1. This Dog Don’t Hunt* Rob Dubois IFPAC SM Arlington, Virginia, USA January 13, 2004 “the best way to predict the future is to create it” NeSSI™ *...or why “classic” 4-20 mA communication and conventional hazardous protection methods are not enablers for the further development of miniature, modular, and smart analytical systems

2. 2 This Dog Don’t Hunt “Chance” Courtesy of M. and D. Dubois

3. 3 Presentation Topics NeSSI™: Objectives Recap Progress Update –The Impact of ANSI/ISA SP76 –Generation II Update The NeSSI-box: A Case Study °The I/O and Interface Dilemma °The problem with hazardous compliance °The problem with 4-20 mA Communication Conclusions and Acknowledgments

4. 4 Objective 1: Modular, miniature & smart process analytical systems Courtesy of Dow Chemical, Fort Saskatchewan, Canada

5. 5 Objective 2: A platform for microAnalytical devices Courtesy of Swagelok and GE/Panametrics Oxygen Sensor

6. 6 Objective 3: An enabler for By-Line Analysis Both pictures Courtesy of Dow Chemical, Freeport, Texas

7. 7 Objective 4: Common Communication Architecture Field - Level 1 LAN (Wireless) Div 2 NA/Zone 1 Europe Serial Bus IS Barrier Sensor Actuator Manager VDC Sensor Actuator Manager (SAM) Field By-Line Analysis Wireless Handheld HMI Sensor - Level 0 LAN DeviceNet <100 ft V T P A Sample System Div/Zone 1 Gas Analyzer Segment 1 (NIS) Segment 2 (IS) microClimate Enclosure Control Room Information - Level 2 LAN (Ethernet) OPC Gateway Field - Level 1 LAN (Wireless and Wired) DCS/Remote

8. 8 It’s all about Standard Interfaces (the “rail” concept) Standard Mechanical Interface “Rail” Standard Electrical (Digital) Interface “Rail” Anyone’s Sensor Anyone’s Actuator SAM* Standard robust “miniPC” P V *Sensor/Actuator Manager

9. 9 Today NeSSI™ Development Progress Gen III Gen II Gen I Mechanical Electrical Networked & Smart Wireless uAnalytical END USER VALUE 2006 2004-05

10. 10 Gen I: The Impact of a Standard Mechanical Interface Courtesy of Parker-Hannifin No confusion within our manufacturing community on which footprint to build to… Lowers the cost to build Allows interchangeability between various components irregardless of manufacturer

11. 11 Gen I: The Impact of Adopting the ANSI/ISA SP76 Standard Over 50 SP76 components now available Price point has decreased from x3 to about x1.2 classical New product categories are in the pipeline including microPumps, aspirators, sensors... Courtesy of CIRCOR

12. Gen I SP76 Component Availability Projected

13. 13 2003 New Developments New substrate designs –Swagelok (Jan IFPAC) –CIRCOR (May ISA-AD) –Parker (Oct. ISAexpo) New SP76 Components –Brooks MFC (2p) –Porter MFC (2 p/Div2) –Horiba/STEC MFC (1p) –Bronkhörst MFC (Zone1) New SP76 Components –FlowMatrix Flow (insens. to press.) –Hanbay mini-actuators –Teledyne (PPB Oxygen) –Rotameters (Porter, Brooks) –Function Blocks (CIRCOR, Parker) Auxiliary Systems –Intertec “smart” heater

14. SP76 Surface Mount Component Trends A move from high purity to “process” A trend to Functional Blocks –atmospheric reference vent valve module –leak detection/purge modules –bypass modules –back-pressure control module –sample injection module Analytical “cluster” applications (eg H 2 O)

15. 15 Gen II: So why “Get Smart” ? Benefits to Industry –predict failures before they happen –decrease maintenance –increase confidence –remote operation in robust environments ARC Advisory Group suggests that 40% maintenance savings can be achieved by automation Maxwell Smart

16. 16 Recap of the Seven Elements of a Gen II Miniature System mini industrial PC (SAM) Wireless Maintenance “TOOL” (PDA) microClimate Enclosure Integrated Heaters Sensors Actuators I.S. bus

17. 17 Status Update: Gen II/III (encouraging news) DOE award for NeSSI systems ($3MM) –Won by Honeywell led consortia –Smart Gas/Liquid System (2004-05) –microGC (2006) –wireless, robust standard (2006 – funded sep.) Generation II Specification –“working version” at hand –www.cpac.washington.edu/NeSSI/NeSSI.htm

18. 18 Status Update: Gen II/III (work in progress) Who can cut the Gordian knot? –No clear target to industry on an industrially robust low cost digital standard to build to. DeviceNet requires $0.5MM to certify for Intrinsic Safety IEEE 1451.6 standard for IS in progress (with CiA/CANopen) Profibus or FF an option? –Power to operate multiple actuators and sensors within IS (low power) constraint is a formidable goal. (target 20-30 devices) Alexander the Great cutting the Gordian Knot

19. 19 Case Study: Hard-earned lessons from the NeSSI-box installation Courtesy of Dow Chemical, Fort Saskatchewan, Canada Upper Enclosure PLC with 4-20mA Bottom Enclosure Heated Sample System in Propylene Service

20. 20 Upper Enclosure Control System (SAM Jr.) Conventional PLC controller (Div. 2) –12 I/O points Expensive to design and build Custom programming Highly engineered Courtesy of Dow Chemical, Fort Saskatchewan, Canada

21. 21 Lower Enclosure Sample Handling & Conditioning X-purged pressurized enclosure/interlock LEL gas detector/interlock Integrated an x-proof heating system into the control strategy Courtesy of Dow Chemical, Fort Saskatchewan, Canada

22. 22 The Field Human Machine Interface (NeSSI-box) Courtesy of Danny Quevillon. Dow Chemical, Fort Saskatchewan, Canada

23. 23 The I/O Dilemma Conventional analyzers do not support flexible I/O interfacing with sample systems –expensive to implement –multiple interfaces (RS-232, analogue, digital, proprietary bus, etc.) –lack of HMI for monitoring data –may have limited AI/AO/DI/DO Input/Output

24. 24 4-20 mA Communication not viable for NeSSI Gen II/III highly engineered and labor intensive space hungry expensive to wire for haz. electrical areas conduit and cabling systems can be larger than the actual components and do not support miniaturization different global certification rules “this dog don’t hunt”

25. 25 The Solution: Low cost Intrinsically Safe Serial Comm. for Gen II/III First analytical serial bus now demonstrated (POCA* project) –simple wiring and connections Courtesy of Dow Chemical, Fort Saskatchewan * POCA = Proof of Concept Apparatus

26. 26 Free at Last A wiring method with no conduits, cables Plug and play identification of sensors and actuators An industry standard connector Smart diagnostics Global certification

27. 27 Conclusions Gen I products are streaming to market DOE award will bring Gen II/III prototypes to market in 2-3 years 4-20 mA I/O is not optimal for NeSSI miniature systems target the “NeSSI- bus”

28. 28 Acknowledgments Special Thanks –Peter van Vuuren (ret.) ExxonMobil Chemical –Jeff Gunnell (EMCC) –John Cumbus (EMCC) –John Mosher (H’well) –Bob Nickels (H’well) –Ulrich Bonne (H’well) –Dave Veltkamp (CPAC) –Mel Koch (CPAC) –Rick Ales (Swagelok) Special Thanks (Dow) –D. Quevillon, R. Hartwig, H. Quartel (Fort Sask.) –P. Williams, B. Vu, J. Leach, D. Yates, D. Gay, W. Henslee, M. Walsh, C. Snook (Texas) –G. Timmermans, E. Engelen (Netherlands) –Paul Landry (Louisiana) –Ralf Schade (Germany) –M. Dittenhafer, M. Buchmann (Michigan)

29. 29 Thanks Peter!