfC monthly admin committee meeting.

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Presentation transcript:

Dry Etch and Thin films & Process Integration August 26, 2014 NNfC monthly admin committee meeting

Tool issues 2 eBeam deposition:  Down time due to e-gun arching and single operational gun. Two new electron guns installed on August 13 th.  Most commonly used materials qualified on 15cc crucibles to more efficiently use target. Previously all depositions, including Gold was being done on 25cc crucibles. Sputter tools:  Sputter2 down for mid-July to early August due to WindowsXP boot-up and PC system. Issue resolved with help from Smart Systems.  New deposition requests denied:  Special targets such as TaN and TiW not available.  Thick Al2O3 (100nm) requiring long deposition times.

Tool issues 3 DRIE:  SPTS local support has been discontinued, causing longer down times and slow recovery.  System not fully operational after conversion to 4-inch chuck.  System is now working with limited capability –  only HF bias (13.56MHz) recipes qualified.  Seeing excessive polymer deposition on LF (350KHz) bias recipes.  Troubleshooting on-going with phone and support from Singapore.  Need to accelerate PM schedule – parts being ordered for first major PM in two years … Target Nov ‘14.

PECVD DRIE Anelva Sputter

Unit process development started in Aug. –Key challenges in eChannel RIE, Au-seed layer, gold plating, wafer bonding and dicing. Prasiddhi mask ordered to start structural learning. MTRDC project progress 6Sadanand Deshpande, NNFC