1. Advanced hybrid detectors in Oxford: Facilities, experience, and interests Arndt, Bortoletto, Placket, Shipsey

2. Oxford Particle Physics Microstructure Detector Laboratory - OPMD
Currently Under construction – expected completion in Oct 2015
Focused on generic R&D and ITK Strip/Pixel Module production
Clean Rooms
160 m2 of class 10,000 clean room
35 m2 of class 100 clean room
Vacuum, Dry Compressed Air, Nitrogen & DI water as piped services
Equipment
Semiprobe 300mm probe station with thermal chuck (delivery this month)
Hesse Bondjet 820 automatic wire bonder (delivery expected Oct/Nov)
Dage 4000Plus pull tester (Oct/Nov)
OGP CNC500 Smartscope optical metrology system (Oct/Nov)
Keyance VHX500 digital inspection microscope (Oct/Nov)
Weiss Thermal chamber WTL100 (+50oC –> -50oC) (Oct/Nov)
Henniker Bench top Plasma Cleaner (Oct/Nov)
Aerotech pick and place assembly gantry (Sept/Oct)
Nordson EFD Glue Robot (Delivered this week)
HV-CMOS Infrastructure
09 May 2018

3. Oxford Particle Physics Microstructure Detector Laboratory - OPMD
Currently Under construction – expected completion in Oct 2015
Focused on generic R&D and ITK Strip/Pixel Module production
Clean Rooms
160 m2 of class 10,000 clean room
35 m2 of class 100 clean room
Vacuum, Dry Compressed Air, Nitrogen & DI water as piped services
Equipment
Semiprobe 300mm probe station with thermal chuck (delivery this month)
Hesse Bondjet 820 automatic wire bonder (delivery expected Oct/Nov)
Dage 4000Plus pull tester (Oct/Nov)
OGP CNC500 Smartscope optical metrology system (Oct/Nov)
Keyance VHX500 digital inspection microscope (Oct/Nov)
Weiss Thermal chamber WTL100 (+50oC –> -50oC) (Oct/Nov)
Henniker Bench top Plasma Cleaner (Oct/Nov)
Aerotech pick and place assembly gantry (Sept/Oct)
Nordson EFD Glue Robot (Delivered this week)
HV-CMOS Infrastructure
09 May 2018

4. Planar sensors Beam tests Lab I-V measurements
Participated in the evaluation of thin n-on-p sensor fabricated on a variety of substrates for the CMS Hamamatsu campaign
Beam tests
Lab I-V measurements
HV-CMOS Infrastructure
09 May 2018

5. 3D sensors Beam test results after 7 E14 neq/cm2) Normal incidence
SINTEF, FBK, CNM
Beam test results after 7 E14 neq/cm2)
Normal incidence
200 incidence

6. Interests and Possible Contributions
We are especially interested in:
Task 7.4 Detector validation for tracking devices
Characterisation of 3D and planar hybrid pixel sensors with laboratory measurements and beam-tests to demonstrate sufficient tracking capabilities in the high radiation and occupancy environment of the ATLAS and CMS pixel systems at HL-LHC
Validation of thin hybrid pixel detectors for application at the Vertex pixel detector at CLIC with laboratory measurements and test-beam campaigns, after hybridisation to the CLICpix readout chips
HV-CMOS Infrastructure
09 May 2018