1. LHCb Velo Construction Authorisation steps Tony Smith

2. Authorisation 1- stages 0-7 Before PA and chip attach Stage 0 – Bare substrate Stage 1 – Reception of Hybrid Stage 2 – Thickness measurements at 16 chip sites. Stage 3 – Metrology (before population) Stage 4 – Additional Metrology/send for population Stage 5 – Electrical tests after population Stage 6 – Clean and Inspect Stage 7 – Metrology Check log file entries for stages 0 to 7 for comments and assess these Check twist and thickness criteria and electrical tests are passed PASS go on to next stage, FAIL – reject, FIX – repair and repeat

3. Authorisation 2 Review stages 8-19 Before sensor Gluing I Stage 8 – Glue r-side pitch adaptors Stage 9 – Glue r-side chips Stage 10 – Glue p-side pitch adaptors Stage 11 – Glue p-side chips Stage 12 – Bond backend r-side chips Stage 13 – Bond backend phi-side chips Stage 14 – Electrical test on all chips Stage 15 – Replace faulty r-side chips Stage 16 – Replace faulty phi-side chips Stage 17 – Front end bond r-side chips Stage 18 – Front end bond phi-side chips Stage 19 – Electrical test

4. Authorisation 2 Review stages 8-19 Before sensor Gluing I Check CM subtracted noise and pedestal plots to confirm operation of all ADC channels and identify bonding shorts. – Typical plot (M87 chip14 Phi) showing two shorted channels Note that it is not possible to spot open circuit channels at this stage as the noise due to the capacitive load of the PAs is too small

5. Authorisation2 sensor gluing II Check individual chip plots and full sensor channel plots for shorts. A small number of shorts (1 or 2) is OK. Note that any possible rework will already have been done – but check log.

6. Authorisation 3 – Review Steps 19-25 Before Hybrid to pedestal gluing Stage 19 – Electrical test after FEB Stage 20 – Glue sensors Stage 21 – Metrology of Sensor-Sensor Alignment Stage 22 – Bias Bond Measure IV – compare with bare sensors Stage 23 – Bond r-sensor Stage 24 – Bond phi-sensor Stage 25 – Laser test Results (see Kurt and Girishs Talks) plus IV – compare with pre bonding plot

7. Proposed new inspection and authorisation steps Stage 8 – Glue r-side pitch adaptors Stage 9 – Glue r-side chips Stage 10 – Glue p-side pitch adaptors Stage 11 – Glue p-side chips New inspection - gluing?? Stage 12 – Bond backend r-side chips Stage 13 – Bond backend phi-side chips Stage 14 – Electrical test on all chips Stage 15 – Replace faulty r-side chips Stage 16 – Replace faulty phi-side chips New authorisation –include PCN check?? Stage 17 – Front end bond r-side chips Stage 18 – Front end bond phi-side chips Stage 19 – Electrical test