1. HR-HV CMOS activities and plans at Glasgow
Craig Buttar & Richard Bates

2. Craig Buttar, Glasgow CMOS, Aida2020 kickoff meeting
Glasgow summary
People
Craig Buttar
Richard Bates
Dima Maneuski
Kestutis Kanisankaus
Andy Blue
Interests
CMOS development for HL-LHC upgrades and for Linear Collider experiments
TCAD simulation of devices
understanding charge collection and implementing radiation damage models
Device characterisation (before and after irradiation)
MIPS, Fe55, X-rays (max 80kV), Microfocussed X-ray beam (Diamond), testbeam, TCT
Module building
Development of modules using TSVs
Craig Buttar, Glasgow CMOS, Aida2020 kickoff meeting

3. Craig Buttar, Glasgow CMOS, Aida2020 kickoff meeting
TCAD simulations
Synopsis TCAD simulations
TowerJazz HR-CMOS sensors
NDA with TJ
Electrical properties
Geometry optimisation
Radiation damage
Craig Buttar, Glasgow CMOS, Aida2020 kickoff meeting

4. Craig Buttar, Glasgow CMOS, Aida2020 kickoff meeting
HV-CMOS pixel sensors
HV-CMOS pixels characterisation
CCPD AC-coupled to FEI4 chip
DAQ and software and analysis development
Laboratory tests: Sr90, Fe55, temperature variation
Transient current technique setup
X-ray generator setup
Test beams at Diamond Light Source Synchrotron
Collaboration with CERN CLIC group
Craig Buttar, Glasgow CMOS, Aida2020 kickoff meeting

5. Craig Buttar, Glasgow CMOS, Aida2020 kickoff meeting
HV-CMOS pixel sensors
HV-CMOS pixels characterisation
Diamond 15 keV 2.5 um beam scan
CCPD + FEI4 noise occupancy
Pixel layout
CCPD + FEI4 Threshold tuning
CCPD + FEI4 Sr90 response
Craig Buttar, Glasgow CMOS, Aida2020 kickoff meeting

6. Craig Buttar, Glasgow CMOS, Aida2020 kickoff meeting
HV-CMOS strip sensors
HV-CMOS strips characterisation
Standalone AMS350 CMOS strip sensor
Performance optimisation
Laboratory tests: Sr90, Fe55, temperature variation
Radiation damage studies
Birmingham
Test DESY
Test Diamond
Collaboration with Oxford and RAL
Craig Buttar, Glasgow CMOS, Aida2020 kickoff meeting

7. Craig Buttar, Glasgow CMOS, Aida2020 kickoff meeting
HV-CMOS strip sensors
DESY 4 GeV MIPS
HV-CMOS strips characterisation
Diamond 15 keV 2.5 um beam
High gain pixels
Low gain pixels
Bias sweep
Fe55 spectrum
Craig Buttar, Glasgow CMOS, Aida2020 kickoff meeting

8. Craig Buttar, Glasgow CMOS, Aida2020 kickoff meeting
Glasgow areas of work
TCAD simulation
Can we get access to relevant process parameters through AIDA?
Have NDA with TJ
Device design
No electronics design effort but would contribute to top level design: layout, readout architecture
Device characterisation
As discussed above
Access to sensors through WP
Development of CMOS module with TSVs
Collaboration with CERN, LAL & MPI (WP4)
Craig Buttar, Glasgow CMOS, Aida2020 kickoff meeting

9. Fergus Wilson, STFC/RAL, AIDA 2020 Kick-off meeting
STFC/PPD capabilities and facilities
Irradiation sources:
Continuous X-ray sources.
Radioactive Sources (Fe55, Sr90, etc…)
Hardware:
Full resources for extensive testing of sensors.
Three lasers systems with XYZ stages: Pulsed three-wavelength Nd-Yag laser; Scanning TCT IR laser from particulars.si; IR laser for use with probe station.
Probe stations (manual and automatic).
Cryostats and environmental chambers.
Likely to have a magnet with 300mm bore and a variable field up to 5T in 2016.
Software:
Euro-practice member.
In-house expertise with TCAD simulation, VHDL/FPGA, Finite Element, Heat Dissipation software.
Facilities:
Clean-rooms.
Metrology labs.
Access to CMOS Sensor Design Group expertise.
Access to ASIC Design Group expertise.
DAQ:
PPD is a member of LHCb, CMS, ATLAS, MICE, T2K, DUNE, LZ, etc… and has access to hardware and expertise in various DAQ systems (e.g. ATCA and GLIB) through our experiment DAQ groups.
AIDA 2020:
Our main areas of interest is WP6.2 (TCAD simulation) and WP6.3 (HV/HR-CMOS sensors).
Fergus Wilson
04-Jun-2015
Fergus Wilson, STFC/RAL, AIDA 2020 Kick-off meeting