1. Strasbourg status Ring 7 pilot run François Didierjean

2. 18 modules received from Lyon 30200020000275 30200020000276 30200020000277 30200020000278 30200020000279 30200020000280 30200020000281 30200020000282 30200020000283 30200020000284 30200020000285 30200020000286 30200020000287 30200020000288 30200020000289 30200020000290 30200020000291 30200020000292 Si 1Si 2

3. views of bonding Si – Si PA - Si

4. Gluing of the ceramic stiffeners on the back side for 12 modules

5. New bonding jig vacuum holes on the ceramic stiffeners

6. Procedure : 1.The bias ring bonding and IV curves all OK except 2 bad modules : current up to 10 µamp at 200 V for ##281 module current up to 10 µamp at 100 V for ##291 module OK bad

7. 2. Bonding Si – Si every 50 strips (11 wires) and PA – Si every 50 strips (11 wires) pull test : PA-Si Si-Si 30200020000275 6.0 +/- 1.5 6.3 +/- 0.3 30200020000276 6.2 +/- 0.9 6.0 +/- 0.5 30200020000277 5.6 +/- 0.9 6.0 +/- 0.5 30200020000278 5.5 +/- 0.8 6.3 +/- 0.2 30200020000279 6.6 +/- 1.2 5.9 +/- 0.5 30200020000280 5.4 +/- 0.9 6.0 +/- 0.3 30200020000282 6.8 +/- 1.2 6.9 +/- 0.4 30200020000283 6.0 +/- 0.8 6.4 +/- 0.2 30200020000284 5.3 +/- 0.6 5.9 +/- 0.3 30200020000285 6.0 +/- 1.5 5.4 +/- 0.9 30200020000286 5.6 +/- 0.7 5.7 +/- 0.3 30200020000287 5.9 +/- 0.5 6.1 +/- 0.3 30200020000288 5.6 +/- 0.8 5.8 +/- 0.3 30200020000289 6.0 +/- 0.7 6.0 +/- 0.7 30200020000290 8.0 +/- 1.0 6.3 +/- 0.4 30200020000292 5.7 +/- 1.3 6.5 +/- 0.4 results without angle correction

8. Angle correction : standardizing to 30° measurement angle : 18°  correcting factor : 75% pull strengthhook wire

9. 3. The full module bonding 2 x 512 wires on one go. Repairing :  on 5 modules : one wire Si – Si  on 9 modules : up to 5 wires PA – Si 4. Optical inspection : OK 5. ARC and LED tests IV curves are identical before and after bonding.

10. LED resultsDB data from sensor group