1. Power Trench® MOSFETs in Dual CoolTM Package Internal Webcast
Tomas Moreno
Product Marketing Manager
Computing LVCCC
June 22nd, 2010

2. Housekeeping Mute your phone please
We will begin 5 minutes past the hour
Questions:
Chat Message through ATT Webcast interface
We will answers chat questions at the end of every slide

3. Agenda Introduction Fairchild's Current Portfolio
Market Trends
Dual CoolTM
Fairchild's Current Portfolio
Key Features and Benefits
Performance
Competitive Landscape
Competitive Analysis and Benchmarking
Why Dual CoolTM
Tools and Resources Available
Questions and Answers

4. Industry Trends Increased Focus on Power Density
Customers looking for ways to reduce board space and increase power density through better cooling techniques and technology integration.
Customers looking for ways to improve system efficiency at light, medium and heavy loads.
Increased Focus on Power Density
Blade and Rack Servers and Smaller Desktop PCs
Increasing proportion computing systems
DC-DC converter applications requiring higher power density [small form factor].
Increased Focus on Efficiency
Energy Star Initiative by the Environmental Protection Agency (EPA)
Extended battery life requirements
Reduction of Electricity Expenses in Servers by IT Departments

5. Applications with Thermal and Space Constraints Requiring Top Side Cooling
Power Supplies
VRM Modules
Gaming
Servers and Computing
Class-D Audio

6. Low Voltage CCI and Computing Package Transitions
Dual CoolTM 56
Dual CoolTM 33
5mm x 6mm
3.3mm x 3.3mm
Power 33
PowerStage33/34
Thermal Enhancement
PowerStage56
Power 56
3mm x 3mm x 0.8mm
3mm x 3mm
3mm x 4.5mm
5mm x 6mm
5mm x 6mm
SO-8
5mm x 6mm x 1.75mm
SuperSOT™-6
3.0m x 3.0mm
~30mm2
~9mm2
Smaller Footprint

7. Power Trench® Dual CoolTM
Features
Top Side Cooling – Lower thermal resistance from the top of package
Same land pattern as 5x6 and 3x3 PQFN – JEDEC standard
Allows higher current and power dissipation: Replace 5x6 with 3x3 or replace two 5x6 with one!
Benefits
Highest power density for DC-DC applications
Can be used with or without a heatsink, reducing the number of qualified components in the AVL
Multiple suppliers without cross licensing requirements
High degree of production commonality with standard PQFN packaging – low risk
Applications
DC-DC synchronous buck conversion
Desktop, Notebook, and Server
Telecommunications, routing, and switching

8. Power Trench® Dual CoolTM
Heat sink
Copper slug
Junction (Die)
QJC-S = 3.7ºC/W
Clip (source)
Leadframe (source)
QJC-D= 3.0ºC/W
Leadframe (drain)
PCB

9. Power Trench® Dual CoolTM
Direction of heat flow indicated by red arrows
Heat sink
Copper slug
Junction (Die)
Clip (source)
Leadframe (source)
Leadframe (drain)
PCB

10. Why Fairchild has the Highest Power Density
FCS 6/10
We have the smallest 30V-25V die
in the industry!
FCS 12/08
Enabling our customers to reduce board
space, system cost and overall form factor.
FCS charge balance device delivers the same
Advantage from 25V to 150V.

11. “Industry Leading Silicon Now Coupled with Industry Leading Thermal Performance Packaging”

12. Agenda Introduction Fairchild's Current Portfolio
Market Trends
Dual CoolTM
Fairchild's Current Portfolio
Key Features and Benefits
Performance
Competitive Landscape
Competitive Analysis and Benchmarking
Why Dual CoolTM
Tools and Resources Available
Questions and Answers

13. Power Trench® Dual CoolTM
Portfolio Today

14. Power Trench® Dual CoolTM
Mid Voltage Roadmap
Amps
RDS-on (m Ohm) nC
Part Number
Vds Id
10V 6V Qg
Qgd
FDMS86200DC
150V
TBD
16.5 20 33
7.7
FDMS86101DC
100V
7.5 13 39
10.8
FDMS86300DC
80V 24 3
7.2 46 17
FDMS86500DC
60V 32
1.9 67 19
Sampling and Code S dates being worked on

15. Power Trench® Dual CoolTM
* Minimum Copper Pad, Large Heatsink
Up to 57% more power dissipation capability

16. Power Trench® Dual CoolTM
Benchmark Boards
Dual Cool 33HS
Dual Cool 33LS
Dual Cool 33HS
Dual Cool 56LS
Heatsink.
Berquist Gap pad 2000, 15 mil
Thermocouple via from the bottom

17. Power Trench® Dual CoolTM

18. Power Trench® Dual CoolTM
Temperature HS
7mΩ
3.3x3.3mm2 Dual CoolTM
FDMC3020DC
1.2mΩ LS
2.4mΩ
5x6mm2
Dual CoolTM
FDMS2502SDC
Conditions:
12V IN, 1V OUT,
Fswitch =~280KHz,
Lout = 0.36uH,
Mode = 2Phase CCM
Controller: ISL6262A,
Ambient Temperature

19. Power Trench® Dual CoolTM
Temperature HS
7mΩ
3.3x3.3mm2 Dual CoolTM
FDMC3020DC LS
2.4mΩ
3.3x3.3mm2
Dual CoolTM
FDMC2512SDC
Conditions:
12V IN, 1V OUT,
Fswitch =~280KHz,
Lout = 0.36uH,
Mode = 2Phase CCM
Controller: ISL6262A,
Ambient Temperature

20. Agenda Introduction Fairchild's Current Portfolio
Market Trends
Dual CoolTM
Fairchild's Current Portfolio
Key Features and Benefits
Performance
Competitive Landscape
Competitive Analysis and Benchmarking
Why Dual CoolTM
Tools and Resources Available
Questions and Answers

21. Summary of Fairchild vs. Competition
Top Side Cooling Family
Dual CoolTM
Polar Pak
DirectFETTM
Dualcool
CanPAKTM
Release to Market
Yes
Portfolio Size 12 23 48 5
Approximate Form Factors
Dual CoolTM33 (3.3x3.3mm2),
Dual CoolTM56 (5x6mm2)
5x6mm2
L (7x9mm2),
M (5x6mm2),
S (3.8x4.8mm2)
Product Breakdown
3x3 (5), 5x6 (7)
5x6 (23)
L (5), M (28),
S (15)
5x6 (5)
M (7), S (5)
Schottky Body Diode (SyncFETTM) on Synchronous FETs 8 1 6
Common Footprint with PQFN (AKA PowerPak, PowerXX, SuperS08, etc) No
Lowest in 5x6mm2
0.99mΩ
1.2mΩ
1.3mΩ
1.7mΩ

22. Power Trench® Dual CoolTM
Competitor: IR
QJA (ºC/W)
Max Power in Typical Application (50ºC temp rise)
Power Density
mW/(mm2)
Dual CoolTM 33
(Min Pad no Heat Sink) 80
0.63W 50
DirectFET Small Can 94
0.53W 20
(Min Pad with Heat Sink)
20.7
2.42W
210
18.4
2.72W
140

23. Why is Dual CoolTM Power Density Leader?
Power Trench® Dual CoolTM
Competitor: IR
Why is Dual CoolTM Power Density Leader?
Board Solderable Component Area
% Difference
Solderable Area
Total Component Area (max)
Power33
4.54mm2
The new standard
11.56mm2
IRF6710
3.04mm2
>33% Less!
19.16mm2

24. Power Trench® Dual CoolTM
Competitor: IR
Key HS loss factors are Qg, Qgd, Ciss and Rdson_4.5V.
FSC part better on all key metrics.
Key LS loss factors are Rdson_4.5V, Coss, and Qrr.
FSC part equivalent or better on all key metrics.
FSC total solution component area is smaller.

25. Power Trench® Dual CoolTM
Benchmark Boards
Dual Cool 33HS
Dual Cool 33LS
SQ HS
M1LS
S1 HS
SQ LS
S1 HS
M1 LS
Thermocouple via from the bottom
Dual Cool 33HS
Dual Cool 56LS
5 internal evaluation boards built and tested
Heatsink.
Berquist Gap pad 2000, 15 mil

26. Power Trench® Dual CoolTM
Competitor: IR
Temperature
Dual CoolTM33 HS and LS vs Direct FET Small can HS + Medium Can LS
IRF7610S + IRF7695M 25A
FDMC3020DC+ FDMC2512SDC
25A
Fairchild Solution delivers the same temperature but in a much smaller footprint.
FDMC3020DC+ FDMC2512SDC
20A
IRF7610S + IRF7695M 20A
Conditions: 12V IN, 1V OUT, Fswitch =~280KHz, Lout = 0.36uH, Mode = 1Phase CCM, Controller: ISL6262A.

27. Power Trench® Dual CoolTM
Competitor: IR
Efficiency
Conditions: 12V IN, 1V OUT, Fswitch =~280KHz, Lout = 0.36uH, Mode = 1-Phase CCM Controller: ISL6262A.

28. Power Trench® Dual CoolTM
Competitor: IR
25A Control and Synchronous Solutions
30A Control and Synchronous Solutions S
7.2mΩ M
Dual CoolTM 3x3
7.2mΩ
Dual CoolTM 3x3
7.2mΩ M
2.4mΩ M
Dual CoolTM 5x6
1.2mΩ
Dual CoolTM 3x3
2.4mΩ
Component Area:49mm2
Component Area:21.5mm2
Component Area:62mm2
Component Area:41mm2

29. Dual CoolTM Competitive Landscape
Suppliers Offering 3.3x3.3mm2 Top-Side Cooling Solutions or Smaller*
Key Suppliers Offering Top Side Cooling Solutions
Suppliers Offering PQFN - 3x3mm2 and 5x6mm2
* As of June 2010

30. Dual CoolTM Standard Footprint
PolarPak
DirectFET
Standard Footprint (JEDEC)
YES NO
Ease of Placement and Routing
Common footprint as Standard PQFN and MLP
Suppliers
Fairchild, TI
ST, Vishay
IR, Infineon

31. Power Trench® Dual CoolTM Competitor: Texas Instruments - Ciclon
Fairchild’s advantage over TI’s Dual Cool is our Power Trench® Silicon.
Advantages and features of our Silicon over TI are:
Smallest Silicon (lowest RSP)  Yields lower RDSON and higher power density
Lower Output Capacitance  Delivers higher peak and light load efficiency
Monolithic Schottky body diode  Lowers reverse recovery losses – higher efficiency
Shielded gate technology  attenuates switchnode ringing
Lower Qrr  Increases overall efficiency

32. Power Trench® Dual CoolTM Competitor: Texas Instruments - Ciclon
50% Lower Output Capacitance  Delivers higher peak and light load efficiency
Lower Qrr  Increases overall efficiency
Qrr Loss:

33. Power Trench® Dual CoolTM Competitor: Texas Instruments - Ciclon
PowerTrench® Shielded gate technology  attenuates switchnode ringing
Smallest Silicon (lowest RSP)
Lowest RDSON 3x3 PQFN at TI is CSD16323Q3  5.5mΩ 4.5VGS
Fairchild PowerTrench® Shielded-Gate
Lowest RDSON 3x3 PQFN at Fairchild is FDMC2512SDC and FDMC7570S  2.9mΩ 4.5VGS
TI – Ciclon
Lateral Process

34. Agenda Introduction Fairchild's Current Portfolio
Market Trends
Dual CoolTM
Fairchild's Current Portfolio
Key Features and Benefits
Performance
Competitive Landscape
Competitive Analysis and Benchmarking
Why Dual CoolTM
Tools and Resources Available
Questions and Answers

35. Tools and Resources Evaluation boards: Available WW29 Website :
Going live in WW30:
Application Note
White paper
Datasheets and availability
Press Release and Podcasts
Product Line Contacts:
Computing Applications:
Tomas Moreno
Starry Tsai
Naveed Ahmad
Jerry.C.Chen – Asia Pacific
Consumer, Comms, Industrial Applications
Mike Speed
Internal Computing LV CCC Google Site:

36. Agenda Introduction Fairchild's Current Portfolio
Market Trends
Dual CoolTM
Fairchild's Current Portfolio
Key Features and Benefits
Performance
Competitive Landscape
Competitive Analysis and Benchmarking
Why Dual CoolTM
Tools and Resources Available
Questions and Answers