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New MPGDs at CERN PCB Workshop

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Presentation on theme: "New MPGDs at CERN PCB Workshop"— Presentation transcript:

1 New MPGDs at CERN PCB Workshop
Rui De Oliveira Rui De Oliveira

2 outline Introduction to sparks protection
Embedded resistors in Micromegas Embedded resistors with well detectors MSGC development status Future Conclusion Rui De Oliveira

3 Spark protection After looking in bibliography we found that the Voltage V during a spark is in the range of 15 to 30 V It can change a little bit depending on the metals and the available energy Since this value is low compared to the 600V needed we usually consider a spark as a short The protection test on a read out structure becomes simple : apply the mesh voltage directly to the pads V Rui De Oliveira

4 First idea for spark protection
-Cover the pads with resistive material -We have easily found resistive paste and produced samples -After applying directly the voltage to the pads , we have clearly seen a problem of breakdown voltage through the resistive layer , -up to now we never found any resistive material able to do a long term protection with this configuration Rui De Oliveira

5 Second idea -the resistive material is not in contact with the read-out pads, a high breakdown voltage material is inserted in between. -The signal is correctly transmitted by capacitive coupling -in this configuration the protection is optimum. We have not seen up to now any damages -The current flowing in the resistive layer can at one point be a problem in High rate applications Rui De Oliveira

6 Introducing an embedded resistor for High rate applications
Surface resistor 2 layers with one embedded -The thickness above the pad is similar in both structures -Around 50 to 75um to minimize the signal loss Rui De Oliveira

7 Rate limitation due to surface evacuation of charges with single resistive layer protection
-If the layer resistivity is too large the voltage drops will affect the amplification field - Resistivity should be chosen taking in account the current flow : (rate) x (charges ) -This mode of evacuation spreads the signal if low resistivity is used. -A local measurement of the max rate can’t be extrapolated to large sizes. Rui De Oliveira

8 Embedded resistor -One resistive pad will not see any current coming from neighbors -For a given resistive value the maximum rate is increased -A local measurement can be extrapolated to the full size detector -The length of the embedded resistor should be designed taking in account the max mesh voltage to avoid any voltage breakdown Rui De Oliveira

9 outline Introduction to sparks protection
Embedded resistors in Micromegas Embedded resistors with well detectors MSGC development status Future Conclusion Rui De Oliveira

10 Pad PCB for LAPP tests Rui De Oliveira

11 Production steps Bare PCB Coverlay gluing + via fill
Inner resistor printing +top resistive layer print Rui De Oliveira

12 Production steps Bare PCB Coverlay gluing + via fill
Inner resistor printing +top resistive layer print Rui De Oliveira

13 Production steps Bare PCB Coverlay gluing + via fill
Inner resistor printing +top resistive layer print Rui De Oliveira

14 Production steps Bare PCB Coverlay gluing + via fill
Inner resistor printing +top resistive layer print Rui De Oliveira

15 Shapes and values for embedded resistor R1 Detectors for the LAPP
Real values: 40 to 60 KOhms with 10KΩ/Sq 400 to 750 KOhms With 100KΩ/Sq Real values: 400 KOhms with 10KΩ/Sq 4 MOhms With 100KΩ/Sq Real values: 4 MOhms with 10KΩ/Sq 40 MOhms With 100KΩ/Sq Rui De Oliveira

16 1 2 3 1 2 Best region 3 4 Surface resistors Embedded resistors
Surface resistors 1 2 3 4 Best region Embedded resistors Region 3 in buried and 1 in surface (we call it 31) gives the best linearity in response Rui De Oliveira

17 Results with embedded resistors in Micromegas
Results are corresponding to expectations Up to 11 mega events per cm2 with good linearity (rate VS current) have been measured For deeper details please contact Maxime Chefdeville at LAPP. Rui De Oliveira

18 outline Introduction to sparks protection
Embedded resistors in Micromegas Embedded resistors with Well detectors MSGC development status Future conclusion Rui De Oliveira

19 Well detectors Introduced by Ronaldo Bellazini in 1997
Simple and accurate structure Single stage amplification More robust than MSGC But suffering anyway from spark Bottom lines Top electrode Rui De Oliveira

20 Embedded resistors in well structure
Medium rate High rate Rui De Oliveira

21 Process medium rate Bottom resistive DLC deposition on 50um Kapton
Rui De Oliveira

22 Process medium rate Glue to read-out board Rui De Oliveira

23 Process medium rate Top layer patterning + kapton etching
Rui De Oliveira

24 Process high rate Bottom resistive deposition Rui De Oliveira

25 Process high rate Bottom coverlay + via fill + second resistive layer print Rui De Oliveira

26 Process high rate Strip or pad flex gluing + via fill Rui De Oliveira

27 Process high rate Rigidizer gluing if needed Rui De Oliveira

28 Process high rate Top layer patterning + kapton etching
Rui De Oliveira

29 Problems in first high rate production
Layer 1 Layer 2 -due to the multiple gluing steps and the high value targeted (80Mohm/square) the first resistive layer value increased in a non controllable way -after many test we have discover that the 1MOHMS/square paste is polluted by the glue -new samples are planned , we will use DLC resistor for the fist layer. The Second one will be screen printed with 100Kohms paste -For preliminary results please contact Giovanni Bencivenni Rui De Oliveira

30 outline Introduction to sparks protection
Embedded resistors in Micromegas Embedded resistors with well detectors MSGC development status Future Conclusion Rui De Oliveira

31 MSGC No introduction needed We are still investigating this device
because it is still the simplest existing MPGD Rui De Oliveira

32 MSGC production with PCB technologies
We have produced many samples with PCB technologies and materials They work as expected: Good gain Good energy resolution They suffer from spark damages They charge up They show polarizing effects Rui De Oliveira

33 First improvement -We have change the material of the cathode electrode. From metal we went to 100Kohms/square paste -This modification solved the spark problem -But we were still suffering from charging up and polarization Looking in literature we have found a lot of papers dealing with this problem and giving solutions ,one of them was to deposit a thin resistive high value layer over the full structure Rui De Oliveira

34 After resistive deposition
-We have subcontracted resistive Vacuum deposition in 2 institutes . -We have discovered that one of them already did in the past the deposition on Glass MSCG mentioned in literature -We have asked for 4 different resistive value depositions on 20 small pieces from 10^12 to 10^15 ohms/square -After this coating 2 situations appeared : high values do not improve the behavior low values are showing the expected effect but totally degrading the device at the same time -None of the suppliers were ready to guaranty their resistive value -Due to the last statement this direction is abandoned (still ALD deposition could be investigated but completely out of our budget) Rui De Oliveira

35 New direction: remove material between electrodes where charges are attaching
Type 1 etching the substrate Type 2 etching the substrate Adding an electrode Type 3 Removing top electrode Rui De Oliveira

36 New direction: remove material between electrodes where charges are attaching
Type 1 etching the substrate Type 2 etching the substrate Adding an electrode Type 3 Removing top electrode Rui De Oliveira

37 New direction: remove material between electrodes where charges are attaching
Type 1 etching the substrate Type 2 etching the substrate Adding an electrode Type 3 Removing top electrode Rui De Oliveira

38 Micro gap Even more simple than MSGC
We are now producing a few micro-gap structures This time we will study first that the charging up and polarization effects are as expected negligible by construction . We will then introduce the resistive layer for spark protection Rui De Oliveira

39 Micro gap pad prototype layout
1cm x 1cm pad structure 4 pads structure Rui De Oliveira

40 Micro gap production We expect some samples in the coming weeks
STD qualification test will be then performed Gain Energy resolution Rate Stability in time and rate If OK we will produce a resistive version Rui De Oliveira

41 outline Introduction to sparks protection
Embedded resistors in Micromegas Embedded resistors with well detectors MSGC development status Future Conclusion Rui De Oliveira

42 2016 R&D: Embedded FE electronics
Drift volume 3mm Detecting skin 0.2mm Multilayer PCB 0.8mm FE Chip in glob top 0.8mm Full detector Thickness : 4.8mm Single board structure Rui De Oliveira

43 2016 R&D: Embedded FE electronics
Drift volume 3mm Detecting skin 0.2mm Multilayer PCB 0.8mm FE Chip in glob top 0.8mm Full detector Thickness : 4.8mm Single board structure Rui De Oliveira

44 2016 R&D: Embedded FE electronics
Drift volume 3mm Detecting skin 0.2mm Multilayer PCB 0.8mm FE Chip in glob top 0.8mm Full detector Thickness : 4.8mm Single board structure Rui De Oliveira

45 2016 R&D: Embedded FE electronics
Drift volume 3mm Detecting skin 0.2mm Multilayer PCB 0.8mm FE Chip in glob top 0.8mm Full detector Thickness : 4.8mm Single board structure Rui De Oliveira

46 2016 R&D: Embedded FE electronics
Drift volume 3mm Detecting skin 0.2mm Multilayer PCB 0.8mm FE Chip in glob top 0.8mm Full detector Thickness : 4.8mm Single board structure Rui De Oliveira

47 2016 R&D Future sub ns proportional high rate MPGD
Top read-out electrode Thin drift gap 250um First resistive well Second resistive well Thin drift gap 250um Third resistive well Bottom electrode Rui De Oliveira

48 2016 R&D Future sub ns proportional high rate MPGD
Top read-out electrode Thin drift gap 250um First resistive well Second resistive well Thin drift gap 250um Third resistive well Bottom electrode Rui De Oliveira

49 2016 R&D Future sub ns proportional high rate MPGD
Top read-out electrode Thin drift gap 250um First resistive well Second resistive well Thin drift gap 250um Third resistive well Bottom electrode Rui De Oliveira

50 2016 R&D Future sub ns proportional high rate MPGD
Top read-out electrode Thin drift gap 250um First resistive well Second resistive well Thin drift gap 250um Third resistive well Bottom electrode Rui De Oliveira

51 Sub ns detector Time resolution well below 500ps are expected
No high voltage, each cell is independent First test beams are confirming the principle with 2 stacked well structures . Differential read-out possible Resistivity in the range of 10Mohms/square. High rate compatible and spark protected. We are going to build a 4 gap soon. Rui De Oliveira

52 Conclusion We are working on 3 single board detectors principles: Micromegas , Well , Micro gap 2 of them are already showing good results . Micro gap still to be proven Embedding the FE electronic will make an extra thin structure for calorimeter applications Large areas can be easily covered by patching small size modules without dead zones. Rui De Oliveira

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