TK Upgrade report

Sensors R&D Sensors R&D based on HPK samples continuing efficiently A lot of data being collected, plan to converge on specs in Q1 2013, then move onto Market Survey Prototypes qualified with new vendor Infineon Austria: excellent quality Encouraging option to pursue, very good news in view of procurement, next steps planned R&D for pixel phase II continuing (planar silicon from HPK, 3d silicon, diamond) Needs to be boosted/structured in the coming future

FE Electronics and modules - I Good progress in the development of strip pT modules (“2S modules”) New version of readout chip (CBC2) submitted this summer Layout adapted to C4 bump-bonding onto high-density substrate Reads out 2x127 channels, for an assembly of two silicon sensors Implements a preliminary version of correlation logic Layout of a 2-CBC hybrid finalized, awaiting a quote from the provider Will be used to assemble “mini” 2S modules early next year, together with Infineon sensors (available) DAQ development also started, in view of coming beam tests Making progress in defining the overall electronics architecture in all details Including powering and controls Aim at finalizing specifications for CBC3 in Q1 2013 Will include all required functionalities Mechanical design of the module refined Prototyping of full-scale assemblies with dummy parts to start before the end of the year Purpose: optimize design of supporting mechanics and cooling, develop assembly procedures

FE Electronics and modules - II Development of pixellated pT module continuing, in both versions With horizontal interconnections (“PS modules”): Work in progress in the analogue front-end for the pixellated sensor, in 65 nm technology Exploring option to optimize correlation logic Module design refined With vertical interconnections (“VPS modules”) Electronics design progressing Launched new R&D line on edgeless sensors, to address concerns on yield for large-area modules

Track-trigger and back-end electronics Evolving organization following definition of the new Upgrade WGs Already established good communication with the Trigger Performance and Strategy Working Group Re-opened discussion on scope of Tracker Upgrade, Track Trigger, and related boundary conditions Positive and fruitful discussion A solid, well-understood and shared definition of the scope (with possibly some retuning), is highly desirable, but a big change of scope is not affordable Need to boost and structure the work on the track-trigger and back-end electronics, in cooperation with the TPSWG

Pixel phase II Starting to form a collaboration to design the ultimate CMS pixel chip 65 nm technology identified as the preferred option Several groups interested, exploring possible synergies with ATLAS Will now extend the discussion to more general system aspects

Comments and outlook R&D on sensors, FE electronics and modules progressing well Will now increase the focus on back-end processing of trigger info Overall, need a significant change of pace within the next 1-2 years, to deliver a working tracker by LS3 Freeze the concept Narrow down open options Structure pixel phase 2 upgrade Attract more people/groups to participate in the developments Plan to hold a series of topical mini-workshops in Q1-Q2 2013 Will serve as reviews of all the ongoing activities Will help to converge towards a fully defined project, and prepare for writing a TP in 2014