1. Update on tendering for HIC automatic assembly system A. Di Mauro ITS Upgrade Plenary, 01.09.2014

2. 01/09/20142 Market survey outcome 7 out of the 19 invited companies replied to the MS: HACKER (DE)PACTECH (DE)UNITECHNOLOGIES (CH)VEA (IT) – BAUMANN (DE), HACKER (DE), INFOTECH (CH), PACTECH (DE), UNITECHNOLOGIES (CH), VEA (IT), VECTA (FR) 5 additional companies replied spontaneously: – DEMCON (NL), IBS (NL), NEITRACO (NL), SCOTLAND EL. (UK), SETTELS SAVANIJE (NL) Analysis of replies in progress: – the majority of companies has provided the required information in Technical Questionnaire – 6 can be considered qualified for the tendering – the other 6 have been contacted for clarifications (missing or wrong information, missing references of similar supplies) HIC automatic assembly green (in green : known companies)

3. Status of Technical Specifications The document with technical specifications is in preparation, MFT has been included since they will use one of the machines for their HICs Most relevant points for the baseline system: – The ITS Upgrade project will supply the laser head, the work tables (plate with vacuum chuck for chips, soldering mask and lid for vacuum) for IB, OB and MFT, the soldering balls transfer tools (multi- and single-ball), needle probe card system. – Assembly sequence: 1.Automatic chips placement in nominal positions wrt to an external reference on the vacuum chuck with an accuracy of ± 5 µm 2.Manual placement of FPC and soldering mask by the operator in nominal positions defined by locating pinholes, check of alignment between holes and pads by the operator 3.Manual placement of soldering balls using our transfer tools; check by automatic vision system and manual correction of faults using the single-ball tool 4.Manual tightening of lid and vacuum start 5.When P ~ 2x10 -1 mbar, the laser soldering is started by the operator and each interconnection is performed automatically performed in sequence (tolerance on laser positioning of ± 10 µm) – Quality assurance tasks for the vision system: 1.Chips integrity 2.Soldering joints (2D and 3D, data to be processed by us) 3.Metrology of assembled HIC (measurement of chips position using openings on FPC corresponding to markers on chips) – Electrical test of chips using the needle probe card supplied by us (function implemented only in two machines). 01/09/20143HIC automatic assembly

4. Status of Technical Specifications Options for alternative system: A.Manual chip placement by an operator using a joystick-like control of moving stages and camera assistance. Solution proposed by a company as possible mean of cost reduction since the time constraints are not very tight wrt usual capabilities of automatic assembly systems. Possible issue with homogeneity and quality of distributed production. B.Automatic placement of soldering balls using a system proposed by the bidder. Summary of various required quotations: 1.Baseline system: 1 prototype (CERN) + between 3 and 6 machines for distributed production* 2.Cost for implementation of chips testing with probe card in two machines 3.System with option A (1 proto + 3 to 6 machines) 4.Cost for option B 01/09/20144HIC automatic assembly (* potential sites: China, France, Italy, Netherlands, South Korea, UK, USA; final number decided on the basis of cost)

5. Timeline Market Survey: clarify all issues and contact reference clients for “doubtful” companies within Sept 10 Tendering: finalize technical Technical Specifications by Sept 3 Meeting with tendering committee after ~ 1 week to validate company selections and Tech. Specs. Send Invitation to Tender on Sept 15 01/09/20145HIC automatic assembly