Electronics Interconnection at NPL Training Consultancy Investigations and validation Underpinning research Collaborative or single client work chris.hunt@npl.co.uk Wednesday, 07 November 2018Wednesday, 07 November 2018Wednesday, 07 November 2018Wednesday, 07 November 2018

Areas of Interest ~ what we do www.npl.co.uk/ei Micromechanical Testing Instruments Prognostics Smart textiles Coatings PCB reliability Circular economy Sintered Interconnects Plastic Electronics ~ inks Advanced Conductive Adhesives Carbon Nanotube Interconnects SnPb & Pb-Free Moisture Diffusion Tin Whiskers Thermal properties SIR, SAM, XRF, … + access to many more facilities in NPL

Drivers & Metrology Drivers for electronics are: Miniaturisation (Moore's Law) Robustness (use in harsh conditions) Materials (legislation) New areas (wearable electronics) Supporting Industry (Aerospace, Automotive, Space, Health, and more) NPL is developing metrology for interconnect materials Tools to validate performance across a number of areas Combining electrical, mechanical, chemical, & thermal properties in mixed material systems and environments Tin whisker cause unpredictable shorts that have caused satellites to fail and nuclear power stations to shutdown.

Sector Impact of NPL EI work Wednesday, 07 November 2018Wednesday, 07 November 2018Wednesday, 07 November 2018Wednesday, 07 November 2018

Capability and interests in characterising interconnects Mechanical properties characterisation of interconnects Purpose designed equipment Time dependent properties Microstructural evolution in fatigue Polymer degradation Electrical effects Thermal effects Electrochemical characterisation Thin films at the surface and subsurface Material systems Smart textiles Solders, adhesives Substrate Coatings Plastic electronics & end-of-life High temperature performance Nano-carbon interconnect Sintered interconnects Substrates Wednesday, 07 November 2018Wednesday, 07 November 2018Wednesday, 07 November 2018Wednesday, 07 November 2018

Tutorials (webinar based) Electronic assembly performance Environmental Robustness: Measuring Performance Coatings and High Temperature Interconnects BGA Reliability - The Effects of Solder Joint Voiding and Uneven Stand-Off Height Tin Whiskers Evaluation Techniques & Benefits of Conformal Coating Assessment of Re-terminated RoHS Components for SnPb Applications Practical Applications for Printed Electronics Analytical techniques How to Test and Qualify Packages with Scanning Acoustic Microscopy Cleanliness Assessment Using Solvent Extract and Ionic Extraction to Improve Reliability Using Mechanical Testing to Diagnose Design, Product & Process Failures Characterisation of Solder Joints, Test Methods & Typical Failure Modes Using Surface Insulation Resistance (SIR) to Qualify Production Processes & Materials Solderability Assessment - Testing, Ageing & Practical Impact on Assembly Yield X-Ray Fluorescence Testing Results with Laboratory & Handheld Systems

Tutorials (webinar based) PCB issues Effectiveness of Baking to Remove Moisture from Between PCB Ground Planes CAF Conductive Anodic Filaments - How To Avoid Failure Process tools Guide to Temperature Profiling for Wave, Reflow and Selective Soldering Benefits of Using Nitrogen During Soldering and Determining PPM Levels Impact of Copper Dissolution in Lead-Free Manufacture with Different Alloys Novel systems Functionalisation and Applications of Nanomaterials for Electronic Applications Reuse of Electronic Products Practical Applications for Nano Electronics

Training & Practical Workshops Cleaning Printed Circuit Assemblies, Design & Process Control Package on Package (PoP), STACK Assembly, Rework and Inspection BMC (Bottom Mounted Component) LGA (Land Grid Array) QFN (Quad Flat No-lead) Design, Printed Circuit Board Inspection and Quality Control Practical Failure Analysis & How to Do it in Printed Board Assembly Counterfeit Component Workshop- Causes and Cures Troubleshooting Your Lead Free Assembly Yields - On Site or Offshore Lead-Free Selective Soldering, Design, Quality Control Vapour Phase & Convection Reflow – Selecting a Reflow Process Conformal Coating Application and Inspection Workshop BGA, CSP and Flip Chip PCB Design and Assembly Flexible Circuit Board Design and Assembly with Lead-Free Alloys PCB Microsectioning and Analysis of Failure Quality Standards 0201 0155 Component Design, Assembly and Inspection Basic Printed Circuit Board Manufacture and Process Defects Double Sided Reflow Design and Assembly Ball Grid Array Technology Design, Assembly and Inspection Practical X-Ray Inspection of BGA and Quality Standards Printed Board Design for Manufacture and Assembly in Lead Free Pin in Hole/Intrusive Reflow Design and Assembly Wire Preparation and Crimping Workshop Lead-Free Assembly and Soldering Hand Soldering and De-Soldering Hands On Solder Paste and Stencil Printing Quality Control of Surface Mount Assemblies Hands On Wave Soldering Static Control in Electronic Assembly Design and Assembly of SMT Boards Rework and Repair of Surface Mount and BGA A-Z of Modern Electronic Assembly of PCBs Reflow Soldering and Temperature Profiling Selecting Solderable Finishes for BGA and Fine Pitch Assembly PCB Microsectioning and Analysis of Failure Quality Standards