Power Trench® Dual CoolTM

Power Trench® Dual CoolTM Features Top Side Cooling – Lower thermal resistance from the top of package Same land pattern as 5x6 and 3x3 PQFN – JEDEC standard Allows higher current and power dissipation Benefits Highest power density for DC-DC applications Can be used with or without a heatsink, reducing the number of qualified components in the AVL Multiple suppliers without cross licensing requirements High degree of production commonality with standard PQFN packaging – low risk Applications DC-DC synchronous buck conversion Desktop, Notebook, and Server Telecommunications, routing, and switching

Where Do We Target Dual CoolTM Any application that utilizes heatsinks, heatpipes, or any other form of top-side cooling method. Any application where DirectFET (CanPak) type MOSFET packaging is present Any other thermally and space constrained application

Power Trench® Dual CoolTM Heat sink Copper slug Junction (Die) QJC-S = 3.7ºC/W Clip (source) Leadframe (source) QJC-D= 3.0ºC/W Leadframe (drain) PCB

Power Trench® Dual CoolTM Direction of heat flow indicated by red arrows Heat sink Copper slug Junction (Die) Clip (source) Leadframe (source) Leadframe (drain) PCB

Power Trench® Dual CoolTM Internal Construction

Power Trench® Dual CoolTM Portfolio as of 10/6/2010

Power Trench® Dual CoolTM Temperature HS 7mΩ 3.3x3.3mm2 Dual CoolTM 1.2mΩ LS 2.4mΩ 5x6mm2 Dual CoolTM Conditions: 12V IN, 1V OUT, Fswitch =~280KHz, Lout = 0.36uH, Mode = 2Phase CCM Controller: ISL6262A, Ambient Temperature

Power Trench® Dual CoolTM Temperature IRF7610S + IRF7695M 75ºC @ 25A IRF7610S + IRF7695M 58ºC @ 20A S 7.2mΩ M 2.4mΩ Component Area:49mm2 FDMC3020DC+ FDMC2512SDC 58ºC @ 20A FDMC3020DC+ FDMC2512SDC 75ºC @ 25A Dual CoolTM 3x3 7.2mΩ Dual CoolTM 3x3 2.4mΩ Component Area:21.5mm2 Conditions: 12V IN, 1V OUT, Fswitch =~280KHz, Lout = 0.36uH, Mode = 1Phase CCM, Controller: ISL6262A.

Why is Dual CoolTM Power Density Leader? Power Trench® Dual CoolTM Competitor: IR Why is Dual CoolTM Power Density Leader? Solderable Area Bottom Side of Package Board Solderable Component Area % Difference Solderable Area Total Component Area (max) Power33 4.54mm2 The new standard 11.56mm2 IRF6710 3.04mm2 >33% Less! 19.16mm2

Evaluation Board Support Three Evaluation Boards on Sales Center: HS: 5x6 LS: 5x6 HS: 3x3 LS: 5x6 HS: 3x3 LS: 3x3

www.fairchildsemi.com/dualcool

Additional Resources for Dual CoolTM Sales Center (to become available at time of launch) Left Navigate to: Market Solutions –> Computing –> Dual Cool Product overview Application note Evaluation Boards Customer Presentation Podcast External web page (to become available at time of launch) www.fairchildsemi.com/dualcool General overview Complete list of available resources Application Note (Dennis Lang Video (Dennis Lang) White Paper (Art Black) Other Press release in WW43 White papers (in Q1’11) Preliminary Datasheets (Contact Tomas Moreno)

Power Trench® Discrete PQFN Portfolio

Power Trench® PQFN Discrete Power33 Portfolio as of 10/6/2010 High Efficiency MOSFETs for POL and Multi-phase Applications

Power Trench® PQFN Discrete Power56 Portfolio as of 10/6/2010 High Efficiency MOSFETs for POL and Multi-phase Applications

Q & A