ALICE-MFT-WP5-FPC- vidyo

Slides:



Advertisements
Similar presentations
1 Pixel Bus Development Atsushi Taketani RIKEN/RBRC 1.Who is working 2.Over view of pixel bus 3. Manufacture process 4. Issues 5. Development / Production.
Advertisements

Status of Al-FPC development for IB A. Di Mauro, A. Junique, P. Riedler ITS-MFT mini-week
MFT Progress Report Ginés Martínez García for the MFT project ALICE mini-week, Sep 1 st -5 th 2014.
SPD general meeting Pixel bus and Pilot MCM Integration CERN October 8, 2002.
1 CARRIER BUS LAYOUT(a) ± 193 mm ladder1ladder mm mm Pixel chip Michel Morel EP/ED 09/ x 425µ 256 x 50µ Decoupling capacitors
STATUS OF THE CRESCENT FLEX- TAPES FOR THE ATLAS PIXEL DISKS G. Sidiropoulos 1.
IB stave assembly A. Di Mauro, C. Gargiulo, J. Van Beelen ITS-MFT mini-week
VELO upgrade electronics – HYBRIDS Tony Smith University of Liverpool.
WP7&8 Progress Report ITS Plenary meeting, 23 April 2014 LG, PK, VM, JR Objectives 2014 and current status.
Hybrid Integrated Circuit
CVD PCB, first steps. 15 mm 25 mm Chip area. No ground plane underneath the chip. Bulk isolated => only one ground line Power lines Connector: 11,1mm*2,1mm:
FE-I4a Single Chip Card issues V. Tyzhnevyi HEP group, University of Manchester.
GigaTracker Working Group meeting Status of the GTK_carrier /03/2015.
1 Physics of Compressed Baryonic Matter 12 th CBM Collaboration Meeting R&D ON MICRO-CABLES FOR BABY SENSOR RADIATION TEST MODULE October , 2008.
High Density Interconnect (WBS 1.4.3) Extension Cables (WBS 1.4.4) Douglas Fields University of New Mexico Douglas Fields, FVTX DOE Review November 17,
Update on tendering for HIC automatic assembly system A. Di Mauro ITS Upgrade Plenary,
EP/ED group meeting1 ALICE PIXELS DETECTOR.
Dummy and Pad Chips Needed for various activities (interconnection tests, mass tests, assembly,…) Production of masks, processing, thinning and dicing.
RP detectors CTS Sensors now in production, full delivery between February and June 07 Production GUI and DB being finalised Test Procedure being defined.
WP6 meeting 30/07/2013. Status of flex prototypes production New laser soldering tests Discussion on mass production schedule.
WP6 status report A. Di Mauro (CERN) ITS plenary meeting
Low Mass Rui de Oliveira (CERN) July
MFT WG5: ladder disk and global assembly Stéphane BOUVIER & Sébastian HERLANT MFT WG7: Mechanics and Thermal studies Jean-Michel BUHOUR & Emili SCHIBLER.
Vessel dimensions GTK assembly carrier Electrical connections Cooling pipes integration Vessel alignment with the beam Next steps Conclusion 3/10/20102.
The Development of the Fabrication Process of Low Mass circuits Rui de Oliveira TS-DEM.
CERN SPD meeting, 4/06/2002V. Manzari for Bari SPD-Group1 Half-stave assembly Gluing procedure & glue characteristics Status of dummy components.
Pixel Atsushi Taketani RIKEN RIKEN Brookhaven Research Center 1.Overview of Pixel subsystem 2.Test beam 3.Each Components 4.Schedule 5.Summary.
Dec
Vessel dimensions GTK assembly carrier Electrical connections Cooling pipes integration Vessel alignment with the beam Next steps Conclusion 3/23/20102electro-mechanical.
WP7&8 Progress Report ITS Plenary meeting, 10 June 2014 LG, PK, VM, JR.
Report on dummy detector Equipped with Heater & sensors NA62 GigaTracker Working Group Meeting May 24 th 2011.
Module Assembly Jig Status Cambridge and DESY came to Liverpool Nov. 15 th -16 th for training on module assembly – A complete jig set was sent back with.
Integration of the MVD Demonstrator S. Amar-Youcef, A. Büdenbender, M. Deveaux, D. Doering, J. Heuser, I. Fröhlich, J. Michel, C. Müntz, C. Schrader, S.
Origami and PA design 6 February 2012 Christian Irmler (HEPHY Vienna) 1 Common SVD-PXD Meeting.
DEPFET Workhop, Ringberg, June Ladislav Andricek, MPG Halbleiterlabor Lessons learned from EMCMs assembly status - next steps.
B2GM, Nov 2014 Laci Andricek, MPG Halbleiterlabor 1 PXD Module Assembly - Overview and SWB bumping -
Andrei Nomerotski 1 Flex Status & AID A.Nomerotski, 18 June 2010.
De Remigis The test has been accomplished with an SLVS signal, since that was chosen for the serial communication between the readout and the optical converter.
Florian Buchsteiner (HEPHY Vienna)
SVD Electronics Constraints
Jan 2016 Solar Lunar Data.
T. Bowcock University of Liverpool
Hybrid Pixel R&D and Interconnect Technologies
ob-fpc: Flexible printed circuits for the alice tracker
T1 status (a selection from EDR presentations)
Wiring the Breadboard (the right way).
Meeting at CERN March 2011.
LHCC Upgrade Session, 12 March 2013
1IPHC Strasbourg, France, 2CERN, Geneve, Suisse
Design of Flexible Printed Circuit Prototype towards RD53 IC
Average Monthly Temperature and Rainfall
Module/Ladder Assembly
Gantt Chart Enter Year Here Activities Jan Feb Mar Apr May Jun Jul Aug
Flex Status A.Nomerotski, 4 May 2010.
LPKF Laser Direct Structuring System
Electricity Cost and Use – FY 2016 and FY 2017
Text for section 1 1 Text for section 2 2 Text for section 3 3
Text for section 1 1 Text for section 2 2 Text for section 3 3
Text for section 1 1 Text for section 2 2 Text for section 3 3
Text for section 1 1 Text for section 2 2 Text for section 3 3
Text for section 1 1 Text for section 2 2 Text for section 3 3
Text for section 1 1 Text for section 2 2 Text for section 3 3
Text for section 1 1 Text for section 2 2 Text for section 3 3
Text for section 1 1 Text for section 2 2 Text for section 3 3
Text for section 1 1 Text for section 2 2 Text for section 3 3
Text for section 1 1 Text for section 2 2 Text for section 3 3
Manufacturing Processes
Possible types of Si-sensor: SILICON CALORIMETRY FOR A LINEAR COLLIDER G.Bashindzhagyan, Il Park August Silicon sensor.
Building pattern  Complete the following tables and write the rule 
Presentation transcript:

ALICE-MFT-WP5-FPC- vidyo-2015-07-08 Flexible Printed Circuit (FPC): old FPC # name sensor capas holes ears queue pattern eyes Fab Cu Fab Al fab stainless chip cabling SMD cabling documentation goal 1 meca 5 LoI type 30 no - 12 CERN (Oct13) ? WG5 ALICE – MFT – FLC13 – R012 – A (12-Dec-2013) Test manual cutting precision (WG4) Test gluing on a stiffener (WG5) 3 alim yes 3 CERN (Dec13) 2 Ouestronic (Mar14) ALICE – MFT – FPC14 – R004 – A (27-May-2014) Power supply routing constraints (WG4) 4 lvds Test lvds transmission in aluminium (WG4) 5 its 5 ITS TDR type 82 11 8 ALICE – MFT – FPC14 – R001 – A (25-Feb-14) Verify routability (WG4) 6 7 tdr 5 MFT TDR type 10 5alpv0 5 alpide-v0 2 16 14 Verify routability of alpide (WG4) 07-jul-15-v2 Subatech, IN2P3/CNRS-l’UNAM, Nantes, F44307, France Ch.Renard, Alice-Upgrades

ALICE-MFT-WP5-FPC- vidyo-2015-07-08 Flexible Printed Circuit (FPC): actual FPC # name sensor capas holes ears queue pattern eyes Fab Cu Fab Al fab stainless chip cabling SMD cabling documentation goal 2 bond 5 mimosa32-v4 10 3 no - 10 CERN (Jul14) ? Test laser cutting (WG4) Test bonding (WG4) 8 dumy50p 5 dummy 50pin 16 14 18+ ACB (Oct 14) ? WG5 4 WG5 Submitted 27 March 2015 Test laser soldering (WG5) 9 20 CERN (Nov14) Prepare for transmission test in aluminium(WG6) 11 3 dummy 50pin 15 13 yes 30 ACB (Mar15) 20 Ouestronic (15) Test assembly on disk (WG5&7) 12 23 17 20 CERN (May15) 2 Ouestronic (ju15) Test gluing for smd components (WG5) 13b aspi 3 Pochoir (May15) 07-jul-15-v2 Subatech, IN2P3/CNRS-l’UNAM, Nantes, F44307, France Ch.Renard, Alice-Upgrades

ALICE-MFT-WP5-FPC- vidyo-2015-07-08 Flexible Printed Circuit (FPC): next FPC # name sensor capas holes ears queue pattern eyes Fab Cu Fab Al fab stainless chip cabling SMD cabling documentation goal 13 dumy50p 3 dummy 50pin 23 3 14 yes 8 21 CERN (oct 15?) - no Test laser soldering (WG5) 13c aspi 12+ ? ACB () ? Pochoir () 14a 3alpv3 3 alpide-v3 15 10 7 CERN (oct 15?) Electrical test of full ladder 14b 5alpv3 5 alpide-v3 12 07-jul-15-v2 Subatech, IN2P3/CNRS-l’UNAM, Nantes, F44307, France Ch.Renard, Alice-Upgrades

ALICE-MFT-WP5-FPC- vidyo-2015-07-08 Signals, planes, holes, & components on FPC#14 AGND (bottom) DGND (bottom) AVDD (top) DVDD (top) Screw hole Pinhole Oblong vias for laser soldering “eye” Opening PWELL-SUB pattern pattern Data pairs (top) Clock bus pair (top) Control bus pair (top) Termination res. ITS routing constraints: minimum wire width 100µm, minimum gap 100µm, metal 25µm, Kapton 75µm, finished holes 220µm Footprint of ITS pALPIDE version 3 7 ordered to CERN (aluminium version) PWELL and SUB lines included “eye” openings for optical survey of chip position and position on table included 07-jul-15-v2 Subatech, IN2P3/CNRS-l’UNAM, Nantes, F44307, France Ch.Renard, Alice-Upgrades

ALICE-MFT-WP5-FPC- vidyo-2015-07-08 2 possible positions for barcode to be engraved on TOP layer of FPC#14 07-jul-15-v2 Subatech, IN2P3/CNRS-l’UNAM, Nantes, F44307, France Ch.Renard, Alice-Upgrades