DOE CD-2/3a Review of the BTeV Project – December 14-16, 2004 1 BTeV Pixel Detector Pixel Module Assembly and Half-Plane Assembly Guilherme Cardoso James.

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Presentation transcript:

DOE CD-2/3a Review of the BTeV Project – December 14-16, BTeV Pixel Detector Pixel Module Assembly and Half-Plane Assembly Guilherme Cardoso James Fast C. M. Lei

DOE CD-2/3a Review of BTeV Project – December 14-16, 2004 Substrate and Half-Plane Assembly – C. M. Lei 2 Pixel Module Assembly Tooling  Take advantages of ATLAS pixel detector experience  Port card (PC) to provide needed electrical circuitry and HDI holding by vacuum suction  Extra long tabs of high-density interconnects (HDI) to provide testing and burn in  Assembly steps summary:  Align and glue a pixel module (consisting of the sensor bump-bonded with read-out chips) to an HDI; Alignment tolerance : 100 microns  Wire bond all electrical connections except that for high voltage (HV)  For HV, solder a flex circuit to the HDI and bond the other end to the back of sensor with epoxy HDI Decoupling Capacitors and Termination Resistors Wire Bonds FPIX Chip Sensor High Voltage Data PIFC Power PIFC

DOE CD-2/3a Review of BTeV Project – December 14-16, 2004 Substrate and Half-Plane Assembly – C. M. Lei 3 Pixel Module Assembly Steps 1 & 2 Assemble PC on a vacuum chuck Align and glue HDI on PC Wire bond HDI to PC Test HDI for opened traces Step 1 Align pixel module (PM) to PM vacuum holder Step 2 Port card (PC) PC vacuum chuck PM vacuum holder PM with alignment targets at corners exposed

DOE CD-2/3a Review of BTeV Project – December 14-16, 2004 Substrate and Half-Plane Assembly – C. M. Lei 4 Pixel Module Assembly Step 3 Position HDI with its vacuum chuck on to pixel module alignment jig Place spacers for PM vacuum plate (The thickness of the spacers will provide some clearance between pixel module and HDI) Step 3 pixel module alignment jig spacers

DOE CD-2/3a Review of BTeV Project – December 14-16, 2004 Substrate and Half-Plane Assembly – C. M. Lei 5 Pixel Module Assembly Step4 Engage PM vacuum holder Align HDI to PM with the aid of CMM then vacuum hold the HDI vacuum chuck when done Step 4 Stationary HDI with its chuck are moved freely under stationary PM

DOE CD-2/3a Review of BTeV Project – December 14-16, 2004 Substrate and Half-Plane Assembly – C. M. Lei 6 Pixel Module Assembly Step 5 Remove PM vacuum holder Change spacers (The thickness of the spacers will provide 50 micron glue between PM and HDI) Dispense epoxy on HDI Re-engage PM vacuum holder, and start gluing PM to HDI Step 5

DOE CD-2/3a Review of BTeV Project – December 14-16, 2004 Substrate and Half-Plane Assembly – C. M. Lei 7 Pixel Module Assembly Step 6 Glue flex circuit Complete HV connections Wire bond PM to HDI Step 6 Flex circuit for HV connections Note: The flex circuit is already soldered to the HDI at this point

DOE CD-2/3a Review of BTeV Project – December 14-16, 2004 Substrate and Half-Plane Assembly – C. M. Lei 8 Pixel Module Assembly Step 7 Transfer and fasten PC to HDI storage base plate Install HDI cover plate Conduct module burn in and testing Step 7 HDI cover plate

DOE CD-2/3a Review of BTeV Project – December 14-16, 2004 Substrate and Half-Plane Assembly – C. M. Lei 9 Pixel Module Assembly Step 8 Remove HDI top cover plate and base plate Fasten PC on its vacuum chuck Remove HDI to HDI wire bonds Cut HDI at designated slots of PC Pixel module formed and ready for half- plane assembly Step 8 cutting slots on PC

DOE CD-2/3a Review of BTeV Project – December 14-16, 2004 Substrate and Half-Plane Assembly – C. M. Lei 10 Half-Plane Assembly  Module placement accuracy of 5 microns is required  Modules will be held by the HDI (wider section) so that fiducial targets at the sensor corners can be seen optically from the top  4-axis stages will be used for precise positioning of modules  Optical targets visible on both sides of the substrate will be used to tie the alignment of modules on one side of the substrate to the modules on the other side  Reliable gluing process is needed which will not damage the substrate or the sensors  Even, thin joints require significant gluing loads  Substrate must be supported from the back side with vacuum plates For second side, support is through first side sensors

DOE CD-2/3a Review of BTeV Project – December 14-16, 2004 Substrate and Half-Plane Assembly – C. M. Lei 11 Half Plane Assembly Steps 0. Glue flex cables on substrate 5. Flip the half populated substrate and vacuum plate holding the silicon modules 6. Repeat steps 1 and 4 with a new set of modules and vacuum plate. Half-populated substrate starts at step Wire bond HDIs to flex cables 4. Align substrate to modules and allow glue to cure 3. Apply glue on substrate 2. Engage substrate into substrate holder then place on stage 1. Align and load modules on vacuum plate 8. Test all modules

DOE CD-2/3a Review of BTeV Project – December 14-16, 2004 Substrate and Half-Plane Assembly – C. M. Lei 12 Module is loaded individually with HDI side down onto module vacuum holder. The Module Placement Setup 4-axis stages on rail Vacuum plate for substrate Vacuum plate for modules

DOE CD-2/3a Review of BTeV Project – December 14-16, 2004 Substrate and Half-Plane Assembly – C. M. Lei 13 Align and Load Modules on Vacuum Plate Module is aligned using 4-axis adjustment of pick and place. A common coordinate system is used to align a full set of modules. Leaf springs provide vertical compliance.

DOE CD-2/3a Review of BTeV Project – December 14-16, 2004 Substrate and Half-Plane Assembly – C. M. Lei 14 Engage Substrate into Substrate Holder then on Stage Cart for module installation moved away and vacuum chuck rotated out of the way. Substrate on substrate vacuum holder All modules loaded – ready for substrate

DOE CD-2/3a Review of BTeV Project – December 14-16, 2004 Substrate and Half-Plane Assembly – C. M. Lei 15 Align Substrate to Modules and Allow Glue to Cure 4-axis adjustment of substrate to modules Leaf springs provide vertical compliance.

DOE CD-2/3a Review of BTeV Project – December 14-16, 2004 Substrate and Half-Plane Assembly – C. M. Lei 16 Flip the Half Populated Substrate and Vacuum Plate Place the substrate with first set of modules underneath on stage. – Repeat Step 2. Second side modules aligned on another modules vacuum plate. – Repeat Step 1 for another side of modules placement

DOE CD-2/3a Review of BTeV Project – December 14-16, 2004 Substrate and Half-Plane Assembly – C. M. Lei 17 Finishing the Half-Plane Assembly Align substrate to modules and allow glue to cure. – Repeat Step 4 for another side of modules placement

DOE CD-2/3a Review of BTeV Project – December 14-16, 2004 Substrate and Half-Plane Assembly – C. M. Lei 18 Status of Half-Plane Assembly  Detailed fabrication drawings completed.  Parts are being made.

DOE CD-2/3a Review of BTeV Project – December 14-16, 2004 Substrate and Half-Plane Assembly – C. M. Lei 19 Summary  The pixel module assembly steps have been thought through. This design will be completed, prototyped and tested with prototype sensor and HDI when they are available.  The design of the half-plane assembly steps have been completed. Parts are being made and will be tested.