BioMEMS Device Fabrication Procedure

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Presentation transcript:

BioMEMS Device Fabrication Procedure Theresa Valentine ENMA490 September 25, 2003

BioMEMS Device Fabrication Procedure Steps Electrode Fabrication Mold or Fluid Control Fabrication (SU-8) Molded Fluid Control Fabrication (PDMS) Assembly November 22, 2018 BioMEMS Device Fabrication Procedure

Electrode Fabrication Materials: Pyrex wafer, 100 mm diameter, 0.5 mm thickness Cr and Au evaporation targets Acetone, methanol, isopropyl alcohol (IPA) HMDS Shipley 1813 photoresist Shipley 352 developer Au etchant Cr etchant Equipment: E-beam evaporation system Spin-coating system Contact aligner Hotplate November 22, 2018 BioMEMS Device Fabrication Procedure

BioMEMS Device Fabrication Procedure Metal Deposition Begin with bare double-polished 4” Pyrex wafer (white). Si Deposit 90Å Cr adhesion layer (green) with e-beam evaporation. Cr Deposit 2000Å Au (yellow) with e-beam evaporation. Au November 22, 2018 BioMEMS Device Fabrication Procedure

BioMEMS Device Fabrication Procedure Electrode Patterning Apply HMDS primer, wait 1 min, and spin (3000 rpm for 30 sec). Spin on photoresist 1813 (blue) (3000 rpm for 30 sec). Soft bake for 1 min at 100C. 1813 Align wafer with Mask 1 – electrode mask. Expose photoresist to UV light for total dose of 180-200 mJ/cm2. Develop photoresist for 30 s in Shipley 352 developer. (Resist is positive, so exposed areas are removed.) Hard-bake photoresist for 10 min at 120C. Etch with gold etchant (TFA, Transene Co.), 100 s. Etch with chromium mask etchant (Transene), 25 s. November 22, 2018 BioMEMS Device Fabrication Procedure

Completed Electrode Wafer November 22, 2018 BioMEMS Device Fabrication Procedure

Mold or Fluid Control Fabrication (SU-8) Materials: SU-8 50 negative resist SU-8 developer Equipment: Spin-coating system Hotplate Contact aligner November 22, 2018 BioMEMS Device Fabrication Procedure

SU-8 Coating/Patterning Spin on SU-8 photoresist (orange). Pre-bake at 95°C. SU-8 Align wafer with Mask 2 – channel/reservoir mask. Expose SU-8 to UV light. Post-bake at 95°C. Develop SU-8 in SU-8 developer. (Resist is negative, so unexposed areas are removed.) November 22, 2018 BioMEMS Device Fabrication Procedure

BioMEMS Device Fabrication Procedure Completed Mold Wafer November 22, 2018 BioMEMS Device Fabrication Procedure

Molded Fluid Control Fabrication (PDMS) Materials: Sodium dodecyl sulfate (SDS) PDMS (Sylgard 184) PDMS curing agent Equipment: Spin-coating system Box furnace November 22, 2018 BioMEMS Device Fabrication Procedure

BioMEMS Device Fabrication Procedure PDMS Fabrication Dip wafer in 0.1 M sodium dodecyl sulfate (SDS) adhesion barrier and let dry naturally. Mix PDMS (Sylgard 184, Dow-Corning) 10:1 with curing agent. Spin on PDMS (purple). Bake in box furnace for 2 h at 70°C. PDMS November 22, 2018 BioMEMS Device Fabrication Procedure

BioMEMS Device Fabrication Procedure Assembly Materials: Methanol Equipment: Razor blade Tweezers Gently loosen edges of cured PDMS with razor blade Submerge PDMS wafer in dish of methanol Hold one edge of PDMS with tweezers and gently pull from wafer (keeping in methanol as much as possible) Remove wafer from dish and allow PDMS to float Slide (electrode) wafer to be assembled under PDMS layer in dish Coarse align PDMS to wafer while in dish Remove wafer and PDMS from dish and align carefully by hand or under microscope, dropping methanol on if sticking occurs, then let dry. November 22, 2018 BioMEMS Device Fabrication Procedure

Complete Assembled Wafer (2560x2560 um) November 22, 2018 BioMEMS Device Fabrication Procedure