Module design for B-layer replacement V.1. Bare Module dimensions 16.200mm Active area 17.000mm 16.210mm Footprint 18.500mm stack 200um chip 20um bumps.

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Presentation transcript:

Module design for B-layer replacement V.1

Bare Module dimensions mm Active area mm mm Footprint mm stack 200um chip 20um bumps 250um sensor Module power load: 1.25W (also consider 1.0W and 1.5W)

Stave arrangement Modules abut one against the next (maybe assume 10um nominal gap for modeling) 48 modules per stave for 778mm total length. Readout/power from both ends.

Option 1: module with flex cable 14mm 500mm Flex cable 0.075mm 0.97mm Cable power load: 0.4W (uniform over full 50cm)

Option 2: cable in stave x (mm) 1mm 0.15mm kapton/glue 0.06mm aluminum Cable power load : 0.1/x 2 W/cm 2 Z=0 Z=+/- 40cm 80/x 2 W/cm 2 Would like to know sensor T vs. x