Overview of New Packages, Materials & Processes Ken Gilleo ET-Trends Ken@ET-Trends.com © ET-Trends LLC

AGENDA Telecom Overview; Internet & wireless MEMS and MOEMS basics MEMS and optical packages Packages; micro, performance Emerging packaging materials Conclusions © ET-Trends LLC

Communications Milestones <1900: telephone, telegraph, simple wireless 1940’s: military boosts technology 1950’s: solid state paradigm shift 1960’s: Telstar, satellite global links 1970’s: cellular phone, fiber optics 1980’s: technology enables portability 1990’s: photonic, new wireless, convergence 200X: World Wide Hub - Telecom Revolution © ET-Trends LLC

Last 50 Years Radio improves Solid State invented/implemented Fiber optics made practical Cellular advances INTERNET – a major event! © ET-Trends LLC

Tomorrow’s Telecom Cellular proliferates and morphs! Internet becomes the World Wide Hub Everything becomes portable, even wearable Every person and business wants connectivity All of this drives innovation: Devices Packaging Circuitry Assembly © ET-Trends LLC

RF Wireless; Bluetooth, etc Long-Haul Fiber Backbone Net Centric Satellite RF RF Wireless; Bluetooth, etc Submarine Fiber Link amplifiers Free Space Photonics Long-Haul Fiber Backbone Metro Ring Loop Access Regional Ring gilleo Submarine Fiber Link © ET-Trends LLC World Wide Hub

Exponential Bandwidth but why & how? Terebits Internet Goal: Unlimited Bandwidth? YEAR Source: RHK and others © ET-Trends LLC

Communications Links Internet Terrestrial (and submarine) Electronics Copper wire Computer-based Routers Photonics (channeled) Fiberoptics used extensively for backbone links High tech multiplexing is evolving quickly Wireless - Free-Space Bluetooth - short range Cellular (newest have IP) Satellite; new services Fiberless Optics - short and medium-range links © ET-Trends LLC

Electromagnetic Spectrum Not to precise scale Megahertz (103 Hz) 1016 1014 1012 1010 108 106 104 102 100 1011 103 Today’s Photonics wavelengths Bluetooth Visible UHF microwave FM UV IR RADIO Cosmic Rays Gamma Rays X-rays Rays More Bandwidth © ET-Trends LLC

Conductors Electronics Photonics Optical Fiber - - - - - Single-mode Copper Optical Fiber Skin Effect: Electrons travel closer to surface as frequency increases; can radiate as RF 8.6 – 9.5 mm Cladding 125 mm - - - - - Single-mode Fiber - - - - - © ET-Trends LLC

Basic Telecom Photonics Convert e- data or voice to modulated light Transmit through optical fiber Convert to electronic Direct signals using routers Convert back to photonic © ET-Trends LLC

How do we get more bandwidth? Increase data rate. Add more fibers. Multiplex the signals (colors). All are being done, but number 3 can give a plus-10,000% bandwidth boost without adding fiber. DWDM = Dense Wave Division Multiplexing © ET-Trends LLC

Optical Backbone WDM = Wave Division Multiplexing Switch- Router DMUX Long-Haul Optical Fiber WDM = Wave Division Multiplexing ONE FIBER A single fiber can transmit 100’s of colors and each acts as a separate high-speed channel Many colors. Multiplexing mimics multiple fibers Optical Backbone Switch- Router DMUX MUX Multiplexer Combines individual signals. Demultiplexer (separates into individual signals. © ET-Trends LLC

Today’s Interconversion photons O-O MEMS switches Detectors, sensors Sources; Lasers O-E-O switches electronics © ET-Trends LLC

The Switch Glitch Internet Back-Bone uses photons Switching is double conversion Need to all-optical switching, but how? Can we use optical MEMS? What’s optical MEMS (MOEMS). e l Switch l Switch © ET-Trends LLC

Enter the MEMS World Optics Where all technologies converge The convergence point of electronics, mechanics, physics, chemistry and biology, etc. Electronics Mechanics MEMS MOEMS OE OM Optics Where all technologies converge © ET-Trends LLC

Micro-Opto-Electro-Mechanical System MEMS/ (MOEMS) Micro-Opto-Electro-Mechanical System Semiconductor processes are used. Merges mechanical motion, light & electronics High Versatility sensing computing motion Control including light © ET-Trends LLC

MEMS Structures IBM MEMS DNA Detector © ET-Trends LLC

MEMS “Engines” Electrostatic; very efficient* Thermal; easy to implement Electromagnetic Pneumatic Hydraulic Photoelectric *Surface area is relatively high, mass is very low; surface effects are important © ET-Trends LLC

MEMS Concerns Some devices are fragile Most are shock-sensitive Most devices can stick; “stiction” New packages are needed Special assembly for some Optics adds assembly complexity Stuck © ET-Trends LLC

(air bag sensor example) Stiction Problem (air bag sensor example) Stuck Analog Devices Chip Sensing Mechanism (Analog Devices) High surface area = high attraction = “STICTION” Result of rough handling = “dead” component © ET-Trends LLC

“New” Packaging Materials Getters Moisture Particle Active gas Coatings Vapors Parylene; fluorintated; Nova NT © ET-Trends LLC

Traditional Packaging Few Standards High Cost! © ET-Trends LLC

Cronos (JDS-Uniphase) Optical MEMS or MOEMS Fiber Alignor Cronos (JDS-Uniphase) Micro-Mirror Lenses Array Rotating Mirror-UCLA Pop-Up Lens © ET-Trends LLC Micro-Mirror Array - TI Shutter - Sandia Cross-switch mirror

TI MOEMS: Micro-Mirrors on off on World’s most complex machine! on on on off on © ET-Trends LLC Ref. “Digital Light Processing TM for High-Brightness, High-Resolution Applications” Larry J. Hornbeck, Ti.com

Other Optical Switches 4 x 4 switch Other Optical Switches l1 Binary Mirror; on/off 2-Axis Mirror 3D, point anywhere MARS Mech. Anti-Reflective Switch (Lucent) Bubble (Agilent) Optical Transistor ??? WaveStar Lucent Agilent patent drawing © ET-Trends LLC

MEOMS Packaging Types Traditional hermetic; metal or ceramic New Cap-on-Chip wafer-level device-level Near- and non-hermetic Selective packaging for accessibility © ET-Trends LLC

TI’s MOEMS Package WINDOW HEAT SINK HERMETIC Getter Weld or seal Ceramic HEAT SINK HERMETIC 250,000 mirrors MEMS Digital Mirrors one section © ET-Trends LLC

New Cap-on-Chip Overmolding MEMS Chip Cap Vacuum Seal 1. Apply cap to device or wafer; solder, weld, bond. 2. Attach & bond device 3. Conventional overmolding followed by solder ball attach. © ET-Trends LLC

MOEMS Window Cap Optical Encapsulant Transparent Cap MOEMS AMKOR’s Vision Pack? © ET-Trends LLC

Other Optical Packages Intrasia Glass Substrate Wafer Level Packaging: Intrasia Glass Substrate A Cavity Type CSP Glass MOEMS ShellCase © ET-Trends LLC

Advanced Packaging Trends 10 December 1996 Time TO Can DIP Density/efficiency PQFP FC BGA Notes: CSP Electronic Packages © ET-Trends LLC Some drawings from Joe Fjelstad 3 3

Packaging Change Drivers Miniaturization Area Height Weight Performance High lead count High frequency; processors, RF MEMS/MOEMS; a new technology cluster Reduction Boost © ET-Trends LLC

Advanced Packaging Types Advanced BGAs Flex-Based MultiChip Array Molded CSP Wafer-Level CSP and FC © ET-Trends LLC

Packaging Miniaturization Flip Chip FCOB (on board) FCIP (in package) CSP MultiChip Package Single plane Stacked © ET-Trends LLC

Chip Scale Packaging Flex-based doing well Wafer-level; strong trend Area molding reduces cost © ET-Trends LLC

CSPs © ET-Trends LLC µBGA is a registered trademark of Tessera, Inc. Shellcase NS µBGA is a registered trademark of Tessera, Inc. © ET-Trends LLC

Flip Chip BGA © ET-Trends LLC

Flip Chip Trends About 80% is FCIP Virtually all high I/O chips are FCIP New underfills Molded (FCIP) No Flow (FCOB) Cost reduction continues Bumping Integral underfill US 6,194,788 Issues Feb. 27, 2001 © ET-Trends LLC

Flex-BGA TapeArray™ BGA Singulated edge Mold Compound Die Attach Polyimide Tape Wire Bond TapeArray™ BGA Singulated edge © ET-Trends LLC

MultiChip Packages Single-Plane Stacked © ET-Trends LLC Drawings from Pacific Consultants, LLC

Molded in strip format © ET-Trends LLC

Wafer Scale CSP & FC Lower Cost CSP All processing on the wafer Fan-in structure Wafer Level Packaging: Shellcase © ET-Trends LLC

Bluetooth Short-range inter-device wireless Shared frequency; 2.4 - 2.5 GHz (ISM) band Uses ceramic CBGA module Clean room assembly? Tighter board & assembly tolerances When will Bluetooth really take off? © ET-Trends LLC

Modern Wireless © ET-Trends LLC

Conclusions Telecom is driving packaging & assembly Performance drives up density Packages getting smaller; 202s, FC, CSP New telecom packages New packaging materials Biggest are still opportunities ahead © ET-Trends LLC