Contacts:- For enquiries, please contact the following members: Consortium Chairman/ Microwave Circuit Design Dr. Chew Siou Teck csioutec@dso.org.sg Tel: 65-68712008 Antenna Design Dr. Ooi Ban Leong eleooibl@nus.edu.sg Tel: 65-68747942 Foundry Service Wong Chee Khuen Stephen ckwong@simtech.a-star.edu.sg Tel: 65-67938490 Photonics Packaging Design Dr. Ong Ling Chuen Michael ongmichael@i2r. a-star.edu.sg Tel : 65-68709155 SUBSTRATE AND MICRO-PACKAGING RESEARCH FOR INDUSTRY AND MILITARY APPLICATIONS CONSORTIUM (SPRIMA) The Substrate and Micro-Packaging Research for Industry and Military Applications (SPRIMA) Consortium was formed in January 2003 to develop design and manufacturing capability in Low Temperature Co-Fired Ceramic (LTCC) technology. By leveraging on the strengths of four institutes: DSO National Laboratories (DSO), National University of Singapore (NUS), Institute for Infocomm Research (I2R) and Singapore Institute of Manufacturing Technology (SIMTech), this consortium will develop dual-use technologies in wireless communication and broadband digital electronics. This is a strategic research project jointly funded by A*STAR (Agency for Science, technology and Research) and DSTA (Defence Science and Technology Agency). This consortium has accumulated significantly rich intellectual properties in design and fabrication in the areas of antennas, high speed digital, photonics and microwave interconnects and circuits. SPrima is keen and ready to engage in prototyping services for commercial applications. It is also keen to collaborate with strategic partners for future research and development. LTCC DESIGN, FABRICATION AND BROADBAND CHARACTERISATION DESIGN High-Speed Signal Integrity Analysis Power Distribution Modelling and Simulation Embedded Passives Modelling and Simulation Virtual Prototyping FABRICATION High-density flip chip substrate High-Density Multi-Layer Interconnection Integration of Embedded Passives CHARACTERISATION 20 GHz Multi-Port Frequency Domain Analysis 10 Gb/s Eye Diagram Analysis APPLICATIONS Optical Networking High-Performance Computing Broadband Data Communications Power distribution resonance analysis 10 Gb/s performance validation

LTCC Low Loss Vertical Interconnect & Millimetre-wave Package IMPLEMENTATION OF OPTO – Tx/Rx on LTCC MODULES LTCC Low Loss Vertical Interconnect & Millimetre-wave Package Fibre Fibre Stopper DESIGN Design Microstrip to stripline transitions Coplanar Waveguide to stripline transitions Millimetre-wave package design LTCC MCMs for Radio-over-Fibre (RoF) application Flip-chipped bare-die Vertical Cavity Surface Emitting Lasers (VCSEL) and detectors Design of individual transmitter and receiver subsystem Characterisation of IC chips and opto-electro components in LTCC 125m 50m PD/VCSEL Characterization LNA/Driver Fibre alignment in LTCC APPLICATIONS Back-to-back microstrip to stripline transition Frequency : multi-band up to 40GHz Insertion loss: <-1dB Return loss: <-20dB Opto-electro modules for communication applications RF modules for wireless applications Fibres Fibres LTCC Rx LTCC Rx LTCC Tx LTCC Tx Filters Filters Caption Caption PA PA LNA LNA LTCC ANTENNA DESIGN PCB/LTCC motherboard PCB/LTCC motherboard Opto-electro modules in LTCC Ultra-Broadband Antenna and Array Design Multi-Band Antenna Design Fractal Antenna Design Triple-band antenna design for GSM and IEEE 802.11b WLAN applications Transient fields characteristic in LTCC aperture coupled antenna due to Gaussian pulse excitation Novel multi-band photonic-band-gap antenna design for GSM and IEEE 802.11b WLAN applications Back-to-back CPW to stripline vertical transition Frequency: DC - 40GHz Insertion loss: < -0.6dB Return loss: < -15dB Back-to-back millimeter-wave package Frequency: DC - 40GHz Insertion loss: < -0.7dB Return loss: < -15dB Wide-band array antenna design for IEEE 802.16 WLAN and LMDS applications Fabricated LTCC balun network Applications Miniaturized T/R module MMIC integration