ICT 25 Generic micro- and nano-electronic technologies Marc Boukerche DG CONNECT, A.4 Components

Technology context ICT 25

What we want To keep Europe's position at the forefront of advanced micro- and nano-electronic technologies developments To ensure strategic electronic design and manufacturing capability in Europe avoiding dependencies from other regions

Objective The objective is to sustain the historical integrated circuit scaling cadence and reduction of cost/function into future decades The technological challenges in information processing and communications based on memory and logic devices, circuits and architectures for advanced CMOS technologies New alternative information processing devices and microarchitectures for existing or new functions

Research & Innovation Actions Extend MOSFET to the end of the ITRS roadmap Make "Beyond and Extended CMOS" devices CMOS compatible Integrate functionalities in System-on-Chip (SoC) / System-in-Package (SiP) New computing paradigms like quantum computing and neuromorphic computing with a focus on their future integration with Si technologies Design for advanced nanoelectronics technologies. Focus on: Energy efficiency, high reliability, robustness. Focus on high mobility substrates for performance improvement, new switch architectures for reduced energy dissipation, 3D approaches, new information carriers, emerging memory devices and on interconnecting nanoscale objects and novel interconnect architectures. Project may include activities related to modelling and simulation: e.g. quantum and atomic scale effects. R&D on Graphene devices is not included under this objective. by using nanostructures and/or nanodevices. 38 M€ - 100% funding

Innovation Actions 7 M€ - 70% funding Access to advanced design tools and IC fabrication (includes training) Assessment for technology suppliers in nano-electronics Evaluate novel equipment, processes and building blocks with potential customers Awareness actions targeted at young students Action targeted for academia, research institutes and SMEs. Including access to technology platforms for piloting small series of advanced products. Actions should include training. Including tools and methods for metrology and characterisation. Open to international cooperation.

Coordination and Support Actions International cooperation (US/Asia) Standardisation - 450mm wafers - Potential impact on workers of the manipulation of nano-materials in the semiconductor fabrication Development of common roadmapsAwareness actions targeted at young students 3 M€- 100% funding

Expected impact Regain market share in electronic components Maintain the European manufacturing base Secure the availability of essential parts in the value chain (design and manufacturing) Technology: - Sustain the scaling cadence - increase n° of devices / mm 2 – 10 nm feature size - 3D approach - Maintain the x2 transistor density every 18 months Innovation: Easy access to design tools and IC manufacturing (Academia, Research inst, SME) Assessment of equipment (Equipment industry)

Timing  Publication:15 October 2014  Deadline:14 April 2015 (17h00 Brussels time) Attention  New funding rules  New evaluation criteria ICT 25 – Generic micro- and nano-electronic technologies

R&D with low exploitation, innovation, impact Research focused only on materials Research focused on smart systems integration (done in ICT 2) What we do NOT want

Don't forget ICT 25 – Generic micro- and nano-electronic technologies Underpinning European leadership in technology development, design and production Automotive, transport, aerospace, medical & health, home appliances, energy networks and security systems Actors (Joint Undertaking)  ARTEMISIA, AENEAS, EPoSS  EC  Member States About EUR 5 Billion EU 1.2 Bn, MS 1.2 Bn, Industry 2.4 Bn

"Put Innovation at the Core of your Proposal" Oct 2pm 'Health & Well-Being' Village Advice from the EC and two experts who were evaluators in H2020 Call 1

Questions: DG CONNECT: Electronics: ECSEL: ICT 25 – Generic micro- and nano-electronic technologies