Sidet Facilities A snap shot of space and equipment at Sidet and their current use Projected future uses and upgrades Hogan Nguyen, Fermilab May 22nd 2007.

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Presentation transcript:

Sidet Facilities A snap shot of space and equipment at Sidet and their current use Projected future uses and upgrades Hogan Nguyen, Fermilab May 22nd 2007

Major Sidet Work Areas Designed No. Volume Location Size(Sqf) Class changes/hour Lab C north 1750 10,000 15 Lab C south 1600 10,000 15 Lab D 2350 10,000 30 Bonding room 720 -- -- Repair stations 300 -- -- C-D cross connect 2000 -- -- A-B bridge east 500 -- -- A-B bridge west 780 -- --

Temperature Uniformity Study (Winter '06) Preliminary ! Variations (Celcius) Area Daily Horizontal Vertical Lab C North 1-2 1 1-2 Lab C South 1-2 1 1-2 Lab D 1-2 1 2-3

Temperature Uniformity Near Brown&Sharp CMM in Lab C South Preliminary ! Temperature Uniformity Near Brown&Sharp CMM in Lab C South Vertical span of 8'

Brown & Sharp Global Image CMM with Touch Probe 200 Touch Probe 200 Force = 2-10 grams Feather Probe Force < 10 mgrams (not shown)

Best overall Machine

Other Major Equipment Generic Equipment Wire bonders Dicing Saw Vacuum Ovens and Clean Benches Encapsulation machines (manual and automatic) Alcatel Leak checker Inspections Stations Probe stations Electronics Modules (e.g. Keithley 237's) Chillers Vacuum pumps Plasma Cleaner (needs to be recommissioned) Flip-Chip Bonder (on arrival) Project Specific Equipment SVX readout infrastructure Burnin Boxes

Vacuum Oven and Clean Bench Workstation in Lab D Currently used by CMS-FPIX for lamination

Kullick &Soffa 8090 Wirebonders We will be receiving a flip-chip bonder in the summer. We are exploring upgrading to a deep-head bonder. Encapsulation Robot in Lab D

Omis-II X-Y inspection stations (~4 total) Aerotech Gantry (Specific to CMS-TOB) Probe stations (~4 total)

Inspection Optics and CCD camera Device Magnification Pixel resolution Field of View Ram 2x 0.6 microns 0.46 mm x 0.46 mm OGP 5x 0.5 microns 0.45 mm x 0.45 mm Nikon 20x 0.17 microns 0.15 mm x 0.15 mm AEI 450x - 0.7 mm x 0.7 mm Typical working distance of 30 mm (except AEI) Typical CCD camera 756 (h) x 572 (v) pixels

Chillers (all currently in use) 4 small Neslab bath chillers. -5C. Low wattage 2 medium glycol chiller -5C. 10 watts 1 medium glycol-PF50 chiller with heat-exchanger X X 1 large glycol chiller -20C. 20 Watts 1 FTS PF50 chiller X large (Univ of Rochester)

Space and Equipment Usage Projects (Other than ILC Silicon R&D) Space Usage CMS-FPIX Lab C North, Lab D C-D cross connect DES/SNAP Lab C South, Lab A RD50 Lab C South (Small) ILC SiliconPM R&D A-B bridge test area LANL-Phenix Forward Planar Pixel Lab D (small) and A-B brige test area BNL-Phenix Layer3-4 Wirebonding Lab D (small) and and Encapsulation A-B bridge test area Silicon Pixel Testbeam Support Lab D (small) and A-B bridge test area Super CDMS Lab D (small) COUPP Lab D (small) Other Projects (in discussion) -----

Space Usage Forecast DES/SNAP will occupy Lab C South for long term. CMS-FPIX Panel Assembly concludes in Summer 2007. Significantly more space and equipment in Lab D and C-D cross connect will be available. CMS-FPIX Full Detector Assembly concludes in Fall-Winter 2007. Significantly more space and equipment in Lab C North will be available. We do not know yet the impact of other projects that are in discussion: SLHC upgrade, and other DOE silicon projects based elsewhere. I expect that priority will be given to ILC Silicon R&D in lab D.

Clean room space is also available at Lab 3, in the village (5 minutes drive from Sidet). Rated at class 10,000. Size comparable to Lab C. This space would have to be shared with SuperCDMS, COUPP.