Impact of the Öko-Institut Recommendations on an Avionics OEM :

Slides:



Advertisements
Similar presentations
U Development of Reliability Program Standard GEIA-STD-0009 SE Summit March 2009 Approved for Public Release; Distribution is unlimited.
Advertisements

ASPRS 2005 Annual Conference, Baltimore, Maryland Camera Calibration, Characterization and Contracting Guidelines: An Quality Assurance Perspective U.S.
Aviation Safety ProgramSingle Aircraft Accident Prevention April NCC-1-377, Honeywell Tucson Design, Implementation, and Verification of Fault-Tolerant.
DoD Standardization Conference Lansdowne, Virginia “Aerospace Qualified Electronic Components” Joe Chapman Defense Standardization Program
The Impact of Lead-free Soldering Processes on Defense Industry Electronic Assembly Practices Dave Hillman Rockwell Collins SMTA Huntsville Chapter 2011.
ARINC Overview Alliance Baltimore November 16, 2007.
OPEN _ESCO Conference - Supply Chain Counterfeit Avoidance.ppt ESCO 6 th Anti Counterfeiting Forum London, Thursday 19 th February 2015 Avoidance.
CENTRAL CONTRACTOR REGISTRATION (CAGE CODES) DFARS Case 2003-D040 DFARS Parts 204, 212, 213 and 252 are amended to remove policy on Central Contractor.
Briefing for the Department of Defense EU REACH: Registration, Evaluation, Authorization and Restriction of Chemicals July 16, 2008.
SAE AS9100 Quality Systems - Aerospace Model for Quality Assurance
1 Highly Accelerated Life Test (HALT) Wayne Bradley 8 April 2014.
PURPOSE OF DFMEA (DESIGN FAILURE MODE EFFECTS ANALYSIS)
Dubai Government Policies for Enhancing the Competitiveness of Multimodal Transportation and Logistics Cluster June 2014.
Department of Defense Briefing on Impacts of the EU REACH Legislation July 16, 2008 Tony Hilvers, Vice President Sahar Osman-Sypher, Project Manager IPC.
A Commercial Airplane Manufacturers View
Copyright Reserved Roadmap and Control for the Implementation of the European RoHS Directive NeoPhotonics Corporation Revision, December 2008.
LEAD-FREE SOLDER (Continuation of an FY08 Task) Description:FY09 Plans: -Reliability data on lead-free solder applications for various part lead finishes.
EOT_PW_no-icon.ppt | 6/7/2006 | 1 Lead-free Electronics in Aerospace Systems Parts Standardization and Management Committee November Boeing Phantom.
2005 Europe/US International Aviation Safety Conference, Cologne 7-9 June The Europe-US International Aviation Safety Conference 2005 ‘ Aviation Safety.
Rockwell Collins: WEEE, RoHS and Pbfree Soldering Processes! David Hillman Advanced Process Engineering May 2006.
AVS Repair, Alteration and Fabrication Team (RAFT) Results
QUALITY MANAGEMENT SYSTEM ACCORDING TO ISO
Global Standards for a Global Industry ANSI/SAC Symposium May 30, 2007 Laura E. Hitchcock Standards Strategy and Policy The Boeing Company Chair, The Strategic.
1 Rockwell Collins Environmental Stewardship In the Value Chain National Environmental Partnership Summit 2006 May 10, 2006 Atlanta, Georgia Vicki Fisher.
Pb-Free Electronics Risk Management (PERM). What PERM is: A Consortium sponsored by the Aerospace Industries Association (AIA) Includes industry and government.
Logistics McGraw-Hill/Irwin
Page 1/18 October 15, 2004Beijing General Assembly Forum IAQG Expectations Kinsuke Hara Director - Quality Mitsubishi Heavy Industries, Ltd Nagoya Aerospace.
Copyright© Underwriters Laboratories Inc. All rights reserved. No portion of this material may be reprinted in any form without the express written.
EOTC aisbl Rue de Stassart, 36 B-1050 Brussels Belgium Tel Fax EOTC2003© - #1.
API 18LCM (Life Cycle Management) Report back to SC17 August 27, 2015 Review Team: Dave Wilkinson, John Strut, Smarty John, David Saul, Peter Moles.
Conference on Quality in Space & Defense Industries CQSDI ‘08 Probabilistic Technology Panel: What Is Probabilistic Technology? Mohammad Khalessi, Ph.D.
1 EU Directives and Their Impact on the Aerospace Industry DSPO Conference March 5, 2008 Rusty Rentsch, Aerospace Industries Association Director, Life.
1 Lead-free/RoHS Compliance Roadmap customer version, April 04.
Standards for the Global Enterprise Presentation by Laura E. Hitchcock External Standards Management The Boeing Company ANSI Annual Conference October.
© 2016 Rockwell Collins. All rights reserved. Rockwell Collins Wellness Overview.
Technical External Management Requirements Technology Complexity Interfaces Reliability / Performance Quality Planning Controlling Funding / Resources.
Update on Pb-free Electronics in Military Systems David Locker.
Rockwell Collins, Cedar Rapids, IA
Pb-free Electronics Risk Management (PERM) Council
On-Site Services Driving Flexibility and Responsiveness for our Customers with a highly skilled and experienced team Test Engineering Quality Engineering.
Pb-free Electronics Risk Management (PERM) Council
Analysis of Current Maturity Models and Standards
Federal Reserve Bank of Cleveland
Department of Defense Briefing on Impacts of the EU REACH Legislation
Jason Keeping, Celestica Dave Hillman Rockwell Collins ISCR 2016
Schlenker, H. , R. Kluge, and J. Koehl
Pb-free Electronics Risk Management (PERM) Council
From: Reliability of Lead-Free Solder Joints
CRANE RELIABILITY STUDY
Purchasing supplies at CERN
1000 Hour GreyTM Ni-PTFE Plating
Procurement’s Impact on Logistics.
© 2016 Global Market Insights, Inc. USA. All Rights Reserved Fuel Cell Market size worth $25.5bn by 2024Low Power Wide Area Network.
….the Rest of the REACH and RoHS Story
Corporate Responsibility Org Chart
GEOP 4355 Supply Networks: Supplier management
Outsourcing Strategies
Pb-Free Design/Implementation Guide - Overview
CORPORATE RESPONSIBILITY STEERING COMMITTEE
Next Generation 911: Making it Happen NOW!
2016 International Conference on Grey Systems and Uncertainty Analysis
Pb-Free Design/Implementation Guide Team Update for PERM 33
CORPORATE RESPONSIBILITY STEERING COMMITTEE
Balanced Approach to Noise Mitigation
IAQG 9110:2012 Revision Overview
IAQG 9110:2012 Revision Overview
Balanced Approach to Noise Mitigation
Future Airborne Capability Environment (FACE™) Support
Presentation transcript:

Impact of the Öko-Institut Recommendations on an Avionics OEM : Dave Hillman Rockwell Collins IPC Brussels June 2008

Impact of the Öko-Institut Recommendations on an Avionics OEM Agenda: High Performance Use Environment OEM Characterization Visual Impact Example Consequences of Material Changes on OEM Impact of New RoHS Material Additions Conclusions

Impact of the Öko-Institut Recommendations on an Avionics OEM High Performance Electronic Products Characterization: Life Critical & Flight Critical Applications Extremely Stable Qualified Material Lists Significant Use Life ~ 20-30 Years Not Uncommon Manufacturing Mode: High Mix/Low Volume Design Cycle Mode: Deliberate and Long ~ 12 Months Customer Certification * Nothing is set in stone – and there is no guarantee that “legacy” products will have infinite exemption. exemption/exclusion Graphic source: M. Kelly, SMTAI 2007, “Case Study: Qualification of a Lead-free Card Assembly & Test Process of a Server Complexity PCBA

Impact of the Öko-Institut Recommendations on an Avionics OEM

Impact of the Öko-Institut Recommendations on an Avionics OEM (Graphic courtesy of L. Whiteman ACI)

Addresses issues that are: AIA-AMC-GEIA Lead-free Electronics in Aerospace Project Working Group (LEAP WG) Formed in 2004 AIA – Aerospace Industries Association AMC – Avionics Maintenance Conference GEIA – Government Electronics and Information Technology Association Includes all stakeholders (market segments, supply chain, geographic regions) ~90 meeting attendees 10 active task groups Addresses issues that are: Unique to aerospace and military Within control of aerospace and military Copyright © 2006 Boeing. All rights reserved. PPT cell courtesy of Lloyd Condra, Boeing

LEAP WG Actionable Deliverables GEIA-STD-0005-1, Performance Standard for Aerospace and High Performance Electronic Systems Containing Lead-free Solder Used by aerospace electronic system “customers” to communicate requirements to aerospace electronic system “suppliers” GEIA-STD-0005-2, Standard for Mitigating the Effects of Tin Whiskers in Aerospace In High Performance Electronic Systems GEIA-STD-0005-3, Performance Testing for Aerospace and High Performance Electronic Interconnects Containing Lead-Free Solder and Finishes Used by aerospace electronic system “suppliers” to develop reliability test methods and interpret results for input to analyses GEIA-HB-0005-1, Program Management / Systems Engineering Guidelines For Managing The Transition To Lead-Free Electronics Used by program managers to address all issues related to lead-free electronics, e.g., logistics, warranty, design, production, contracts, procurement, etc. GEIA-HB-0005-2, Technical Guidelines for Aerospace and High Performance Electronic Systems Containing Lead-Free Solder and Finishes Used by aerospace electronic system “suppliers” to select and use lead-free solder alloys, other materials, and processes. It may include specific solutions, lessons learned, test results and data, etc. GEIA-HB-0005-3, Rework and Repair Handbook for Aerospace and High Performance Electronic Systems Containing Heritage SnPb and Lead-Free Solder and Finishes GEIA-HB-0005-4, Impact of Lead Free Solder on Aerospace Electronic System Reliability and Safety Analysis Used to determine, quantitatively if possible, impact of lead-free electronics on system safety and certification analyses, using results from tests performed per GEIA-STD-0005-3 Copyright © 2006 Boeing. All rights reserved. (Published) (in ballot) PPT cell courtesy of Lloyd Condra, Boeing

Impact of the Öko-Institut Recommendations on an Avionics OEM Failure Phenomena Due to a Materials Change

Impact of the Öko-Institut Recommendations on an Avionics OEM *Determining, quantitatively if possible, impact of material substitutions on system safety and certification is a significant task 200 thermal cycles: SnPb solder (left) and SAC solder (right)

Impact of the Öko-Institut Recommendations on an Avionics OEM Material - Beryllium Beryllium is a highly regulated and controlled material within aviation electronics market segment. Beryllium has extensive applications in electronic component construction and as metal alloy constituent. Metal alloys utilizing Beryllium as an alloy constituent have unique performance characteristics for which a substitute material may not exist.

Impact of the Öko-Institut Recommendations on an Avionics OEM Material - Nickel Nickel is widely used as substitution material for current RoHS prohibited materials: Cadmium and Hexavalent Chromium. Nickel has extensive applications in electronic component construction, plating, and as metal alloy constituent. The addition of Nickel to the current RoHS prohibited materials list would result in the requalification of another substitute material for Cadmium and Hexavalent Chromium, provided a substitute material exists.

Impact of the Öko-Institut Recommendations on an Avionics OEM The Periodic Table is a Finite Material Set Table Courtesy of Sargent Welch Scientific Co.

Impact of the Öko-Institut Recommendations on an Avionics OEM The compact fluorescent light bulb is an example of controlled use of a hazardous material resulting in a better technology Material substitutions require due diligence test/evaluation efforts to determine applicability for a industry use segment compatibility before a substitution can be accomplished

Impact of the Öko-Institut Recommendations on an Avionics OEM Conclusions: The High Performance Use Environment Industry Segment is not a “stand alone” entity - material changes to the global industry supply base impact all industry use segments. A critical parameter of material assessment is the balance of material elimination versus material restricted use The implementation of new materials of High Performance Use Environment technologies is achievable if conducted in a measured, controlled, methodical manner.