1. From: Reliability of Lead-Free Solder Joints
Date of download: 10/23/2017
Copyright © ASME. All rights reserved.
From: Reliability of Lead-Free Solder Joints
J. Electron. Packag. 2006;128(3): doi: /
Figure Legend:
Young’s modulus of lead-free and tin-lead solders

2. From: Reliability of Lead-Free Solder Joints
Date of download: 10/23/2017
Copyright © ASME. All rights reserved.
From: Reliability of Lead-Free Solder Joints
J. Electron. Packag. 2006;128(3): doi: /
Figure Legend:
Tensile creep strain rate for SnAgCu and Sn37Pb solder alloys at 50°C

3. From: Reliability of Lead-Free Solder Joints
Date of download: 10/23/2017
Copyright © ASME. All rights reserved.
From: Reliability of Lead-Free Solder Joints
J. Electron. Packag. 2006;128(3): doi: /
Figure Legend:
Thermal cycling test of lead-free 256-Pin PBGA package on PCB (−25–125°C, one cycle per hour)

4. From: Reliability of Lead-Free Solder Joints
Date of download: 10/23/2017
Copyright © ASME. All rights reserved.
From: Reliability of Lead-Free Solder Joints
J. Electron. Packag. 2006;128(3): doi: /
Figure Legend:
256-Pin PBGA with 25°C, 1h thermal cycle)

5. From: Reliability of Lead-Free Solder Joints
Date of download: 10/23/2017
Copyright © ASME. All rights reserved.
From: Reliability of Lead-Free Solder Joints
J. Electron. Packag. 2006;128(3): doi: /
Figure Legend:
Reliability engineering