1. Status
Caltech meeting – discussions of assembly centers, US responsibilities
We will try to organize a PS module assembly workshop at Brown April 30 – May 1
Building a smaller test rod to understand CF thermal interface, gluing …
Smaller radius pipe
Test with instrumented AL block
Eventually section old rod to examine interface surfaces

2. Dummy Modules Status at CVI? Daisy Chain testing when received
MPA-lite testing is very encouraging
Chip basically works as designed
CERN is planning to go to 3 vendors for bump bonding
Seems excessive to me – some are irrelevant to PS module
Few months before chip testing at universities
MAPSA-lite sensor fabrication is going more slowly
Poor sensor material (?)
Some parts broken during testing
Bonding vendors have been told that we have dummy parts (as requested by CERN). They will let us kno where or when they are needed.

3. OT modules
The table summarizes the number of modules of each kind in the baseline design with flat inner barrel modules and in the modified design with tilted inner barrels modules.
There are S modules in either design.
These sensors will be about 10x10 cm2 in size for a total silicon area of 170 m2.
The PS sensors will be about 5x10 cm2 in size.
In the baseline design there will be 7004 of them for a total silicon area of 70 m2.
In the modified design the number of PS barrel modules in the barrel would be reduced from 4164 to 2908.

4. Our interests in OT modules
develop and build the support and cooling structure for the flat part of the barrel
and in the assembly of a number of the PS modules.
The PS modules consist of a strip sensor and a pixel sensor.
The strip sensor has two rows of AC coupled strip with a length of 2.5 cm and a pitch of 100 𝜇m. It is bonded on either side to a hybrid with a row of short-strip ASIC (SSA) readout chips.
The pixel sensor has 32 rows of macro-pixels of length 1.5 mm and pitch 100 𝜇m. The macro-pixel ASIC (MPA) readout chips will be bump-bonded directly onto the sensor to form a macro-pixel-sub-assembly (MaPSA).
The module assembly has to provide for precise alignment of the two sensors relative to each other and supply power and cooling to the sensors and readout chips.

5. PS Module DC-DC sensor Strip hybrid Opto hybrid Carbon fiber Al-CF
R. Lipton

6. US interests
build and test a larger faction of the PS modules (>50%).
other options to discuss
build and test a significant number of 2S modules?
build some mixture of PS and 2S modules?
Participating US Institutions
Brown University
Cornell University
Davis
Fermilab
Rutgers University
University of Rochester
Santa Barbara
Princeton University

7. Institutional Interests R&D
Task
Brown
Cornell
Davis
Fermilab
Santa Barbara
Rochester
Rutgers
Princeton
R&D Tasks
Module Prototyping X
Development of assembly procedures
Development of testing procedures
Development of production infrastructure
Support Development
Mechanical and thermal tests
Readout and test electronics
Beam tests

8. PS Module Participation plans
Task
Brown
Cornell
Davis
Fermilab
Santa Barbara
Rochester
Rutgers
Princeton
Module Constrtcution Tasks 1
Sensors
1.1
Sensor Quality Control X
1.2
Process Quality Control
1.3
Irradiation Tests 2
Hybrids
2.1
FE or Service Hybrid QA X? 3
Mechanics
3.1
Al-CF production(vendor contact) and QA
3.2
Al-CF coating
3.3
CF production (vendor contact) and QA 4
MaPSA
4.1
Vendor Contact and QA 5
Assembly
5.1
Gluing x
5.2
verification of geometrical precision
5.3
Wirebonding
5.4
QA assembled modules (connectivity etc)
5.6
Full QA w/ extended operation & thermal cycles
5.7
Transport Equipment 6
Mechanical Structures 7
Tracker Integration 8
Backend Electronics/L1 Track Trigger
Not a production
assembly w/
w/Rutgers
center

9. Construction and R&D Cost Estimate for 50% of PS modules

10. R&D Estimate (in progress)
Task #
Task Name
Start date
duration (months)
end date
milestone/goal date
M&S (k$)
Travel (k$)
Labor (#FTE) Engineer
Labor (#FTE) Tech 1
PS Module
1.1
Modules and Chips
155 10
1.5
1.6
1.1.1
Dummy PS Module
Fabrication
1/1/15 3
4/1/15 20
0.2
Thermal testing
2/1/15 4
6/1/15
Fabrication of alternatives
3/1/15 6
8/28/15 50
0.4
Parts for commercial test
7/31/15 25
Commercal pre-production 12
7/25/16
0.5
1.2
Bump bonding dummy module
113 5
0.95
1.2.1
Sensor wafer fabrication
12/15/14
1/14/15 9
0.1
1.2.2
Dummy ROIC fabrication
1.2.3
Bump bonding
1/10/15
2/9/15
1.2.4
Dummy MPA testing
6/9/15
1.2.5
Integration into dummy module
10/7/15
1.2.6
Commercial pre-production 8
2/4/16 40
0.25
1.3
Full PS Prototype Assembly and test
390
3.2 2
1.3.1
Develop assembly procedures 16
9/23/16
200
1.3.2
assemble prototype
6/26/17
9/24/17
1.3.3
test prototype
1/22/18
1.3.4
7/21/18
100
1.3.5
Test commercial modules
1/17/19 15
Chips
2.1
MAPSa Lite
145 45
1.4
2.1.1
Initial chip tests
2.1.2
Integration with sensors
8/30/15
2.1.3
Bench tests
7/1/15
10/29/15
2.1.4
Beam tests
4/26/16
2.2
MPA Chip fabrication
715
1.75
2.25
2.2.1
Test board development
6/1/16
9/29/16
2.2.2
1/27/17
5/27/17
550
2.2.3
MPA chip test 75
2.2.4
MPA hybrid fabrication
11/28/16
3/28/17
2.2.5
MPA hybrid test
Sensors
Sensor Development
7/26/17
485
1.9
2.4
3.1.1
First round Novati Fabrication
6/13/15
3.1.2
Test
12/10/15
3.1.3
Pixel sensor fabrications
150
3.1.4
Strip sensor fabrications
3.1.5
sensor testing 60
cost/FTE
Total
2003 90
10.7
10.8
Total cost
5853
2140
1620

11. R&D Estimate (in progress)
Task #
Task Name
Start date
duration (months)
end date
milestone/goal date
M&S (k$)
Travel (k$)
Labor (#FTE) Engineer
Labor (#FTE) Tech 2
Chips
2.1
MAPSa Lite
145 45
1.4
1.6
2.1.1
Initial chip tests
2/1/15 4
6/1/15 25
0.5
2.1.2
Integration with sensors 3
8/30/15 40
0.2
2.1.3
Bench tests
7/1/15
10/29/15
2.1.4
Beam tests 6
4/26/16 20
0.4
2.2
MPA Chip fabrication
715 10
1.75
2.25
2.2.1
Test board development
6/1/16
9/29/16 50
2.2.2
1/27/17
5/27/17
550
0.25
2.2.3
MPA chip test 75 1
1.5
2.2.4
MPA hybrid fabrication
11/28/16
3/28/17
2.2.5
MPA hybrid test
9/24/17
Sensors
Sensor Development
12/15/14
7/26/17
485
1.9
2.4
3.1.1
First round Novati Fabrication
6/13/15
3.1.2
Test
12/10/15
3.1.3
Pixel sensor fabrications
150
3.1.4
Strip sensor fabrications
3.1.5
sensor testing 8 60
cost/FTE
200
Total
2003 90
10.7
10.8
Total cost
5853
2140
1620

12. Centers and equipment Test system CMM Auto. Probe station
Assembly fixtures
Auto Wirebonder
Cooling system
Burn-in system
Gantry
Hybrid Testing X
Sensor pkg assembly
MPA testing
Hybrid assembly to base X- ?
Sensor assembly to base
Assembly to rods
R. Lipton

13. Infrastructure: module assembly
Wire bonder : ~$200K
Pull tester. e.g. Dage 4000: ~10K$
Microscope for optical inspection. Microscope with LED display for quick viewing. ~5K$
Glue dispensing robot. ~20K$
Gantry style robot. Aerotech AGS10000 for TOB construction. ~100K$
Automatic Probe station with cold chuck: ~150K$
Camera with LabVIEW Vision system for robot. ~$20k
Keithley 237 voltage sources. Standard lab power supplies. ~10-20K$
Vacuum oven: ~20K$
Dry storage units with grounding capability. ~10-20K$
Anti-static protection system. ~5-10K$
CMM ???
Cooling system
Burn-in system
Test systems
Clean Room?
Estimate: 400K$ + wire bonder (200K$) + clean room

14. Infrastructure: sensors
Clean room (class 100,000 or better)
Basic equipment
Source meter ≥ 1000V, Imax ≥ 1mA
pAmmeter
LCR-Meter 100Hz ≤ f ≤ 1MHz
Voltage source
Temperature controlled vacuum chuck (~20°C) for sensors up to 16 cm long
Light-tight and humidity controlled metallic enclosure
Probes, vacuum tweezers, microscope
Humidity controlled storage
Additional equipment for strip measurements
automatic probe station (up to 2032 strips, 5 parameters each)
XYZ-stage (accuracy ~5µm)
Switching-matrix including HV switching
Long-term setup to monitor leakage current at 500 V for 48h
Estimate: 250K$ + wire bonder (200K$) + clean room
2/27/2015
Ulrich Heintz - Caltech USCMS meeting

15. Summary
We would like to develop the procedures and assemble PS modules
Current costs based on assembly of half of PS modules
Interest and capacity to build ALL PS modules
can major purchases be made by international colleagues?
Centers: Four for assembly and two for sensor QA
Prelim R&D costs and Costs to establish centers
review and update based on recent experience and expression of interests by institutes.
a lot to do…
propose a workshop for outer tracker: April 30 – May 1
location: Brown University, Providence
dates will be confirmed based on feedback from our CMS partners