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Pb-free Electronics Risk Management (PERM) Council

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Presentation on theme: "Pb-free Electronics Risk Management (PERM) Council"— Presentation transcript:

1 Pb-free Electronics Risk Management (PERM) Council
Meeting #31 Hosted by CAVE3/Auburn University Auburn, Alabama March 7-9, 2017 Meeting address: Wiggins Hall – Auburn University 354 War Eagle Way Auburn, AL 32902 USA POC: John Perry Director, Printed Board Standards & Technology IPC — Association Connecting Electronics Industries® (tel)

2 Tuesday, March 7, 2017 8:00 – 8:30 Auburn University Badging Check-In
8:30 – 9:00 Sign In / Coffee – Wiggins Hall Room 1408 9:00 – 9:15 Welcome and Introductions (Dave Pinsky, PERM Council Chair) 9:15 – 9:45 Auburn/CAVE3 Welcome and Overview (Dr. Pradeep Lall, CAVE3) 9:45 – 10:00 Pb-free Electronics Risk Management (PERM) Council – Overview & Status 10:00 – 10:15 Overview of November 2016 PERM 30 Meeting (David Pinsky, PERM Chair) 10:15 – 10:30 Break 10:30 – 11:15 High Strain Rate Properties of Pb-Free Solders (Dr. Pradeep Lall, CAVE3) 11:15 – 12:00 Methods for fast, reliable growth of Sn Whiskers (Dr. George Flowers, CAVE3) 12:00 – 13:00 Lunch 13:00 – 13:45 Aging Behavior of Lead Free Solders (Dr. Jeff Suhling, CAVE 3) 13:45 – 14:15 NASA DoD Phase 3 Consortium Testing Plan (Jeff Kennedy, Celestica) 14:15 – 14:45 Update on DoD Executive Agent for Printed Circuits/Electronics Interconnects (Denny Fritz, SAIC) 14:45 – 15:00 Break 15: :30 Update on IPC Standards Concerning PERM Input (Dave Hillman, Rockwell Collins) 15:30 – 16:00 Update on AVSI ISRP Airplane Environmental Monitor (Joe Juarez, Honeywell) 16: :15 Discuss Wednesday Agenda (Dave Pinsky, PERM Chair)

3 Wednesday, March 8, 2017 7:30 – 8:00 Sign In / Coffee – Ross Hall Room 278 8:00 – 9:15 Pb-free Design Guide working session (Tony Rafanelli, Raytheon) 9:15 – 9:45 SERDP Proposed Inputs to SAE GEIA-HB and GEIA-STD 9:45 – 10:00 Break 10:00 – 11:00 Brainstorming on revision of GEIA-STD (Anduin Touw, Boeing & Tony Rafanelli, Raytheon (Remote WebEx Presentation) 11:00 – 11:30 SAE G-24 General Session (Anduin Touw, Boeing) 11:30 – 12:00 IEC BGA Re-balling standard Update, (Dave Burdick, Boeing) 12:00 – 13:00 Lunch and Move to Ross Hall Room 202 13:00 – 14:00 SAE G-24/IPC/JEDEC Pb-Free Solder Bump Task Group (Remote WebEx Presentation) (Anduin Touw, Boeing) 14:00 – 15:00 Brainstorming on SAE GEIA-STD 15:00 – 15:15 Review Thursday joint schedule and Adjourn (Dave Pinsky, PERM Chair)

4 Joint PERM/CAVE 3 Meeting
Thursday, March 9, 2017 Joint PERM/CAVE 3 Meeting 8:00 – 8:30 Coffee and Check-in Wiggins Hall Room :30 – 8:45 Status of PERM Pb-free Design Guide Effort (Anthony Rafanelli, Raytheon) 8:45 – 9:15 Tin whisker self mitigation study Update (Dave Pinsky, Raytheon) 9:15 – 9:45 Tin Whisker Mitigation Test Vehicle (Stephan Meschter, BAE Systems) 9:45 – 10:00 Break 10:00 – 11:00 Reliability Impact of Long- term Thermal Aging on Lead Free Solders (Dr. John Evans, CAVE3) 11:00 – 12:00 CAVE 3 Presentation #2 TBD 12:00 – 13:00 Lunch 13:00 – 14:00 CAVE 3 Presentation #3 TBD 14:00 – 14:30 TBD 14:30 – 15:00 Future PERM Meeting Dates/Locations (Dave Pinsky, Raytheon) 15:00 – 17:30 Tour of Auburn University Labs


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