1. Slide 1Module Testing Meeting March 7, 2003US Hybrid/Module/Rod Testing Model-Anthony Affolder US Hybrid/Module/Rod Testing Model Anthony Affolder (for the US module testing group)

2. Slide 2Module Testing Meeting March 7, 2003US Hybrid/Module/Rod Testing Model-Anthony Affolder M800 Testing Model Assumptions Hybrids sent with PA bonded and the PA pulsing /thermal cycle tests performed Until module burn-in available, module production will be limited All modules will be burnt-in using Vienna box due to timing of rod delivery Full testing procedures available at hep.ucsb.edu/cmsUCSB/testproc.doc

3. Slide 3Module Testing Meeting March 7, 2003US Hybrid/Module/Rod Testing Model-Anthony Affolder M800 Testing Model (1) Quick Visual Inspection (on arrival) Hybrid Basic Test à Setup self test, pedestal, noise, calibration pulse measurements –Test requirements not finalized à ~3 minutes per test à If pass, begin characterization test Hybrid Characterization à Gain scan, pipeline scan –New tests (No requirements, study unusual hybrids at first) à ~15 minutes per test à Database entry of basic and characterization test results If there is a failure, à If clear fault, we will repair part à Otherwise send to experts for deeper study Hybrids with PA bonded Hybrid Basic Test Hybrid Characterization Module Assembly Visual Inspection Send to experts for study Pass Failure Obvious Repair Repair Else Visual Inspection

4. Slide 4Module Testing Meeting March 7, 2003US Hybrid/Module/Rod Testing Model-Anthony Affolder M800 Testing Model (2) Module Basic Test à Setup self test, IV, pedestal, noise, calibration injection, backplane pulsing and LED pinhole test –Requirements still in flux à Any problem modules quickly put into repair cycle à ~15 minutes per module à Database entry for test results à Storage until Vienna box available Module Burn-in (Vienna cold box) à 24 hour “Burn-in” designed to determine failure rates/times à Multiple thermal, electrical cycles à Module basic tests + pipeline and gain tests à Database entry for long term and qualification tests Module Pinhole Test à ARC LED pinhole test unless other simpler tests found to be sufficient Bonded Modules Module Basic Test Module Burn-in Module Storage Visual Inspection Deeper study Module Pinhole Test Failure Pass Obvious Repair Repair Else

5. Slide 5Module Testing Meeting March 7, 2003US Hybrid/Module/Rod Testing Model-Anthony Affolder Production after M800 Expected through-put matches anticipated peak production rate plus 33% contingency à 12 modules/day per site à 24 hybrids PA bonded/tested per day at UCSB à Allows us to recover from unexpected shut-downs, schedule slippage, etc. Pitch adaptor wire bonding/testing will be done at UCSB Assumes every module is burnt-in using Vienna box à Hopefully we will be able to shift to sampling only at some point à To be determined using M800 production Rod assembly/burn-in testing model not completely fixed à During rod assembly, modules will be tested upon insertion à After gaining confidence, we will move to testing once full side is inserted à Should be able to match 1.5 rods/day peak assembly rate production schedule