QXF Coil Insulation during Each Step QXF Coil WG Miao Yu 08/22/2013

Winding and Curing 2 IR: 75 mm OR: mm 175 µm (7 mil) S2 glass 125 µm (5 mil) S2 glass sleeve 500 µm (20 mil) S2 glass Cable width (mm)BareInsulated and reacted Current cable Lower Upper

Insulation on End Parts 3 No plasma coating on the pole 250 µm(10 mil) coating on end parts in red 175 µm (7 mil) S2 glass between end parts and the cable

Ramp Area µm (7 mil) S2 Glass for ramp area (glue to cover the edges) µm (7 mil) S2 Glass for L µm (7 mil) S2 Glass for L2

Leads through saddles µm (7 mil) S2 glass 175 µm (7 mil) S2 glass

Leads through splice blocks during Curing and Reaction 6 G10 shim for curing SS shim for reaction IL LE OL LE 175 µm (7 mil) S2 glass

IL Curing 7 Midplane 760 µm (30 mil) 3 layers 10 mil Mylar 250 µm (10 mil) 1.5 mm (60 mil) Curing Retainer 250 µm (10 mil) SS shim Curing Shell OR: mm IR: mm 250 µm (10 mil) Mylar µm (4mil) shrink wrap

Coil cross-section during OL curing 8 Midplane OR: mm 760 µm (30 mil) 100 µm shrink wrap µm SS Shim 250 µm (10 mil) 1.5 mm (60 mil) Curing Retainer 250 µm (10 mil) SS shim 250 µm (10 mil) SS shim

Coil cross-section during reaction µm (5 mil) MICA 125 µm (5 mil ) MICA 125 µm (5 mil) MICA 125 µm (5 mil) MICA Midplane 250 µm (10 mil) S2 glass 125 µm (5 mil) MICA 125 µm (5 mil) MICA

Splices Area µm (2 mil)/layer Kapton 7 layers Splice 3 pieces of folded Kapton + 1 piece of flat Kapton G10 pieces Voltage tap 175 µm (7 mil) S2 glass Cut S2 glass Remove cable insulation 350 µm 175 µm

Coil cross-section during impregnation µm (6 mil) S2 glass 100 µm (4 mil ) Polyimide trace 150 µm (6 mil) S2 glass 100 µm (4 mil) Polyimide trace 250 µm (10 mil) MYLAR (mold released, removed after impregnation) 125 µm (5 mil) MYLAR (mold released, removed after impregnation) 125 µm (5 mil) G11 Midplane RTV

Impregnated coil dimension 12 Midplane IR: mm OR: mm Gap: 125 µm (5 mil)