High-Performance MEMS-Based Deformable Mirrors for Adaptive Optics Iris AO, Inc.

Slides:



Advertisements
Similar presentations
Magnetic field.
Advertisements

WP4 Organic crystal deposition Mojca Jazbinsek Rainbow Photonics AG SOFI meeting Karlsruhe
Professor Richard S. MullerMichael A. Helmbrecht MEMS for Adaptive Optics Michael A. Helmbrecht Professor R. S. Muller.
Explosive joining of dissimilar metals: experiment and numerical modeling Anan’ev S.Yu., Andreev A.V., Deribas A.A., Yankovskiy B.D. Joint Institute for.
A vertical-flexure CCD module Bruce C. Bigelow University of Michigan Department of Physics 10/7/04.
A No-Power MEMS Shock Sensor Luke Currano U.S. Army Research Laboratory September 12, 2005.
Wafer Level Packaging: A Foundry Perspective
Assignment#01: Literature Survey on Sensors and Actuators ECE5320 Mechatronics Assignment#01: Literature Survey on Sensors and Actuators Electrostatic.
NEW DESIGN FOR RF FINGERS C. Garion 5 June, 2012TE-VSC1 Acknowledgements to A. Lacroix and H. Rambeau for materials and help.
Arizona State University 2D BEAM STEERING USING ELECTROSTATIC AND THERMAL ACTUATION FOR NETWORKED CONTROL Jitendra Makwana 1, Stephen Phillips 1, Lifeng.
Project #3: Design of a MEMS Vertical Actuator Jianwei Heng Alvin Tai ME128 Spring 2005.
John D. Williams, Wanjun Wang Dept. of Mechanical Engineering Louisiana State University 2508 CEBA Baton Rouge, LA Producing Ultra High Aspect Ratio.
Figure 7 Design and Simulation of a MEMS Thermal Actuated Micropump Shiang-Yu Lin, Huaning Zhao, Advisor Prof. Xingguo Xiong Department of Biomedical Engineering,
Deformable Mirrors Lecture 8
Adaptive Optics Deformable Mirror Electronics Simulation Pearl Yamaguchi Subaru Telescope National Astronomical Observatory of Japan Mentor: Stephen Colley.
Dielectric Properties of Ceramic Thin Films Mara Howell Materials Science and Engineering Junior, Purdue University Professor Kvam, Research Advisor.
Breakdown in Solid Dielectrics
18/6/2007 M.Taborelli, TS-MME Structure fabrication techniques and possibilities M.Taborelli Disk structures Quadrant structures ….most of it inspired.
Adaptive Optics for Wavefront Correction of High Average Power Lasers Justin Mansell, Supriyo Sinha, Todd Rutherford, Eric Gustafson, Martin Fejer and.
High-Order Deformable Mirror
Don Gavel: Keck NGAO meeting April 25, LAO Activities Relevant To Keck NGAO Donald Gavel NGAO Team Meeting 6 April 26, 2007.
IMEC - INTEC Department of Information Technology WAVEGUIDES IN BOARDS BASED ON ORMOCER  s
Y. Mizoguchi1 and M. Esashi2 1NEMS Platform Research Division, Leading-Edge Technology Development Headquarters, CANON Inc. TRANDUCERS ’ 05 The 13th International.
MEMS Deformable Mirrors in Astronomical AO Thomas Bifano Director, Boston University Photonics Center (BUPC) Chief Technical Officer, Boston Micromachines.
Boston University Photonics Center: Precision Engineering Research Laboratory, Thomas Bifano Micromachined Deformable Mirrors for Adaptive.
MonolithIC 3D Inc., Patents Pending MonolithIC 3D ICs RCAT approach 1 MonolithIC 3D Inc., Patents Pending.
Os, 9/16/99 MICROMACHINING AND MICROFABRICATION TECHNOLOGY FOR ADAPTIVE OPTICS Olav Solgaard Acknowledgements: P.M. Hagelin, K. Cornett, K. Li, U. Krishnamoorthy,
Center for Adaptive Optics 15 Nov 1999 Meeting Major William D. Cowan, Ph.D. Air Force Research Laboratory Materials and Manufacturing Directorate, AFRL/ML.
Composite mirror suspensions development status Riccardo DeSalvo For the ELiTES R&D group WP1 & 2 JGW-xxxxxx.
Silicon – On - Insulator (SOI). SOI is a very attractive technology for large volume integrated circuit production and is particularly good for low –
NST PRIMARY MIRROR CELL: ANALYSIS AND SOLUTIONS BBSO, 02/11/2004 Leonid Didkovsky.
MERLIN BEAMLINE RIXS refocusing mirror system D. Yegian
Creative Research Initiatives Seoul National University Center for Near-field Atom-Photon Technology - Near Field Scanning Optical Microscopy - Electrostatic.
EE 5323 – Nonlinear Systems, Spring 2012 MEMS Actuation Basics: Electrostatic Actuation Two basic actuator types: Out of Plane(parallel plate) In Plane.
MAXIM Periscope ISAL Study Highlights ISAL Study beginning 14 April 2003.
The NanoGate: A device for nanometer control of the separation between two plates Prof. Alex Slocum Prof. Jeff Lang Hong Ma Alex Sprunt James White Xue’en.
What is MEMS Technology?. What is MEMS ? What is MEMS ? Micro Electro Mechanical Systems – micro scale dimensions (1mm = 1000 microns) – electrical and.
Lawrence Livermore CfAO Video Conference - March 29, 2001 Emily Carr Department of Electrical and Computer Engineering University of California, Davis.
JY/11/15/99 MTC Optically flat arrays of micromirrors June Yu James A. Folta William Cowan (AFRL) to improve the mirror surface quality and optical fill-factor.
DSODARPA Silicon-based Ion Channel Sensor M. Goryll 1, S. Wilk 1, G. M. Laws 1, T. J. Thornton 1, S. M. Goodnick 1, M. Saraniti 2, J. Tang 3, R. S. Eisenberg.
Technology Road Map Imaging And Etching Trace / Space Outers * Current
Page 1 Active MEMS for Wireless and Optical Space Communications Principal Investigators: Frank Merat, Stephen Phillips Task Number: NAG Case Western.
Sensors for Clear Object Detection
Thin ladder development 28/3/2006. Targets Aiming for 0.1 % X 0 Uniformity over full ladder Compatibility with wire and bump bonding Provision for optical.
MEMS for Adaptive Optics
MEMS 2016 Part 2 (Chapters 29 & 30)
Grid Pix Field Simulations and precision needed for a module Peter Kluit, Jan Timmermans Prepared 16 May 2016.
Conclusion An ACF bonding system dedicated for curved substrates has been set up and bonding of polyimide flexcable to curved glass has been successfully.
Process integration 2: double sided processing, design rules, measurements
Jeffrey R. Regester Physics Department High Point University
Aim: How do capacitors behave in a circuit?
Wafer bonding (Chapter 17) & CMP (Chapter 16)
New MPGDs at CERN PCB Workshop
Polyimide sheet (5 mils)) AZ-93 Thermal Paint (5 mils))
Mechanics of Micro Structures
Grid Pix Field Simulations and precision needed for a module
Repairing the MSE Mirrors
ob-fpc: Flexible printed circuits for the alice tracker
THIRTY METER TELESCOPE : SSA
Pressure vs height (solid CPA plane)
Unit-2.
for X-ray Optics and Beam Transport
Micromachined Deformable Mirrors for Adaptive Optics
Active MEMS for Wireless and Optical Space Communications
Etch-Stop Techniques : (1) Doping Selective Etching (DSE)
31/08/ GaAs and 5629 GaAs growth 5622 GaAs,
MICROMACHINING AND MICROFABRICATION TECHNOLOGY FOR ADAPTIVE OPTICS
Memscap - A publicly traded MEMS company
Micro-Electro-Mechanical-Systems
BONDING The construction of any complicated mechanical device requires not only the machining of individual components but also the assembly of components.
Presentation transcript:

High-Performance MEMS-Based Deformable Mirrors for Adaptive Optics Iris AO, Inc.

Founded in 2002 Small high-technology firm specializing in AO Aim to build high-performance, robust MEMS based DMs that address a large application space Funded by SBIR grants, CfAO grants, consulting and driver / DM sales Iris AO Inc

Iris AO Segmented MEMS DM Robust assembled mirror surface stays flat Temperature insensitive bimorphs elevate mirror above substrate Piston/tip/tilt electrostatic actuation

Electrostatic DM Actuators Actuators wired to periphery Electrostatic forces pull actuators down No hysteresis 4.2 mm aperture Engineered stresses create beam shape Stroke determined by design, not process

Assembled SOI Mirrors: Benefits Single crystal mirror has excellent flatness Thickness gives rigidity  Mirror is still flat after optical coating  Stays flat over varying operating conditions Temperature Actuation High fill factor  Mirrors cover bimorph flexures  Etch holes not necessary

Scalable Assembly: 367 Demo

DM Stroke: Position vs. Voltage Nonlinear position Very repeatable

2 nd Generation Assembled Mirrors

Surface Figure vs. Temperature Optical coating on the DMs forms a bimorph that deforms with change in temperature Some coating stacks have shown to reduce stress mismatches  These stacks do NOT help when materials plastically deform  Best coating for MEMS used for MIR is Au Au plastically deforms at >~100MPa

Surface Figure vs. Temperature

Bimorph-Flexure Benefits Stroke (gap) dictated by design, not process Simple design with a lot of latitude for design changes Materials chosen to minimize deflection vs. temperature Position vs. Temperature = ~2nm/°C Film non-uniformity across 6” wafer < ~5%  Non-uniformity across chip < 1%  Differences in height due to temperature swings are minimal

Bimorph-Flexure Temperature Stability

Electrostatic Actuation No hysteresis Nonlinear with Voltage Highly repeatable Temperature independent Often high-voltages involved (200V)  High voltage is a potential reliability problem Electrode erosion Dielectric breakdown Leakage currents Dielectric charging  Iris AO DMs operate over V

Detailed Position vs. Voltage Data

Experimental Deflection 3.5 micron stroke segment, 60 volts

Experimental Deflection - High Stroke 7.5 micron stroke segment, 130 volts

Experimental Deflection - 7 segments