NeSSI* - Generation II “Revolution or Evolution?” *New Sampling/Sensor Initiative CPAC - November 5-8, 2001 Rob Dubois - Peter van Vuuren - Jim Tatera . Tatera and Associates “the best way to predict the future is to create it”

The Recent History of ISA2001 Meeting (Joint ISA/CPAC Session) NeSSI Tutorial Standing Room Only Interest Public Introduction of Generation II Specification Open Discussion Session (Sept 11 Impact) Main Issue - Area Classification Requirements Identified X-Team to address Ad-hoc Sensor Connectivity Session CAN-based protocols (e.g. SDS, DeviceNet) best candidates A C-team will clarify benefits of CAN and propose as preferred NeSSI sensor communications standard Miscellaneous Efforts afoot to extend SP76 to IEC standard NeSSI Tutorial at INTERMAC Meeting in Japan (Nov 8) - Rob Dubois NeSSI Marketing Survey Underway 11/15/2018

Hot Off The Press Legacy NeSSI 11/15/2018

Facilitate the acceptance/implementation of... Major Goals of Facilitate the acceptance/implementation of... modular, miniature & smart sample system technology based on ISA SP76 standardization work Promote the concept of... field-mounted smart sampling/analytical systems integration of sample systems with physical/chemical sensors Lay the groundwork for... open connectivity architecture for sensor communications (e.g. Ethernet, DeviceNet, etc.) industry standard communication protocols (e.g. OPC, DeviceNet, CAN etc.) web enabled technologies (e.g. Browser based HMI) Provide a technology bridge to the process for... “sensor/lab-on-a-chip” micro-analytical devices

NeSSI Generations NeSSI Generation I (circa 2000-2002) mechanical, passive components are on a SP76 substrate NeSSI Generation II (circa 2002-2004) “electrified” passive & active components are on a SP76 substrate integral heating and temperature control of the substrate all electrical components are integrated with SAM sensors and actuators communicate via sensor bus smart (self-diagnostic) sample systems NeSSI Generation III (circa 2003+) many analytical sensors and micro-analytical systems wireless sensors 11/15/2018

Generation II Dimensions covered in the Specification…. 1. Heated Substrate 2. Physical Sensors 3. Actuators 4. SAM  5. HMI (Graphical) 6. Wired Bus 7. Wireless Bus 8. X Mini Power Bus 9. Packaging 10. Analytical Sensor 11/15/2018

- over-temperature cut-off 1. Heated Substrate Div/Zone 1 GP. A-D Div/Zone 1 or 2 GP. A-D Conduction Heating - cartridge heater(s) - over-temperature cut-off AC Power Furn. by substrate mfg. AC Power Heating Fluids (alternative) 11/15/2018

2. Physical Sensors for System Diagnostics Doing analytical is just not good enough! Miniature Flow, Pressure, Temperature Gas and/or liquid service Rugged construction Encapsulated (IEC Ex m) Intrinsically Safe (IEC Ex ib) Div/Zone 1 Gp A-D; T4 (135 C) FLOW:  P, coriollis, thermal, other? COM A/D Substrate 11/15/2018

2. Conceptual Sensor for NeSSI “Top Hat” Comm. Chip Parallel Ports - standard size/pin - daisy chain A B Body - encapsulated Comm. Digital “Smart” Sensor - engineering units - memory µP BARRIER - Process Seal - Electrical Isolation - Thermal Memory A/D Process Cavity - no unswept voids - low volume Insulation Skirt - engineered 1.50” Base - 316 SS - pressure rated Sensor 11/15/2018

3a. Electrical Actuators on the Substrate - COMBO COMBO Valve /w integral solenoid Miniature substrate mount Gas and/or liquid service Wide P & T service Rugged, encapsulated (IEC Ex m) Intrinsically Safe (IEC Ex ib) Div/Zone 1 Gp A-D; T4 (135 C) Comm. SV AIR On/Off and Proportional Act. 11/15/2018

3b. Conceptual “Combo” Valve Parallel Ports - standard size/pin - daisy chain “TopHat” Comm. Chip A B Comm. D/A 3-way “pilot” solenoid valve - Intrinsically Safe Vent Solenoid Instrument Air Actuator Digital On-Board Actuator - NO or NC Vent Conventional pneumatic valve Valve Engineered Insulation Skirt Thermal Barrier 11/15/2018

Gateway to an Ethernet LAN 4a. SAM explained... Gateway to an Ethernet LAN - OPC perhaps HMI Interface - Field - Graphical - Wireless - e.g. Bluetooth™, 802.11 Software Applets for Sample System Repetitive Tasks (Industry Common) Host to a Sensor/Actuator Bus 11/15/2018

4b. SAM Applets for Common Tasks Zero & span validation Pressure regulation Stream switching Maintenance diagnostics Temperature control Interoperability talk to all analytical systems Enabling Technology for quick introduction of microAnalytical to Industry  SAM 11/15/2018

5. Human Machine Interface PDA     Hello? PC F Vv T Vv P F A 11/15/2018 Vv=automatic valve; P=pressure sensor; F=Flow Sensor; A=Analytical Sensor;T=Temp. Sensor

6a. Standalone “SAM” with Wired Sensor/Actuator Bus Target Ex ib intrinsically safe Plug & Play CAN based connectivity Analyzer System Ethernet LAN Analyzer Controller Sensor Analytical Manager (SAM)  ? V P Legend: Pressure Sensor Temp Sensor Valve/Actuator Analytical Sensor V A T P T A 11/15/2018

6b. Embedded SAM With Wired Sensor/Actuator Bus Target Ex ib intrinsically safe Plug & Play CAN based connectivity Analyzer System Ethernet LAN ?  Analyzer Controller w/ Embedded SAM Functionality V P T A P Legend: Pressure Sensor Temp Sensor Valve/Actuator Analytical Sensor V A T 11/15/2018

7. Wireless Signal (Gen III…?) Signal: Bluetooth , 802.11, other? Plug and Play! Power X-proof miniature power bus Analyzer System Ethernet LAN Sensor Analytical Manager (SAM)  V P T A P.S. 11/15/2018

8. What the world needs is... ..a miniature wiring method Sensors (typ) ..a miniature wiring method “plug & socket” Division/Zone 1 e.g. MTL (England) Mini-Power Bus AC Power AC/DC 11/15/2018

9. Enclosure/Package Convection Heater X-Proof (OPTIONAL) Div/Zone 1 GP. A-D Div/Zone 1 or 2 GP. A-D Temp. Sensor Intrinsic Safe AC Power No Purge or Pressurization NEMA or IP Rated Enclosure - insulated 11/15/2018

10. Analytical Sensors (Gen III…?) Fiber Optic SAM  One sensor per component “lab on a chip” AT One Sensor and Multiple Analytes “laser scanning device” F Vv T A A 11/15/2018

What would a Gen II prototype look like? Programmable, heated substrate Digital, serial sensors/actuators: F, P, T Zone 1 enclosure interior SAM; control algorithms Wireless - graphical HMI Packaged for outdoor installation 11/15/2018

Summary Generation II NeSSI Release of Generation II Spec Evolution as opposed to revolution Release of Generation II Spec 1st quarter 2002 To NeSSI Distribution List & IFPAC 11/15/2018

Acknowledgements I Dow Syncrude ExxonMobil Chemical CPAC Danny Quevillon Reg Hartwig Walt Henslee Bac Vu (SP76) Syncrude Ian Verhappen ExxonMobil Chemical Dan Podkulski (SP76) Jeff Gunnell John Cumbus Rajko Puzic CPAC Mel Koch Lloyd Burgess Brian Marquardt 11/15/2018

Acknowledgements II Doug Mitchell - Panametrics John Wawrowski - Swagelok Rick Ales - Swagelok Yoav Barshad - Applied Analytics Nick van Bruggen - Porter Carl Jones - Rosemount Analytical CD Feng - Rosemount Analytical Bob Nickels - Honeywell Chris Towle - MTL 11/15/2018

Help Wanted/Needed Technology Teams A-Team – Define Applications for SAM C-Team – Communications for SAM to Sensors + X-Team – Hazardous Electrical Area Issues NeSSI Partners A group of users and vendors to help invest in, develop, and evaluate NeSSI technology. CPAC Web Site Listing NeSSI/SP76 Compatible Components 11/15/2018